MOUNTAIN VIEW, Calif, July 26. Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Foveon Inc., a world innovator in the design and development of image sensors and image capture systems, has taped out its newest generation direct image sensor using Synopsys’ Galaxy Custom Designer® solution. The Foveon X3® direct image sensor, used in high end consumer cameras such as Sigma’s SD15 digital SLR camera, has over 14 million pixels and is implemented on a 180 nanometer (nm) CMOS die. Foveon chose Synopsys’ custom design solution … Read More → "Foveon switches to Galaxy Custom Designer solution to accelerate time to tapeout"

MOUNTAIN VIEW, Calif. July 13, 2010 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that SVTC Technologies, the leading commercialisation service provider for new, emerging silicon based technologies, has chosen Synopsys’ manufacturing tool suite to enable its customers to reduce time to market for a wide variety of innovative products using CMOS processes, MEMS, photovoltaics and other related nanotechnologies.

SVTC offers its customers access to facilities, equipment and services to perform the development, manufacturing and analytical activities required to bring new products to market. By pooling … Read More → "SVTC technologies selects Synopsys’ manufacturing tools to accelerate time to comercialisation"

SAN JOSE, CA–(Marketwire – July 12, 2010) –  MicroProbe, Inc., a leading supplier of wafer test technology to the global semiconductor industry, today introduced the MEMS-based Mx-FinePitch (Mx-FP) product. This new class of probe card tackles the ultra-fine-pitch testing needs of leading-edge SoC and logic devices found in applications like digital cameras, set-top boxes and digital TVs. Built for multi-DUT (Devices under Test) testing in high-volume production environments, the product requires no probe positioning adjustments throughout its lifetime. It is highly customizable for diverse application needs, providing unmatched design flexibility for SoC feature integration. Chief advantages include … Read More → "MicroProbe Tackles Mobile Consumer IC Wafer Test Challenges With New MEMS-Based Multi-DUT, Ultra-Fine-Pitch Probe Card"

July 8th, Uppsala, Sweden – IAR Systems today announced that it has incorporated its newly developed power debug and analysis tools within IAR Embedded Workbench for ARM. Bucking the software industry’s trend of charging for new software features, IAR Systems has opted to include its innovative technology as standard.

The new tools provide the capability to correlate current sampling alongside program execution, allowing analysis of the software’s influence on power consumption and providing developers with the means to optimize source code to minimize power consumption.

“We are working with some of the largest suppliers … Read More → "IAR Systems incorporates power debugging as standard in IAR Embedded Workbench"

MOUNTAIN VIEW, Calif, July 7 – Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Open-Silicon a leading system-on-chip (SoC) design and semiconductor manufacturing company, has licensed and integrated 50 high speed DesignWare(r) IP products into customers’ chips with 100 percent first-pass silicon success. The IP products include complete solutions consisting of configurable digital controllers, PHYs which support leading process technologies from 180 to 28 nanometres, verification IP, as well as analogue front ends and data converters. In addition to integrating many of Synopsys’ silicon-proven interface and analogue IP products, Open-Silicon has incorporated … Read More → "Open-Silicon integrates 50 DesignWare interface and analogue IP products with 100 percent silicon success"

San Diego, USA and Cheltenham, UK – 6th July 2010. Atego, the leading independent supplier of industrial-grade, collaborative development tools for engineering complex, mission- and safety-critical architectures, systems, software and hardware, has launched Atego Process Director, a ground-breaking, new web-based environment for process definition, management and deployment.

Atego Process Director delivers a highly scalable, extensible and pragmatic range of new web-based process-oriented capabilities for operational, engineering and development process authoring, roll-out, management, governance measurement and optimization. Its thin client user interface runs on contemporary browsers and also supports mouse-free environments such as Windows Touch, iPad and the iPhone, proactively … Read More → "Atego launches Atego Process Director"

PISCATAWAY, N.J., USA, 14 June 2010 — The IEEE announced today the launch of Get IEEE 1685™, a website where users can download the current version of the standard free of charge. IEEE 1685™ is the first standard description of Intellectual Property blocks in highly automated design environments … Read More → "Get IEEE 1685™ Launches to Provide Industry with Free Access to Standard for Automated Design Environments"

ACTON, MASS. –– June 21, 2010 –– Carbon Design Systems today announced that TSMC added Carbon Model Studio and SoC Designer Plus to TSMC Reference Flow 11.0. 

The Carbon products used in Reference Flow 11.0 support performance and power analysis at the System (ESL) and register transfer level (RTL), and also provide a platform for pre-silicon software development.

Read More → "Carbon Design Systems Announces Performance, Power Analysis in TSMC Reference Flow 11.0"

SANTA CLARA, Calif., June 15, 2010 — Agilent Technologies Inc. (NYSE: A) today expanded its digital communications analyzer (DCA) portfolio with the introduction of the 86100D DCA-X wide-bandwidth oscilloscope. The DCA-X provides engineers with the tools needed to characterize … Read More → "Agilent Technologies Introduces Wide-Bandwidth Oscilloscope for Faster, More Accurate Characterization of High-Speed Digital Designs"

SANTA CLARA, Calif., June 14, 2010 — Agilent Technologies Inc. (NYSE: A) today announced that its SystemVue Electronic System-Level (ESL) design software, version 2010.07, will automatically generate IBIS Algorithmic Modeling Interface (IBIS-AMI) models. IBIS-AMI, a modeling standard for serializer-deserializer (SerDes) transceivers, was created to enable fast, statistically significant analysis of high-speed digital chip-to-chip links. For the first time, < … Read More → "Agilent Technologies Offers Industry’s First Automatic IBIS-AMI Model Generation Capability in an ESL Design Flow"