Optical communication takes center stage in this week’s episode of Amelia’s Weekly Fish Fry. First up, Mark Benton (TE Connectivity) and I chat about the different levels where optics can exist in the world of electronic packaging and the how the most recent advancements in ruggedized fiber optic technology have ushered in a whole new era of box to box and PC to PC communication. Also this week, Patrick Mechin (Techway) joins us to discuss the biggest trends in rugged optical communication today and why signal integrity in these environments is more important than ever before.

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Links for May 10, 2019

More information about TE Connectivity

More information about TE Connectivity’s Rugged Fiber Optic Products

More information about Techway SAS

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Fish Fry Executive Interviews

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Jessica Gomez – Rogue Valley Microdevices

Shishpal Rawat, Chairman – Accellera Systems Initiative

Kevin Bromber, CEO – myDevices

Daniel Hansson, CEO – Verifyter

Mark Papermaster, CTO – AMD

David Fried, CTO – Coventor

Dr. Steven LeBoeuf, President – Valencell

David Dutton, CEO – Silvaco

Bob Niemiec, CEO – TwistThink

Allan Martinson, COO – Starship Technologies

Zhihong Liu, Chairman and CEO – ProPlus Solutions

Taher Madraswala, CEO and President – Open-Silicon

Kapil Shankar, CEO and Director – AnDAPT

Dan Fox, CTO – Local Motors

David Su, CEO – Atomic Technologies