A Chirp By Any Other Name Just Wouldn’t Be The Same

Chirp Microsystems and Their Ultrasonic Sensing Solution

by Amelia Dalton

We’ve all heard of six degrees of separation, right? But what about six degrees of freedom? In this week’s Fish Fry, David Horsley of Chirp Microsystems joins us to discuss the details of Chirp Micro’s innovative ultrasonic sensing solutions. David and I chat about what this six degrees of freedom business is all about, how their ultrasonic software library and gesture classification libraries work together, why MEMS-based ultrasound can go toe-to-toe with today’s optical systems, and why you should consider ultrasonic sensing in your next consumer electronic design.

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Links for January 6, 2017

More information about Chirp Microsystems

MaxLinear Integrates Analog & Digital Design in One Chip with Cadence 3D Solvers

Altera® FPGAs and SoCs with FPGA AI Suite and OpenVINO™ Toolkit Drive Embedded/Edge AI/Machine Learning Applications

Sponsored by Intel

Describes the emerging use cases of FPGA-based AI inference in edge and custom AI applications, and software and hardware solutions for edge FPGA AI.

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Maximizing High Power Density and Efficiency in EV-Charging Applications

Sponsored by Mouser Electronics and Infineon

In this episode of Chalk Talk, Amelia Dalton and Daniel Dalpiaz from Infineon talk about trends in the greater electrical vehicle charging landscape, typical block diagram components, and tradeoffs between discrete devices versus power modules. They also discuss choices between IGBT’s and Silicon Carbide, the advantages of advanced packaging techniques in both power discrete and power module solutions, and how reliability is increasingly important due to demands for more charging cycles per day.

Click here for more information about Infineon Technologies 1200V CoolSiC™ M1H Modules

Dec 18, 2023

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A Chirp By Any Other Name Just Wouldn’t Be The Same

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