News – Page 2145 – EEJournal

Synopsys Introduces Proteus LRC for Lithography Verification

March 1, 2011

SAN JOSE, Calif., March 1, 2011 – SPIE Advanced Lithography—Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today introduced Proteus LRC for lithography verification. Proteus LRC provides comprehensive, process-window-aware checking features to identify locations in a design that are sensitive to process variations, thereby enabling corrective action to be taken prior to committing a design to manufacture. Proteus LRC is integrated into the Proteus Mask Synthesis flow and is targeted for use by OPC and mask data preparation groups at semiconductor manufacturers like Micron Technology, Inc.

MOST(R) Forum 2011: MOST Cooperation Demonstrates Readiness to Meet Future Demands

February 28, 2011

Karlsruhe (Germany) February 28, 2011 – The MOST Cooperation will again participate in the upcoming MOST Forum on April 5, 2011, in Frankfurt (Germany). In the exhibition area, the standardization organization for the leading automotive multimedia network, Media Oriented Systems Transport (MOST), will present new technology highlights based on its latest generation – MOST150 – which meets tomorrow’s multimedia and information network needs in the car. At present, MOST150 is heading towards implementation. “Our newest MOST generation is about to hit the road and we are proud that our core partner members Audi and Daimler will be the first carmakers to integrate MOST150 into series … Read More → "MOST(R) Forum 2011: MOST Cooperation Demonstrates Readiness to Meet Future Demands"

Magma’s Titan and FineSim Validated for LFoundry Interoperable Process Design Kits (iPDKs), Accelerating Turnaround Time for Analog/Mixed-Signal SoCs

February 28, 2011

February 28th 2011 – SAN JOSE, Calif. and LANDSHUT, Germany, Feb. 28, 2011 – Magma® Design Automation (Nasdaq: LAVA), a provider of chip design software, and LFoundry, the customer-specific manufacturer of choice for analog, mixed-signal and specialized technologies, today announced the LFoundry’s interoperable process design kits (iPDKs) are validated for use with the Titan™ Mixed-Signal Design Platform, Titan Acclerators and FineSim™ circuit simulator for 0.15-micron technology platforms. The combination of Magma’s Titan and FineSim software and LFoundry’s process technology will accelerate development of analog/mixed-signal (AMS) products, especially for European system-on-chip (SoC) developers.

< … Read More →

New Shanghai HuaLi Foundry Chooses the Mentor Graphics Calibre RET Solution for 65/45nm Development and Production

February 28, 2011

WILSONVILLE, Ore., February 28, 2011—Mentor Graphics Corporation (NASDAQ: MENT) today announced that Shanghai HuaLi Microelectronics Corp., a joint foundry venture of the China Government, Shanghai Alliance Investment Co., Ltd, Shanghai Hua Hong (Group) Co., Shanghai Grace Semiconductor Manufacturing Corp., and Shanghai Hua Hong NEC Electronics Co., Ltd, has chosen the Calibre® RET and OPC Computational Lithography platform to support its 65, 55 and 45nm development and production. The Mentor® Calibre nmOPC and Calibre OPCverify™ products were selected following a comprehensive technical benchmark in which the Calibre solution demonstrated superior accuracy, ease of use, cost of ownership and overall … Read More → "New Shanghai HuaLi Foundry Chooses the Mentor Graphics Calibre RET Solution for 65/45nm Development and Production"

Synopsys DesignWare IP First to Support Final Release of PCI Express 3.0 Specification

February 28, 2011

MOUNTAIN VIEW, Calif., Feb. 28, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that it is the first IP provider to support the final version of the PCI Express® (PCIe®) 3.0 base specification (version 1.0), recently released by the PCI Special Interest Group (PCI-SIG®). In addition, Synopsys has enhanced its DesignWare® digital controllers … Read More → "Synopsys DesignWare IP First to Support Final Release of PCI Express 3.0 Specification"

Duolog Extends Solutions to Support EDA360 Vision in Collaboration With Cadence

February 25, 2011

DUBLIN, IRELAND–(Marketwire – February 24, 2011) – Duolog Technologies, the award-winning developer of IP and SoC integration products, today announced that its Socrates Chip Integration Hub leverages a multi-standards-based methodology enabled through close collaboration with Cadence Design Systems, Inc. a leader in global electronic design innovation.

