fish fry
Subscribe Now

IoT with a Side of Pi

myDevices and the World’s First Drag-and-Drop IoT Project Builder

In a special Maker Edition of Fish Fry, we’re serving up a little internet of things with a side of Raspberry Pi. My guest Kevin Bromber (CEO – myDevices) and I check out Cayenne – the world’s first drag-and-drop IoT project builder. We’ll look at what sets it apart from the rest of the IoT pack and how you can get your next Raspberry Pi-fueled IoT design up and running in mere minutes. Also this week, we take a closer look at a Kickstarter campaign that aims to take your drone dreams to a whole new level.

 

 

Download this episode (right click and save)

Links for February 12, 2016

myDevices Launches Cayenne, the World’s First Drag-and-Drop IoT Project Builder

More information about myDevices

Kickstarter Corner: Learn to Code, Play with Drone: CoDrone

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

Darrin Billerbeck, CEO – Lattice Semiconductor

Bill Neifert, CTO – Carbon Design Systems

Sean Dart, CEO – Forte Design Systems

Andy Pease, CEO – QuickLogic

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Cees Links – GreenPeak Technologies

Jessica Gomez – Rogue Valley Microdevices

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Autonomous Robotics Connectivity Solutions
Sponsored by Mouser Electronics and Samtec
Connectivity solutions for autonomous robotic applications need to include a variety of orientations, stack heights, and contact systems. In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec explore trends in autonomous robotic connectivity solutions and the benefits that Samtec interconnect solutions bring to these applications.
Jan 22, 2024
13,402 views