Learn about the world's first CXL 3.1 standard multi-vendor interoperability demo, which we showcased with Teledyne LeCroy at the SC24 conference in Atlanta.

We explore how AI chip startups Rain AI, Mentium, and TetraMem leverage cloud-based EDA tools to develop AI accelerator chips and co-processors better, faster.

We joined the Ethernet Alliance to showcase the 800G ethernet standard at ECOC 2024, demonstrating a live network with switches, routers, and interconnects.

Learn about post-quantum cryptography algorithms, NIST post-quantum cryptography standards, and the security promise of quantum-resistant algorithms.

We explain what non-volatile memory is and why RRAM and MRAM (Resistive and Magneto-Resistive Random Access Memory) are taking over for embedded flash memory.

We explain what Hardware-Assisted Verification (HAV) is and explore its impact on hardware architecture, software-defined solutions, and the chip design flow.

From RF design migration to interface IP and multi-die chip design tools, we received multiple TSMC Partner of the Year awards at the 2024 OIP Ecosystem Forum.

Learn how to accelerate AI chip design simulation with cloud-based chip emulation tools for secure, pre-silicon chip validation in a flexible cloud environment.

We explain how Static Random-Access Memory Physical Unclonable Function (SRAM PUF) enhances chip security with silicon fingerprints and cryptographic keys.

Learn about our company-wide Pitch Fest, a contest that fosters semiconductor innovation across chip verification, global energy consumption, and beyond.

We unpack why AI chip startups turn to EDA tools in the cloud, from easily scalable chip design verification to baked-in semiconductor foundry compliance.

Our new 40G Universal Chip Interconnect Express (UCIe) IP, delivers 25% more bandwidth for die to die connectivity in multi-die Data Center AI Chips.

The shift left methodology can help lower power throughout the electronic design cycle. In this episode of Chalk Talk, William Ruby from Synopsys and Amelia Dalton explore the biggest energy efficiency design challenges facing engineers today, how Synopsys can help solve a variety of energy efficiency design challenges and how the shift left methodology can enable consistent power efficiency and power reduction.

In this episode of Chalk Talk, Amelia Dalton and Vikram Bhatia from Synopsys explore how you can accelerate your next tapeout with Synopsys Cloud and AI. They also discuss new enhancements and customer use cases that leverage AI with hybrid cloud deployment scenarios, and how this platform can help CAD managers and engineers reduce licensing overheads and seamlessly run complex EDA design flows through Synopsys Cloud.

In this episode of Chalk Talk, Amelia Dalton and Guy Cortez from Synopsys investigate how Synopsys’ Silicon.da platform can increase engineering productivity and silicon efficiency while providing the tool scalability needed for today’s semiconductor designs. They also walk through the steps involved in a SLM workflow and examine how this open and extensible platform can help you avoid pitfalls in each step of your next IC design.

The adoption of the cloud in the design automation industry has encouraged innovation across the entire semiconductor lifecycle. In this episode of Chalk Talk, Amelia Dalton chats with Vikram Bhatia from Synopsys about how Synopsys is redefining EDA in the Cloud with the industry’s first complete browser-based EDA-as-a-Service cloud platform. They explore the benefits that this on-demand pay-per use, web-based portal can bring to your next design. 

Benchmarking is a great way to measure the performance of computing resources, but benchmark tuning can be a very complicated problem to solve. In this episode of Chalk Talk, Nozar Nozarian from Synopsys and Amelia Dalton investigate Synopsys’ Optimizer Studio that combines an evolution search algorithm with a powerful user interface that can help you quickly setup and run benchmarking experiments with much less effort and time than ever before.

In order to keep up with the rigorous pace of today’s electronic designs, we must have visibility into each step of our IC design lifecycle including debug, bring up and in-field operation. In this episode of Chalk Talk, Amelia Dalton chats with Steve Pateras from Synopsys about in-field infrastructure for silicon lifecycle management, the role that edge analytics play when it comes to in-field optimization, and how cloud analytics, runtime agents and SiliconMAX sensor analytics can provide you more information than ever before for the lifecycle of your IC design.

