fish fry
Subscribe Now

The Challenge of Systemic Complexity

Simulation Models for Embedded Software and Smart Monitor IP Blocks

We’re tackling the multi-faceted challenges of embedded software development in this week’s episode of Amelia’s Weekly Fish Fry. Simon Davidmann (CEO – Imperas) joins us to discuss how familiar debug environments can make all the difference in complex designs and why RISC-V architecture is gaining traction in the EE ecosystem. Next up, Rupert Baines (CEO – UltraSoC) joins us to chat about the details of their “Smart Monitor” IP blocks and how they can oversee all the “moving” parts of your design (and keep them all playing nicely together). Also this week, we check out a new wearable skin sensor developed at Stanford University that can detect stress levels through sweat.

Download this episode (right click and save)

Links for July 27, 2018

More information about Imperas

More information about UltraSoC

Article: Molecularly selective nanoporous membrane-based wearable organic electrochemical device for noninvasive cortisol sensing

New Episode of Chalk Talk: MLCC Alternatives

 

Click here to check out the Fish Fry Archive.

Click here to subscribe to Fish Fry via Podbean

Click here to get the Fish Fry RSS Feed

Click here to subscribe to Fish Fry via iTunes.

Fish Fry Executive Interviews

Darrin Billerbeck, CEO – Lattice Semiconductor

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon>

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

featured blogs
Dec 19, 2024
Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....
Jan 10, 2025
Most of us think we know something about quantum computing, right until someone else asks us to explain it to them'¦...

featured chalk talk

Power Modules and Why You Should Use Them in Your Next Power Design
In this episode of Chalk Talk, Amelia Dalton and Christine Chacko from Texas Instruments explore a variety of power module package technologies, examine the many ways that power modules can help save on total design solution cost, and the unique benefits that Texas Instruments power modules can bring to your next design.
Aug 22, 2024
43,036 views