“As bandwidth demands soar to new heights, companies are turning to multi-die designs at an accelerated pace to achieve greater levels of processing power and performance for their AI and high-performance computing applications,” said Sanjay Bali, vice president of strategy and product management for the Synopsys EDA Group. “Our long-standing and deep collaboration with Intel Foundry, resulting in a production-ready AI-driven multi-die reference flow for EMIB technology, provides our mutual customers with a comprehensive solution that helps them develop their billion- to trillion-transistor multi-die systems.”

“Addressing the design and packaging complexities of multi-die architectures requires a holistic approach to solving the thermal, signal integrity, and interconnect challenges,” said Suk Lee, VP & GM of Ecosystem Technology Office, at Intel Foundry. “Intel Foundry’s manufacturing and advanced packaging technologies, combined with Synopsys’ certified multi-die reference flow and trusted IP, provides designers with a comprehensive and scalable solution for fast heterogeneous integration using the Intel Foundry’s EMIB technology.”

AI-Driven EDA Reference Flow and IP for Multi-Die Designs
Synopsys offers a comprehensive and scalable multi-die solution for fast heterogeneous integration. The solution, from silicon to systems, enables early architecture exploration, rapid software development and system validation, efficient die-package co-design, robust die-to-die connectivity, and improved manufacturing and reliability. Adopted by multiple leading customers, Synopsys 3DIC Compiler, a key component of the multi-die solution, is integrated with Ansys® RedHawk-SC Electrothermal™ multiphysics technology, to address the power and thermal signoff critical for 2.5D/3D multi-die designs. In addition, the solution maximizes system performance and quality of results at a rapid pace with Synopsys 3DSO.ai, an autonomous AI-driven optimization engine for 2.5D and 3D multi-die designs.

Synopsys is developing IP for Intel Foundry process technologies, providing the interconnects needed to build multi-die packages with reduced integration risk and accelerated time-to-market. The combination of Synopsys IP and Synopsys 3DIC Compiler can enable up to 30% reduction in effort and 15% improvement in quality of results (as measured by margin) compared to traditional manual flows by automating routing, interposer studies, and signal integrity analysis.¹

Availability and Resources
The reference flow is available now from either Intel Foundry or Synopsys.

• Learn more about the Synopsys Multi-Die Solution: https://www.synopsys.com/multi-die-system.html
• Learn more about Synopsys IP: https://www.synopsys.com/designware-ip.html
• Intel 18A collaboration announcement: https://news.synopsys.com/2024-02-21-Synopsys-and-Intel-Foundry-Accelerate-Advanced-Chip-Designs-with-Synopsys-IP-and-Certified-EDA-Flows-for-Intel-18A-Process

About Synopsys
Catalyzing the era of pervasive intelligence, Synopsys, Inc. (Nasdaq: SNPS) delivers trusted and comprehensive silicon to systems design solutions, from electronic design automation to silicon IP and system verification and validation. We partner closely with semiconductor and systems customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.  Learn more at www.synopsys.com.