MicroProbe Tackles Mobile Consumer IC Wafer Test Challenges With New MEMS-Based Multi-DUT, Ultra-Fine-Pitch Probe Card
SAN JOSE, CA–(Marketwire – July 12, 2010) – MicroProbe, Inc., a leading supplier of wafer test technology to the global semiconductor industry, today introduced the MEMS-based Mx-FinePitch (Mx-FP) product. This new class of probe card tackles the ultra-fine-pitch testing needs of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs. Built for multi-DUT (Devices under Test) testing in high-volume production environments, the product requires no probe positioning adjustments throughout its lifetime. It is highly customizable for diverse application needs, providing unmatched design flexibility for SoC feature integration. Chief advantages include … Read More → "MicroProbe Tackles Mobile Consumer IC Wafer Test Challenges With New MEMS-Based Multi-DUT, Ultra-Fine-Pitch Probe Card"