With smaller electronics, more options can be fit into the package, allowing for features such as RF transceivers for wireless communication, advanced sensors to optimally time pacing and defibrillation shocks and backup systems in case the main system fails. While integrated circuits (ICs) have taken advantage of advances in dense packaging, such as die stacking, in most cases the discrete components remain unchanged. Market pressures are now forcing improvements in the current discrete packaging.
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See how the UCIe protocol creates multi-die chips by connecting chiplets from different vendors and nodes, and learn about the role of IP and specifications.The post Want to Mix and Match Dies in a Single Package? UCIe Can Get You There appeared first on Chip Design....