fresh bytes
Subscribe Now

Robotic welding arm used to 3D print a stainless steel bike

stainless-steel-3d-printed-arc-bicycle-1.jpg

Although they’re still far from being common, 3D-printed metal bicycle frames do now exist. Usually they’re made using a sintering process, in which a laser is utilized to selectively melt steel powder, building it up in successive layers. Now, however, a team of students at the Delft University of Technology (TU Delft) in the Netherlands has taken another approach – they’ve created the world’s first stainless steel bike made via a welding-based 3D-printing technique.

The students worked with Amsterdam-based company MX3D, which helped bring us the Mataerial 3D printer in 2013. Unlike traditional 3D printers, which build up objects horizontally on a flat stage, the Mataerial uses a robotic arm to extrude resin onto horizontal or vertical surfaces. Those columns of resin can be curved and linked together as they’re being extruded, quickly hardening into modern art-like creations.
via Gizmag

Continue reading 

Image: TU Delft

Leave a Reply

featured blogs
May 2, 2024
I'm envisioning what one of these pieces would look like on the wall of my office. It would look awesome!...
Apr 30, 2024
Analog IC design engineers need breakthrough technologies & chip design tools to solve modern challenges; learn more from our analog design panel at SNUG 2024.The post Why Analog Design Challenges Need Breakthrough Technologies appeared first on Chip Design....

featured video

Introducing Altera® Agilex 5 FPGAs and SoCs

Sponsored by Intel

Learn about the Altera Agilex 5 FPGA Family for tomorrow’s edge intelligent applications.

To learn more about Agilex 5 visit: Agilex™ 5 FPGA and SoC FPGA Product Overview

featured paper

Achieve Greater Design Flexibility and Reduce Costs with Chiplets

Sponsored by Keysight

Chiplets are a new way to build a system-on-chips (SoCs) to improve yields and reduce costs. It partitions the chip into discrete elements and connects them with a standardized interface, enabling designers to meet performance, efficiency, power, size, and cost challenges in the 5 / 6G, artificial intelligence (AI), and virtual reality (VR) era. This white paper will discuss the shift to chiplet adoption and Keysight EDA's implementation of the communication standard (UCIe) into the Keysight Advanced Design System (ADS).

Dive into the technical details – download now.

featured chalk talk

Improving Chip to Chip Communication with I3C
Sponsored by Mouser Electronics and Microchip
In this episode of Chalk Talk, Amelia Dalton and Toby Sinkinson from Microchip explore the benefits of I3C. They also examine how I3C helps simplify sensor networks, provides standardization for commonly performed functions, and how you can get started using Microchips I3C modules in your next design.
Feb 19, 2024
10,963 views