industry news
Subscribe Now

Molex microSD/micro-SIM Combo Connector Offers Lower Profile, More Compact Size

LISLE, IL – September 17, 2014 – Molex Incorporated today introduces the microSD/micro-SIM combo connector, which provides mobile device manufacturers with a highly versatile connector with a lower profile and more compact size than competitive products.  The push-pull, normal-mount combo connector, which features a 2.28 mm height with detect switch, saves space by combining two card functions in one.  This eliminates the need for an extra sub-PCB.  The connector accepts cards that are stacked in the same direction, which provides easier access and a more optimum PCB layout.  The result is a combo connector with the lowest height and most compact size in the market.

“Finding the best combination of space savings and easy access when designing-in microSD and micro-SIM cards has been a problem for mobile device designers,” said DongWook Kim, global product manager, Molex.  “Up until now, they had to either take up space for each card socket, or use a flex-to-board PCB to accommodate both form factors.  The Molex microSD/micro-SIM combo connector solves this problem by providing substantial space savings while also providing easy card access.  In addition, this new design reduces manufacturing, assembly and component costs.”

Features of the microSD/micro-SIM combo connector include:

  • Free insertion and withdrawal of the microSD card, which eliminates the need to turn off power or remove the battery.
  • Anti-stubbing contact terminal design, which prevents contact stubbing and ensures smooth insertion and withdrawal of cards.
  • Card polarization features, which prevent incorrect card insertion
  • Anti-card sticking design, which prevents microSD card from being stuck in case of incorrect insertion into the micro-SIM slot.

With the introduction of the Molex microSD/micro-SIM, mobile device designers have a combo connector that offers an overall volume space savings of up to 15% compared to competitive products.

Molex manufacturing facilities are ISO9000 and ISO14000 certified.  For more information about the microSD/micro-SIM combo connectorplease visit Molex at: www.molex.com/link/microsdcombo.html.  To receive information on Molex products, please sign up for our e-nouncement newsletter at www.molex.com/link/register/.

About Molex Incorporated

Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including: data communications, telecommunications, consumer electronics, industrial, automotive, commercial vehicle, aerospace and defense, medical and lighting.  Established in 1938, the company operates 45 manufacturing locations in 17 countries.  The Molex website is www.molex.com.  Follow us at www.twitter.com/molexconnectors, watch our videos at www.youtube.com/molexconnectors, connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com.

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Why Wiwynn Energy-Optimized Data Center IT Solutions Use Cadence Optimality Explorer

Sponsored by Cadence Design Systems

In the AI era, as the signal-data rate increases, the signal integrity challenges in server designs also increase. Wiwynn provides hyperscale data centers with innovative cloud IT infrastructure, bringing the best total cost of ownership (TCO), energy, and energy-itemized IT solutions from the cloud to the edge.

Learn more about how Wiwynn is developing a new methodology for PCB designs with Cadence’s Optimality Intelligent System Explorer and Clarity 3D Solver.

featured paper

Designing Robust 5G Power Amplifiers for the Real World

Sponsored by Keysight

Simulating 5G power amplifier (PA) designs at the component and system levels with authentic modulation and high-fidelity behavioral models increases predictability, lowers risk, and shrinks schedules. Simulation software enables multi-technology layout and multi-domain analysis, evaluating the impacts of 5G PA design choices while delivering accurate results in a single virtual workspace. This application note delves into how authentic modulation enhances predictability and performance in 5G millimeter-wave systems.

Download now to revolutionize your design process.

featured chalk talk

TE Connectivity MULTIGIG RT Connectors
In this episode of Chalk Talk, Amelia Dalton and Ryan Hill from TE Connectivity explore the benefits of TE’s Multigig RT Connectors and how these connectors can help empower the next generation of military and aerospace designs. They examine the components included in these solutions and how the modular design of these connectors make them a great fit for your next military and aerospace design.
Mar 19, 2024
6,683 views