EEJournal

fish fry
Subscribe Now
February 12, 2016

IoT with a Side of Pi

myDevices and the World’s First Drag-and-Drop IoT Project Builder
by Amelia Dalton

In a special Maker Edition of Fish Fry, we’re serving up a little internet of things with a side of Raspberry Pi. My guest Kevin Bromber (CEO – myDevices) and I check out Cayenne – the world’s first drag-and-drop IoT project builder. We’ll look at what sets it apart from the rest of the IoT pack and how you can get your next Raspberry Pi-fueled IoT design up and running in mere minutes. Also this week, we take a closer look at a Kickstarter campaign that aims to take your drone dreams to a whole new level.

 

 

Download this episode (right click and save)

Links for February 12, 2016

myDevices Launches Cayenne, the World’s First Drag-and-Drop IoT Project Builder

More information about myDevices

Kickstarter Corner: Learn to Code, Play with Drone: CoDrone

Fish Fry Executive Interviews

Moshe Gavrielov, CEO – Xilinx

Darrin Billerbeck, CEO – Lattice Semiconductor

Bill Neifert, CTO – Carbon Design Systems

Sean Dart, CEO – Forte Design Systems

Andy Pease, CEO – QuickLogic

Paul Kocher, President – Cryptography Research Inc.

Anupam Bakshi, CEO – Agnisys

Dave Kleidermacher, CTO – Green Hills Software

Robert Blake, CEO – Achronix

Jack Harding, CEO – eSilicon

Michiel Ligthart, COO – Verific

Adnan Hamid, CEO – Breker Technologies

Jeff Waters, VP and General Manager – Altera

Simon Davidmann, CEO – Imperas

Ted Miracco, CEO – SmartFlow Compliance Solutions

Cees Links – GreenPeak Technologies

Jessica Gomez – Rogue Valley Microdevices

Leave a Reply

featured blogs
BoardSurfers: Training Insights: Design Effortlessly Using Structures in Allegro X
Apr 25, 2024
Structures in Allegro X layout editors let you create reusable building blocks for your PCBs, saving you time and ensuring consistency. What are Structures? Structures are pre-defined groups of design objects, such as vias, connecting lines (clines), and shapes. You can combi...
More from Cadence...
Want to Mix and Match Dies in a Single Package? UCIe Can Get You There
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....
More from Synopsys...
One Robotic Step Closer to Humanoid Robots in the Home
Apr 18, 2024
Are you ready for a revolution in robotic technology (as opposed to a robotic revolution, of course)?...
More from Max's Cool Beans...

featured video

How MediaTek Optimizes SI Design with Cadence Optimality Explorer and Clarity 3D Solver

Sponsored by Cadence Design Systems

In the era of 5G/6G communication, signal integrity (SI) design considerations are important in high-speed interface design. MediaTek’s design process usually relies on human intuition, but with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver, they’ve increased design productivity by 75X. The Optimality Explorer’s AI technology not only improves productivity, but also provides helpful insights and answers.

Learn how MediaTek uses Cadence tools in SI design

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

Electrical Connectors for Hermetically Sealed Applications
Sponsored by Mouser Electronics and Bel
Many hermetic chambers today require electrical pathways to provide internal equipment with power, data or signals, or to receive data and signals from equipment within the chamber. In this episode of Chalk Talk, Amelia Dalton and Brad Taras from Cinch Connectivity Solutions explore the role that seals and connectors play in the performance of hermetic chambers. They examine the methodologies to determine hermetic seal leaks, the benefits of epoxy hermetic seals, and how Cinch Connectivity’s epoxy-based seals and hermetic connectors can add value to your next design.
Click here for more information Cinch Hermetic & High-Temperature DURA-CON™ Connectors
Aug 22, 2023
29,292 views