News – Page 3 – EEJournal

WePower Technologies Attracts Massive Interest at CES 2025 from Major Companies Across Multiple Industries Seeking Alternative Power Integration into New IoT Devices

Lighting Companies, Security Firms Even Elevator Manufacturers Attracted to Gemns Magnet-Powered Replacements for Traditional Batteries

January 14, 2025

Sagaponack, NY (January 13, 2024) – For Larry Richenstein, CEO of energy harvesting company WePower Technologies, CES 2025 has served as complete validation for everything he has recently believed: that the world is finally ready for a viable, sustainable, and cost-effective alternative to traditional battery-power integration into IoT, Smart Home, and even lower-tech electronic devices.

Through the company’s Gemns™ Energy Harvesting Generator (EHG) product line, WePower provides fully sustainable energy output through the use of permanent, oscillating magnets capable of powering a broad range of devices, from lighting, smart home/smart office appliances and electronics to … Read More → "WePower Technologies Attracts Massive Interest at CES 2025 from Major Companies Across Multiple Industries Seeking Alternative Power Integration into New IoT Devices"

Vertical Compute, a new imec spin-off, Raises €20 million to Revolutionize the Future of AI Computing

New deep-tech semiconductor startup tackling AI’s Compute Memory Bottleneck

January 14, 2025

• Vertical Compute, a groundbreaking European deep-tech semiconductor startup, has announced the successful closure of a €20 million seed investment round.
• The company aims to revolutionize the future of computing by solving the critical “memory wall” bottleneck, delivering major advancements for the tech industry and enabling highly tangible applications for consumers in the near future.
• The funding round, led by imec.xpand and supported by Eurazeo, XAnge, Vector Gestion, and imec, will propel the development of a vertically integrated memory and compute technology that unlocks unprecedented potential for AI applications.

Louvain-La-Neuve (Belgium), January 14 2025 -Vertical Compute (Read More → "Vertical Compute, a new imec spin-off, Raises €20 million to Revolutionize the Future of AI Computing"

ISS National Lab Enables Record-Breaking Year of Space-Based Scientific Results

More than 50 peer-reviewed articles published in fiscal year 2024, bringing all-time number to nearly 450

January 14, 2025

KENNEDY SPACE CENTER (FL), January 9, 2025 – The International Space Station (ISS) National Laboratory pushed scientific boundaries and set a record in scholarly output over the past year. Results from these investigations address real-world challenges and benefit Earth’s economy.

In fiscal year 2024 (October 1, 2023-September 30, 2024), more than 50 peer-reviewed articles related to ISS National Lab-sponsored research were published, bringing the all-time number to nearly 450. These findings lay a robust foundation for ongoing scientific advancements that promise significant benefits for humanity. Several groundbreaking results were featured in three new issues of Upward, official magazine of the ISS National Lab, … Read More → "ISS National Lab Enables Record-Breaking Year of Space-Based Scientific Results"

2025 Device Research Conference Announces Call for Papers

January 13, 2025

DURHAM, NC (JANUARY 6, 2025) – The Device Research Conference (DRC), the longest running device research meeting in the world, has announced … Read More → "2025 Device Research Conference Announces Call for Papers"

Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms

January 13, 2025

Wavre, Belgium and Los Altos, California, January, 13rd, – Exostiv Labs has released the addition of device support for AMD Versal™ Adaptive SoCs to its cutting-edge Exostiv and Exostiv Blade platforms, including support for the world’s largest FPGA, the AMD Versal Premium VP1902. This latest development expands the platforms’ compatibility, already available for AMD 7 Series FPGAs and AMD UltraScale™, UltraScale+™, and Zynq™ adaptive SoCs, to meet the high-performance debugging needs of Versal users.