Duolog’s Socrates integration platform enables designers to manage metadata for their IP and systems through auto-generation of verification, hardware and software design data from a central, verified source to ensure that engineering teams remain synchronized at all times, and that costly bugs due to misalignment, miscommunication or misinterpretation are eradicated. Socrates employs … Read More → "Duolog Extends Solutions to Support EDA360 Vision in Collaboration With Cadence"

RFMD® Unveils Portfolio Of Cellular Front End Modules For 3G/4G Switch And Signal Conditioning Applications

February 25, 2011

Barcelona, Spain, February 15, 2011 — RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the addition of four new products to RFMD’s expanding portfolio of front end modules for 3G/4G switch and signal conditioning applications.

RFMD’s switch and signal conditioning product portfolio includes antenna switch modules, switch filter modules, switch duplexer modules, RF power management components, and low noise amplifiers. The four newly introduced products – the RF8889A, the RF1291, the RF1194A, and the RF1196 & … Read More → "RFMD® Unveils Portfolio Of Cellular Front End Modules For 3G/4G Switch And Signal Conditioning Applications"

Versatile Ultra-low Power Biomedical Signal Processor

February 25, 2011

San Francisco, US – February 23, 2011 – At today’s International Solid-State Circuit Conference (ISSCC2011), imec, Holst Centre and NXP present a versatile ultra-low power biomedical signal processor, CoolBioTM, meeting the requirements of future wearable biomedical sensor systems. The biomedical signal processor consumes only 13pJ/cycle when running a complex ECG (electrocardiogram) algorithm at 1MHz and 0.4V operating voltage. This C-programmable chip is voltage and performance scalable supporting a frequency range of 1MHz up to 100MHz with an operating voltage from 0.4 to 1.2V.

Intelligent body area networks (BANs) consisting of wireless sensors nodes which continuously monitor vital … Read More → "Versatile Ultra-low Power Biomedical Signal Processor"

Faraday Picks Silicon Frontline’s F3D for Accurate Post-Layout 3D Extraction of Analog and Digital Converters (ADCs)

February 25, 2011

Campbell, CA February 24,2011 – Silicon Frontline Technology, Inc. (SFT), an Electronic Design Automation (EDA) company, in the post-layout verification market focused on solutions for nanometer design applications, announced today that after an extensive evaluation of post-layout verification tool offerings Faraday picked Silicon Frontline’s F3D for its accurate 3D extraction. The high accuracy results of F3D for Faraday’s Analog to Digital Converters ( … Read More → "Faraday Picks Silicon Frontline’s F3D for Accurate Post-Layout 3D Extraction of Analog and Digital Converters (ADCs)"

Renesas Electronics Announces Low-Power Microcontrollers with Large Capacity Memory

February 25, 2011

Dusseldorf, 25th February 2011 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today announced the availability of its eight new 32-bit V850 microcontrollers (MCUs), an addition to its existing J Series. These new V850ES/Jx3-L MCUs are an extension of the successful low power V850ES/Jx3-L 32-bit MCUs that were introduced in early 2010. They are designed for low power, portable applications with high density memory from 768 kilobyte (KB) flash/80KB RAM to 1 megabyte (MB) flash/80KB RAM to support increasing memory demand. … Read More → "Renesas Electronics Announces Low-Power Microcontrollers with Large Capacity Memory"

featured blogs

Understanding Concurrent Multiprotocol: An In-Depth Exploration

Dec 19, 2024

Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....