News – Page 2174 – EEJournal

Jasper Introduces Intelligent Proof Kits For Faster, More Accurate Verification of SoC Interface Protocols

December 14, 2010

MOUNTAIN VIEW, Calif. – Dec. 14, 2010 – Jasper Design Automation, provider of advanced formal technology solutions, today introduced Intelligent Proof Kits for accelerated certification of advanced SoC interconnect protocols. Jasper Intelligent Proof Kits encapsulate critical behaviors for popular protocols such as ARM’s AMBA, letting users quickly configure designs to the standard or adapt them to their own custom configuration. Intelligent Proof Kits are optimized for high-level verification with Jasper’s ActiveDesign™ and JasperGold® formal verification, and designers benefit from these kits especially in combination … Read More → "Jasper Introduces Intelligent Proof Kits For Faster, More Accurate Verification of SoC Interface Protocols"

TREK-743 Vehicle Mounted Computer: Now Available on a Lightweight Linux Platform

December 14, 2010

Irvine, California, December 13th, 2010 – Advantech is happy to announce it has a new option available for the TREK-743, 7″ Vehicle Mounted Computer which adds support for Lubuntu, a lightweight, derivative of the Ubuntu operating system. This faster, lightweight and more energy efficient operating system gives system integrators an alternative to the traditional Windows-based platform. This allows programmers experienced in Linux platform development to quickly bring applications to market, as well as reducing costs by eliminating operating system licensing fees.

Special Request Becomes Standard Offering

A large installation in India became … Read More → "TREK-743 Vehicle Mounted Computer: Now Available on a Lightweight Linux Platform"

10GbE MAC IP Core Accelerates Time to Deployment in SIGINT and Cyber-Security Applications

December 14, 2010

Camarillo, CA, USA, December 13^th, 2010 – Nallatech, a leading supplier of high-performance COTS FPGA solutions, announces the release of a 10Gb Ethernet Media Access Controller (MAC) IP core for use with their PCIe-180 Network Accelerator Card. This comprehensive IP and hardware combination can significantly reduce time to deployment in signal intelligence, deep-packet inspection, and cyber-security applications.

This IEEE 802.3-2005 compliant MAC core supports the high-bandwidth demands of Internet protocol traffic on LAN, MAN and WAN networks. In addition to dramatically reducing the programming time needed for integration and debugging, an extremely flexible licensing agreement can … Read More → "10GbE MAC IP Core Accelerates Time to Deployment in SIGINT and Cyber-Security Applications"

IAR Systems Commits its Support for STMicroelectronics STM32 F-2 Cortex-M3 based MCUs

December 14, 2010

December 14th Uppsala, Sweden. IAR Systems® announced today the availability of IAR Embedded Workbench® for ARM® that supports the recently released STM32 F-2 series of high performance ARM Cortex-M3 based microcontrollers. Believed to be the fastest Cortex-M3 device available and capable of achieving up to 150 Dhrystone MIPS, the STM32 F-2 device is aimed at high-performance power-sensitive applications. The STM32 F-2 together with IAR Embedded Workbench, with its ability to generate highly optimized and efficient code, is an ideal combination.

IAR Embedded Workbench already supports every microcontroller available from STMicroelectronics. With the addition of this … Read More → "IAR Systems Commits its Support for STMicroelectronics STM32 F-2 Cortex-M3 based MCUs"

IAR Systems Commits its Support for STMicroelectronics STM32 F-2 Cortex-M3 based MCUs

December 14, 2010

Dialog Semiconductor enables 3D experience for smartphones and tablet PCs with first 2D to 3D video conversion IC

December 13, 2010

Kirchheim/Teck, Germany 13th December 2010 – Dialog Semiconductor plc (FWB: DLG), a provider of highly integrated innovative display, audio and power management semiconductor solutions, has announced the DA8223, the world’s first real time 2D to 3D video conversion chip for portable devices including smartphones and tablet PCs. The device also integrates a parallax barrier <http://en.wikipedia.org/wiki/Parallax_barrier> screen driver that lets users view 3D content without the need for glasses.

The IC analyses each 2D video frame and … Read More → "Dialog Semiconductor enables 3D experience for smartphones and tablet PCs with first 2D to 3D video conversion IC"

LDRA Tool Suite Extends Certification Support for x86 Assembly Code

December 13, 2010

Wirral, UK, December 13, 2010. LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, has developed a variant of the LDRA tool suite that supports x86 assembler syntax. Catering to a broad range of … Read More → "LDRA Tool Suite Extends Certification Support for x86 Assembly Code"

Honey…I Shrunk The Basestation

December 13, 2010

Cheshire, UK – 9^th December 2010 – Kane Computing are pleased to announce that Sundance, the leading supplier and manufacturer of advanced digital signal processing and reconfigurable FPGA systems today announced availability of its modular EVP6472-903 Dual WiMax RF Module multiprocessing solution. The energy smart EVP6472-903 feature two multicore DSPs with twelve TMS320C64x+™ processor cores clocked at 500MHz for telecom demanding real time processing.

The product development is aligned to the trend and commitment made by the worldwide mobile communications industry to … Read More → "Honey…I Shrunk The Basestation"

Single Inductor High Efficiency Synchronous Buck-Boost DC/DC Controller

December 13, 2010

MILPITAS, CA – December 13, 2010 – Linear Technology Corporation announces the LTC3789, a very high efficiency (up to 98%) synchronous buck-boost DC/DC controller that operates from input voltages above, below or equal to the regulated output voltage. High power circuits that step-up and-down typically rely on transformers or two DC/DC converters, one for step-up (boost) and the other for … Read More → "Single Inductor High Efficiency Synchronous Buck-Boost DC/DC Controller"

Microsemi Adopts Sibridge Technologies’ Verification IPs

December 13, 2010

IRVINE, Calif., December 13, 2010 –Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor technology aimed at building a secure, smart, connected world, today announced it has adopted Sibridge Technologies’ Verification Intellectual Property (VIP) to reduce time to market for its innovative FPGA and customizable SoC products. Sibridge Technologies is a provider of innovative ASIC/FPGA, design and verification IPs and embedded systems solutions. The company offers a suite of Design IP (DIP) and Verification IP (VIP) for industry-standard interfaces including PCI Express Gen 3/Gen 2/Gen 1, Ethernet 100G/40G/10G/1G, USB 3.0/2.0, SATA 2.0/1.0, AMBA AHB/AXI and I2C.

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