Unlocking Massive Data Capture for Versal Devices
Exostiv Labs specializes in delivering unmatched internal capture capabilities for single and multi-FPGA systems. … Read More → "Exostiv Labs Unveils AMD Versal Adaptive SoC Device Support for Exostiv and Exostiv Blade Platforms"

Renesas Introduces New MOSFETs with Exceptional Performance

New Renesas Wafer Technology Delivers 30 Percent Lower On-resistance, 40 Percent Reduction in Gate-Drain Charge, and 50 Percent Smaller Package Size

January 13, 2025

TOKYO, Japan, January 9, 2025 ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced new 100V high-power N-Channel MOSFETs that deliver industry-leading high-current switching performance for applications such as motor control, battery management systems, power management and charging. End products include electric vehicles, e-bikes, charging stations, power tools, data centers, uninterruptable power supplies (UPS) and more.

Renesas has developed a new MOSFET wafer manufacturing process (REXFET-1) that enables the new devices to drastically reduce on-resistance (the resistance between the drain and source when the MOSFET is on) by 30 percent. The lower on-resistance contributes … Read More →

Bluetest and Rohde & Schwarz collaborate to offer over-the-air testing of next-generation WLAN devices

January 13, 2025

Bluetest and Rohde & Schwarz extend their long-established collaboration and have integrated the Wi-Fi 7 test functionality of the R&S CMX500 one-box signaling tester into the Bluetest Flow control software. Now, developers and manufacturers of next-generation WLAN technology can use the Bluetest reverberation test systems (RTS) to perform MIMO stress testing of IEEE 802.11be stations as well as access points under realistic conditions.

Bluetest specializes in reverberation chambers, such as the RTS65, which are designed for efficient over-the-air performance evaluation of wireless devices. In contrast to anechoic test chambers, reverberation chambers extensively reflect an RF signal … Read More → "Bluetest and Rohde & Schwarz collaborate to offer over-the-air testing of next-generation WLAN devices"

TriLite to Showcase Smart Glasses and Automotive Projection Innovations at SPIE AR | VR | MR

January 13, 2025

Vienna, Austria – January 13, 2025 – TriLite, a pioneer in ultra-compact projection display technology, announces its participation at this year’s SPIE AR | VR | MR event in San Francisco, California. Located at booth 6418, TriLite will present live demonstrations of its augmented reality (AR) smart glasses, powered by Trixel® 3—the world’s smallest projection display.

Exclusive Demonstration: Dynamic Automotive Projection

Read More → "TriLite to Showcase Smart Glasses and Automotive Projection Innovations at SPIE AR | VR | MR"

TDK launches next-gen TWS solution VibeSense360™ enabling premium immersive sound

January 13, 2025

The next-gen VibeSense360™ TWS solution includes motion sensor hardware and software
Running on the latest SmartMotion® ICM-45606 IMU, the next-gen VibeSense360 enables concurrent features of spatial audio, keyword assist, transparency for talk, head/UI gestures, and machine learning
The 220 µA @ 50 Hz 6-Axis IMU delivers industry-leading performance and battery life for TWS applications

January 7, 2025

TDK Corporation (TSE:6762) announces the enhanced next-generation InvenSense VibeSense360™ solution for state-of-the-art spatial audio head tracking. Samples are available via direct inquiry with InvenSense sales.

VibeSense360™ enables concurrent execution of … Read More → "TDK launches next-gen TWS solution VibeSense360™ enabling premium immersive sound"

TE Connectivity’s MULTIGIG HD selected as future VPX connector standard

With doubled pin count compared to VITA 46 and speeds up to 112 Gb/s, TE’s MULTIGIG HD connector designed to meet defense industry’s increased connectivity and bandwidth requirements

January 13, 2025

HARRISBURG, Pa., January 13, 2025 – TE Connectivity, a world leader in connectivity and sensors, today revealed its MULTIGIG HD connector was selected by the VITA Standards Organization (VSO) as the Next-Generation VPX plug-in module connector and will become a defense industry standard. The redesigned MULTIGIG HD connector builds on the previous variants of TE’s MULTIGIG HD product family, while bringing significant … Read More → "TE Connectivity’s MULTIGIG HD selected as future VPX connector standard"

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Understanding Concurrent Multiprotocol: An In-Depth Exploration

Dec 19, 2024

Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....