11th March 2010, Cambridge, UK —The Future of Wireless International Conference, a two day high-profile event to be held in Cambridge on 29th & 30th June 2010, brings together from around the world more than 300 key players, including business leaders, entrepreneurs, technologists, investors and academics, to explore the key market, business and technology opportunities for wireless – and it’s potential impact on society – over the next five years. The breadth of topics to be covered is impressive, including such matters as re-inventing business models and the value chain, bridging the digital divide, wireless delivery of healthcare, low-carbon smart homes, future wireless devices and the impact of cloud computing on life in the 21st Century. As well as informative presentations, there will also be lively, thought-provoking panel discussions and plenty of opportunities for attendees to engage and participate. The Cambridge Wireless free online partnering service enables delegates to maximise business development and partnering opportunities by facilitating pre-arrangement of meetings with other delegates.

“The Future of Wireless conference brings together an industry that has already revolutionised the world through the availability of mass market voice and data communications. At this conference, we are examining the next wave of products and services that can be enabled and enhanced by wireless,” said Peter Whale, Board Member of Cambridge Wireless and Director of Product Management for Qualcomm. “The opportunities are extensive to connect people with each other in new ways, and to connect people with a vast range of personalised and relevant on-line and physical services.”

Keynote speakers include high profile leading industry experts such as Robert Crow, VP of RIM, Houston Spencer, VP Business Strategy of Alcatel Lucent, James Collier, CTO of CSR; Martin Jackson, VP of Plastic Logic, Tudor Brown, President of ARM and many more!

“The Future of Wireless International Conference 2010 is an essential meeting point for the global wireless industry, packed with vital knowledge and powerful opinions from industry leaders.” said Chris Walklett, Business Tax Partner and Head of PEM Technology, the technology team at Peters Elworthy & Moore (PEM). “”PEM are delighted to be a sponsor of such a forward thinking event”.

For information, visit the conference web site at http://www.cambridgewireless.co.uk/futureofwireless 

CHICAGO – March 11, 2010 – The International Engineering Consortium today announced the winners of the 2010 DesignCon Paper Awards in recognition for their outstanding contributions to the educational goals of DesignCon 2010.

“We extend our congratulations to the Design Paper Award winners for their hard work and dedication in serving the semiconductor industry,” commented IEC president, John Janowiak. “We are fortunate to have witnessed this caliber of expertise throughout the DesignCon educational program.”

Winners were chosen from the DesignCon 2010 technical program Paper Award finalists papers. The Technical Program Committee selected the Award papers based on written merit and quality of presentation.

The 2010 DesignCon Paper Award winners include the following individuals in their respective categories:

Chip-Level Design

Andres Takach – Creating C++ IP for High Performance Hardware Implementations of FFTs

Luke Teyssier – Strong Encryption and Correct Design Are Not Enough: Protecting Your Secure System from Side Channel Attacks

Board and System Design

Allen F. Horn III, John W. Reynolds, Patricia A. LaFrance, and James C. Rautio – Effect of Conductor Profile on the Insertion Loss, Phase Constant, and Dispersion in Thin High Frequency Transmission Lines

Kevin Hinckley, Douglas Winterberg, Mike Ballou, Gustavo Blando, Jason R. Miller, Roger Dame, Alexander Nosovitski, Gregory Truhlar, Shelley Begley and Istvan Novak – Introduction and Comparison of an Alternate Methodology for Measuring Loss Tangent of PCB Laminates

Interconnect Design

Eric Bogatin, Don DeGroot, Colin Warwick and Sanjeev Gupta – Frequency Dependent Material Properties: So What?

Jason R. Miller, Gustavo J. Blando and Istvan Novak – Additional Trace Losses due to Glass-Weave Periodic Loading

High-Speed Design and Test Category

Ransom Stephens and John Calvin – A New Method for Receiver Tolerance Testing Using Crest Factor Emulation

Istvan Novak, Yasuhiro Mori, and Mike Resso – Accuracy Improvements of PDN Impedance Measurements in the Low to Middle Frequency Range

Power and RF Design Category

Shishuang Sun, Larry D Smith and Peter Boyle – On-Chip PDN Noise Characterization and Modeling

Xiaoxiong Gu, Renato Rimolo-Donadio, Zhenwei Yu, Francesco de Paulis, Young H. Kwark, Matteo Cocchini, Mark B. Ritter, Bruce Archambeault, Albert Ruehli, Jun Fan and Christian Schuster – Fast Physics-Based Via and Trace Models for Signal and Power Integrity Co-Analysis

Award winning papers and finalists papers will be featured throughout the year in the DesignCon newsletter and InfoVault, and on-line resourse for the DesignCon community. For more information, visit www.designcon.com, or contact Kim Simpao at ksimpao@iec.org or +1-773-315-7779.

About the IEC

A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high-technology industries and their university communities. Since 1944, the IEC has provided high-quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry-leading companies, the IEC has developed an extensive, free, on-line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.

More than 70 leading high-technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org.