PrimeSim

TSMC

" The Synopsys PrimeSim^™ HSPICE^®, PrimeSim SPICE, PrimeSim Pro and PrimeSim XA simulators, as part of the PrimeSim Continuum solution, deliver improved turnaround time for TSMC 3nm designs and provide signoff coverage for circuit simulation and reliability requirements. " Read more

Kioxia

- Shigeo Ohshima
Technology Executive, SSD Application Engineering, Kioxia 

" PrimeSim Continuum is an all-in-one solution that integrates the best SPICE and FastSPICE technologies delivering accuracy, speed and capacity for our complex designs. The PrimeWave design environment provides a common workflow across all simulation disciplines enabling the signoff of Kioxia’s memory designs. " Read more

Samsung Memory

- Jung Yun Choi
Corporate Vice President, Memory Design Technology, Samsung Electronics 

" PrimeSim Pro, the next generation of our plan of record FastSPICE simulator, can deliver up to 5X performance acceleration on our full-chip power delivery network designs." Read more

NVIDIA

- Edward Lee
Vice President of Mixed Signal Design, Nvidia

" Using NVIDIA GPUs enables PrimeSim SPICE to accelerate circuit simulation, notably minimizing signoff time of analog blocks from days to hours " Read more

Samsung Electronics

- Jaehong Park
Executive Vice President Engineering, Samsung Electronics 

" PrimeSim Continuum with its unified workflow of advanced simulation engines delivered 10X speed up with golden SPICE accuracy using heterogeneous compute acceleration on our recent 56Gbit Ethernet design, reducing verification efforts from days to hours. "  Read more