IC design has come a very long way in a short amount of time. Today, our SoC designs frequently include integrated analog, 100+ Gigabit data rates and 3D stacked DRAM integrated into our SoCs on interposers. In order to keep our heads above water in all of this IC complexity, we need a unified circuit simulation workflow and a fast signoff SPICE and FastSPICE architecture. In this episode of Chalk Talk, Amelia Dalton chats with Hany Elhak from Synopsys about how the unified workflow of the PrimeSim Continuum from Synopsys can help you address systematic and scale complexity for your next IC design.

Once a design goes to tape-out, the real challenges begin. Teams find themselves drowning in data from design-process-test during production ramp-up, and have to cope with data from numerous sources in different formats in the manufacturing test supply chain. In this episode of Chalk Talk, Amelia Dalton chats with Mark Laird of Synopsys in part three of our series on the Silicon LifeCycle Management (SLM) platform, discussing how Yield Explorer and SiliconDash give valuable insight to engineering and manufacturing teams.

Award-winning Synopsys.ai, the industry’s first full stack, AI-driven electronic design automation suite, offers AI-driven workflow optimization & data analytics solutions along with breakthrough generative AI capabilities for next-level chip design.

This whitepaper explains the basics of UVM functional coverage for RISC-V cores using the Google RISCV-DV open-source project, Synopsys verification solutions, and a RISC-V processor core from Bluespec.

Adding safety measures to SoC designs in the form of radiation-hardened elements or redundancy is essential in making mission-critical applications in the A&D, cloud, automotive, robotics, medical, and IoT industries more resilient against random hardware failures that occur. This paper discusses the automated process of implementing the safety mechanisms/measures (SM) in the design to make them more resilient and analyze their effectiveness from design inception to the final product.

Learn how designers can take advantage of new ways to efficiently pinpoint voltage bottlenecks, drive voltage margin uniformity, and uncover opportunities to fine-tune operating voltages using PrimeShield design robustness solution.

Aerospace, Government, and Defense industry experts discuss the complexities of 3DHI for technological, manufacturing, & economic intricacies, as well as security, reliability, and safety challenges & solutions. Explore DARPA’s NGMM plan for the 3DHI R&D ecosystem.

Synopsys ARC-V™ Processor IP delivers the optimal power-performance-efficiency and extensibility of ARC processors with broad software and tools support from Synopsys and the expanding RISC-V ecosystem. Built on the success of multiple generations of ARC processor IP covering a broad range of processor implementations, including functional safety (FS) versions, the ARC-V portfolio delivers what you need to optimize and differentiate your SoC.

Join Gary Ruggles, Synopsys Product Manager for PCIe & CXL, at PCI-SIG DevCon 2023 and see Synopsys PCIe 6.0 Controller & PHY IP in an end-to-end host to device system, using Teledyne LeCroy's interposer & analyzer showing impact of payload size on throughput.

See successful PCIe 6.0 interoperability demos in our booth & our partners’ booths at PCI-SIG DevCon 2023. Don’t miss our demo at 128 GT/s as we take a peek into the PCIe 7.0 tech and make sure to watch the world’s first PCIe 6.0 RX link training compliance tests.

At TSMC Symposium 2023 we showcased a successful 224G Ethernet PHY IP interop demonstration with backplane channels. Watch the various plots, ADC histogram and excellent eye diagrams results.

Watch this video of Synopsys 224G Ethernet PHY IP demonstrating wide-open TX PAM-4 eyes using Keysight’s oscilloscope & Samtec’s cables and connectors.

As glitch power becomes a growing component of total power, managing it requires a holistic solution for analysis and optimization from architecture to signoff. Watch this video and learn how to minimize glitch power in your designs.

This video shows how IC Compiler II and Fusion Compiler enable intelligent planning and implementation of complex interconnects through innovative Topological Interconnect Planning technology - accelerating schedules and achieving highest QoR.