TSMC Extends Open Innovation Platform™
HSINCHU, Taiwan, June 7 /PRNewswire-FirstCall/ — Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) today extended its Open Innovation Platform™ with another focus on system-level design, analog/mixed-signal (AMS)/RF design and two-dimensional/three-dimensional integrated circuit (2-D/3-D IC) implementation. At the same time the company introduced the first three initiatives from the new focus.
TSMC originally launched the Open Innovation Platform in 2008 as an industry-wide design enablement initiative. To date, the Open Innovation platform has accelerated time-to-market, improved return on design investment and reduced design infrastructure duplication. It includes a set of interoperable ecosystem interfaces, collaborative … Read More → "TSMC Extends Open Innovation Platform™"