industry news
Subscribe Now

3MHz Chopper Op Amps from STMicroelectronics Feature Rail-to-Rail Input and Output in Tiny Footprint

Geneva, February 2, 2017 – The TSZ182 dual precision op amp from STMicroelectronics combines low and extremely temperature-stable input-offset voltage with the added advantages of a 3MHz gain-bandwidth, rail-to-rail inputs and outputs, and ultra-small 2mm x 2mm DFN8 or Mini-SO8 package options.

Complementing ST’s popular conventional op amps, the chopper-stabilized TSZ182 enables superior precision in instruments like body-signal monitors, blood-glucose meters, industrial sensors, factory automation, and low-side current sensing.

The offset voltage of 25µV at 25°C enables high measurement resolution and accuracy without external trimming components, saving board space and the need for adjustments during production. Moreover, offset drift less than 100nV/°C maintains accuracy over a wide temperature range and saves periodic auto-recalibration thereby simplifying design and enhancing convenience for end users.

Operating from a 2.2V-5.5V supply and providing rail-to-rail inputs and outputs – a competitive advantage over some other precision op amps – the TSZ182 maximizes utilization of available dynamic range. The gain-bandwidth of 3MHz ensures consistent frequency response over a wide range, and the maximum operating current of just 1mA at 5V helps maximize runtime of battery-powered devices.

The extended operating-temperature range of -40°C to 125°C enables use in harsh outdoor or industrial environments. Automotive-qualified variants (TSZ1821IYST) will also be available next month for precision sensor-signal conditioning in equipment ranging from simple wiper modules or climate controls to autonomous-driving systems.

The TSZ182 is in production now in the Mini-SO8 or DFN8 2mm x 2mm package, priced from $0.97 for orders of 1000 units.

For further information please visit www.st.com/tsz182-pr

Leave a Reply

featured blogs
Apr 26, 2024
LEGO ® is the world's most famous toy brand. The experience of playing with these toys has endured over the years because of the innumerable possibilities they allow us: from simple textbook models to wherever our imagination might take us. We have always been driven by ...
Apr 26, 2024
Biological-inspired developments result in LEDs that are 55% brighter, but 55% brighter than what?...
Apr 25, 2024
See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....

featured video

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Sponsored by Cadence Design Systems

MaxLinear has the unique capability of integrating analog and digital design on the same chip. Because of this, the team developed some interesting technology in the communication space. In the optical infrastructure domain, they created the first fully integrated 5nm CMOS PAM4 DSP. All their products solve critical communication and high-frequency analysis challenges.

Learn more about how MaxLinear is using Cadence’s Clarity 3D Solver and EMX Planar 3D Solver in their design process.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

FlyOver® Technology: Twinax FlyOver® System for Next Gen Speeds -- Samtec and Mouser
Sponsored by Mouser Electronics and Samtec
In this episode of Chalk Talk, Amelia Dalton and Matthew Burns from Samtec investigate the challenges of routing high speed data over lossy PCBs. They also discuss the benefits that Samtec’s Flyover® cable assembly systems bring to data center and embedded designs and how Samtec is furthering innovation with their high speed interconnect solutions. 
Apr 15, 2024
1,685 views