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TE Connectivity’s MULTIGIG HD selected as future VPX connector standard

With doubled pin count compared to VITA 46 and speeds up to 112 Gb/s, TE’s MULTIGIG HD connector designed to meet defense industry’s increased connectivity and bandwidth requirements
January 13, 2025

HARRISBURG, Pa., January 13, 2025 – TE Connectivity, a world leader in connectivity and sensors, today revealed its MULTIGIG HD connector was selected by the VITA Standards Organization (VSO) as the Next-Generation VPX plug-in module connector and will become a defense industry standard. The redesigned MULTIGIG HD connector builds on the previous variants of TE’s MULTIGIG HD product family, while bringing significant … Read More → "TE Connectivity’s MULTIGIG HD selected as future VPX connector standard"

Nokia’s Cellular Network Ready for Moon as Intuitive Machines Completes Final Lunar Lander Installation

January 9, 2025

HOUSTON, Jan. 07, 2025 (GLOBE NEWSWIRE) — Today Intuitive Machines, Inc. (Nasdaq: LUNR, LUNRW) (“Intuitive Machines”) and Nokia (NYSE: NOK, Euronext: NOKIA) announced the successful final integration of Nokia’s Lunar Surface Communication System (“LSCS”) into the IM-2 mission lander, named Athena. Athena and the LSCS will voyage to the lunar south pole region in the upcoming IM-2 mission, where Nokia and Intuitive Machines intend to deploy the first cellular network on the Moon.

After months of testing and validation with Nokia Bell Labs, Intuitive Machines engineers installed the LSCS “network in a box” to one of Athena’ … Read More → "Nokia’s Cellular Network Ready for Moon as Intuitive Machines Completes Final Lunar Lander Installation"

NXP’s New Ultra-low-power MCX L Microcontrollers Enable the Next Generation of Smart, Sustainable Solutions

Using 3x less power than previous MCX devices, the MCX L series MCUs leverage an ultra-low-power sense domain to extend the battery life for smart sensor nodes, flow meters and other battery-constrained industrial and IoT devices.
January 9, 2025

What’s new: As part of its ongoing initiative to provide innovative systems solutions for industrial and home energy management, NXP Semiconductors today announced the MCX L14x and MCX L25x, the first families in the ultra-low-power L Series of theRead More → "NXP’s New Ultra-low-power MCX L Microcontrollers Enable the Next Generation of Smart, Sustainable Solutions"

Imec and partners show outdoor stability of highly anticipated perovskite solar modules

A leap for photovoltaic research
January 9, 2025

LEUVEN (Belgium), JANUARY 7, 2024—Imec, partner in EnergyVille, in collaboration with the University of Cyprus, has demonstrated long-term outdoor stability of perovskite solar modules. Mini-modules of 4 cm2, developed at imec/EnergyVille, were comprehensively evaluated over two years in real-world conditions in Cyprus, with a remarkable power efficiency retention of 78 percent after one year, which current perovskite solar modules only retain for weeks. These promising findings are among the first real-world results to address the stability issues that currently hinder perovskite solar cells from commercialization.

Over the last decade, metal halide perovskites have … Read More → "Imec and partners show outdoor stability of highly anticipated perovskite solar modules"

Ceva Powers Oritek’s Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles

Lonquan 560 SoCs leverage Ceva-SensPro Vision AI DSP to advance ADAS capabilities amidst China's rapidly growing EV market and global shift towards more sustainable and intelligent transportation solutions
January 9, 2025

LAS VEGAS, NV. – CES 2025 – January 8, 2025  – Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP that enables Smart Edge devices to connect, sense and infer data more reliably and efficiently, today announced that Oritek Semiconductor, a provider of AI system-on-chip (SoC) solutions for intelligent automotive platforms, has licensed Ceva’s SensPro™ Vision AI DSP for its Longquan 560 series of Advanced Driver Assistance Systems (ADAS) chipsets.

The Longquan 560 series represents Oritek’s commitment to innovation, catering to diverse intelligent automotive needs of Electric Vehicles (EV) such as AI-based headlights, camera monitoring systems (CMS), zone … Read More → "Ceva Powers Oritek’s Next-Gen ADAS chipsets for Smarter, Safer Electric Vehicles"

Honda and Renesas Sign Agreement to Develop High-Performance SoC for Software-Defined Vehicles

Delivering Industry-Leading AI Performance and Power Efficiency for the Honda 0 Series in the Late 2020s
January 8, 2025

TOKYO, Japan ― Honda Motor Co., Ltd. (TSE: 7267) and Renesas Electronics Corporation (TSE:6723) announced today that they have signed an agreement to develop a high-performance system-on-chip (SoC) for software-defined vehicles (SDVs). The new SoC is designed to deliver leading-edge*1 AI performance of 2,000*2 TOPS combined with a world-class power efficiency of 20 TOPS/W, and is slated for use in future models of the “Honda 0 (Zero) Series,” Honda’s new electric vehicle (EV) series, specifically those that will be launched in … Read More → "Honda and Renesas Sign Agreement to Develop High-Performance SoC for Software-Defined Vehicles"

Morse Micro Introduces MM8108: the Smallest, Fastest, Lowest Power and Farthest-Reaching Wi-Fi Chip in the World

January 8, 2025
  • Latest Wi-Fi HaLow System-on-Chip (SoC) Sets a New Benchmark for Performance, Efficiency, Security and Versatility in IoT
  • Accompanying USB Dongle Enables Rapid and Robust Wi-Fi HaLow Integration in New and Existing Wi-Fi Infrastructure

LAS VEGAS, JANUARY 8, 2025 – CES 2025 – Morse Micro, the world’s leading provider of Wi-Fi HaLow chips based on the IEEE 802.11ah specification, has announced the launch of its highly anticipated second-generation MM8108 System-on-Chip (SoC). Building on the success of the first-generation MM6108 SoC, the MM8108 offers even better performance in all key areas of range, … Read More → "Morse Micro Introduces MM8108: the Smallest, Fastest, Lowest Power and Farthest-Reaching Wi-Fi Chip in the World"

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