industry news
Subscribe Now

TDK expands inline structure and low-resistance type MEGACAP MLCCs with metal frames for automotive

  • The automotive-grade inline structure MEGACAP MLCCs are qualified based on the automotive standard AEC-Q200
  • Low resistance achieved by optimizing metal frame materials
  • Lineup includes 99 nF/1000 V with Class 1 and 47 μF/100 V with Class 2 dielectric

 

September 10, 2024

 

TDK Corporation (TSE:6762) has extended the automotive-grade CA series of its MEGACAP MLCCs with a metal frame. Mass production of the product series began in September 2024.

 

In recent years, the development of automobiles with electric powertrains, such as hybrid- (HEVs) and battery-electric vehicles (BEVs), and highly efficient charging technologies, has significantly progressed. Both help to reduce greenhouse gas emissions. In these applications, the power consumption of various subsystems including inverters, onboard chargers (OBCs), and wireless power transfer (WPT) systems is increasing, and MLCCs must handle high currents and have large capacitance.

 

To meet these needs, TDK developed the CA series, the largest MLCCs in the industry* (6.00 x 5.60 x 6.40 mm) with a metal frame and 3-line type structure. TDK now provides an extensive lineup including 99 nF/1000 V with a Class 1 dielectric and 47 μF/100 V with a Class 2 dielectric.

 

To handle high currents, TDK has reduced the equivalent series resistance (ESR) compared to the previous products by optimizing the materials of the metal frame. This helps reduce the number of components and miniaturizes devices. TDK will further expand its lineup to meet the needs of customers.

 

*    As of September 2024, according to TDK

Main applications

  • Smoothing and decoupling of the power lines
  • Resonant circuits in subsystems such as OBCs and WPTs
  • Snubber circuits in inverters

Main features and benefits

Leave a Reply

featured blogs
Dec 19, 2024
Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....
Jan 10, 2025
Most of us think we know something about quantum computing, right until someone else asks us to explain it to them'¦...

featured chalk talk

STM32 Security for IoT
Today’s modern embedded systems face a range of security risks that can stem from a variety of different sources including insecure communication protocols, hardware vulnerabilities, and physical tampering. In this episode of Chalk Talk, Amelia Dalton and Thierry Crespo from STMicroelectronics explore the biggest security challenges facing embedded designers today, the benefits of the STM32 Trust platform, and why the STM32Trust TEE Secure Manager is an IoT security game changer.
Aug 20, 2024
39,821 views