News – Page 2134 – EEJournal

First Qseven Module with NVIDIA Tegra290 ARM CPU

February 21, 2011

Stutensee, Germany – With the MSC Q7-NT2, MSC Vertriebs GmbH presents its first ARM^® processor based Qseven™ module. The compact module consumes only 5 W typical and is specified for an extended ambient temperature range from -40°C to +85°C. The excellent graphics performance of the embedded module allows playback of HD videos and is, among other applications, ideally suited for digital signage.

Microsoft^® Windows^® CE operating system and support for the open source, free Linux is currently offered for … Read More → "First Qseven Module with NVIDIA Tegra290 ARM CPU"

Advantech Announces New ATCA Platform Integration Services To Accelerate Network Solutions Development

February 21, 2011

Irvine, California, February 18, 2011 – Advantech, a global manufacturer of telecom computing blades and multi-core network processor platforms, today announced new ATCA Platform Integration Services at Mobile World Congress 2011 and RSA 2011. With these services, Advantech can create customized ATCA platforms to meet the application-specific needs of Telecom Equipment Manufacturers and Network Solution Providers. The Advantech ATCA Platform Integration Service delivers cost-optimized platform solutions utilizing blade and platform technology from Advantech as well as 3^rd party hardware and software.

“Advantech& … Read More → "Advantech Announces New ATCA Platform Integration Services To Accelerate Network Solutions Development"

Space-saving socket option for energy friendly microcontrollers

February 21, 2011

Oslo, Norway, February 21, 2011 – Energy Micro, the energy friendly microcontroller company, has announced it is making its EFM32 Gecko and Tiny Gecko product lines available in the space-saving QFP48 package. The smaller 48-pin ARM® Cortex(TM)-M3 based microcontroller options will enable manufacturers to take device footprint down to 7mm x 7mm at a pin pitch of 0.5mm.

The QFP48 Gecko product offers the same range of low energy peripherals as its larger QFP100 packaged variant, including a multiple … Read More → "Space-saving socket option for energy friendly microcontrollers"

Meggitt Sensing Systems Introduces High-Temperature Accelerometer to +482°C with Three-Point ARINC Mounting and Long MTBF

February 21, 2011

February 17, 2011, San Juan Capistrano, California, USA – Meggitt Sensing Systems, a Meggitt group division, has introduced the Endevco^® model 6233C, a highly rugged, high-temperature piezoelectric charge output accelerometer, designed for continuous operation to +482°C (+900°F) with long Mean Time Before Failure (MTBF), making it ideal for the high-precision vibration monitoring of high-temperature jet and turboprop engines, helicopter and rotorcraft HUMS, gas turbines and nuclear power plant machinery and equipment.

With available standard ranges of 10, 50 and 100 pC/ … Read More → "Meggitt Sensing Systems Introduces High-Temperature Accelerometer to +482°C with Three-Point ARINC Mounting and Long MTBF"

High performance 600W cPCI from Gresham Power offers vendor, inventory and cost reduction

February 21, 2011

February 2011 – Gresham Power Electronics, the Salisbury based MIL and Commercial power conversion specialist, claim their 6U 600W cPCI power supply can cost effectively replace all other 6U products of equivalent and lower output power, thereby rationalising their customer’s inventory requirements and reducing costs.

Jake Moir, Managing Director of Gresham Power Electronics, explains; “Using our wealth of experience in power conversion design and manufacture we have developed a class leading 6U, 600W compactPCI power supply which … Read More → "High performance 600W cPCI from Gresham Power offers vendor, inventory and cost reduction"

Vector Fabrics eases heterogeneous multicore development

February 21, 2011

Eindhoven, The Netherlands, February 21, 2011 Vector Fabrics today announced the launch of their vfEmbedded cloud-based tool that allows embedded engineers to partition and map their software onto complex multicore platforms with ease. Following on the success of vfAnalyst, the partitioning tool that uses a platform independent symmetrical multicore processor (SMP) approach, vfEmbedded supports specific multicore architectures that have different cores and can assign partitions to specific cores. The ARM Cortex A9 and x86 architectures are the first to be supported with more target types to follow. Heterogeneous platforms having non-uniform resources such … Read More → "Vector Fabrics eases heterogeneous multicore development"

RFMD® Introduces Power Amplifiers With Breakthrough Peak Efficiency

February 21, 2011

Barcelona, Spain, February 14, 2011 — RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced availability of the Company’s RF724x family of HSPA+ power amplifiers. RFMD’s RF724x power amplifiers are ultra-high efficiency, single-mode 3G/4G components that reset the bar for performance in smartphones, tablets, and other high-performance data-centric connected devices.

RFMD’s RF724x power amplifiers support ultra-high peak efficiency … Read More → "RFMD® Introduces Power Amplifiers With Breakthrough Peak Efficiency"

Agilent Technologies’ Latest 3D EM Simulation Platform Provides Faster, More Accurate Modeling of RF, High-Speed Components

February 18, 2011

SANTA CLARA, Calif., Feb. 16, 2011 – Agilent Technologies Inc. (NYSE:A) today announced Electromagnetic Professional 2011.02, a new release of its 3-D electromagnetic modeling and simulation platform for creating 3-D models and analyzing the electrical performance of packages, connectors, antennas, and other RF components.

Known as EMPro, the platform is tightly integrated with Agilent’s Advanced Design System for the design of RF and high-speed circuits, modules and PC boards. The new release features significant improvements in both accuracy and speed for … Read More → "Agilent Technologies’ Latest 3D EM Simulation Platform Provides Faster, More Accurate Modeling of RF, High-Speed Components"

Step-Down Converter with Linear Bypass Powers Multimode PAs in Mobile Handsets

February 18, 2011

SUNNYVALE, CA—February 17, 2011—Maxim Integrated Products (NASDAQ: MXIM) introduces the MAX8989, a step-down converter designed to power PA (power amplifier) modules in mobile phones. The first DC-DC converter in the industry to support power management for multiple communication protocols (e.g., LTE, WCDMA, GSM, and EDGE), the MAX8989 is ideal for converged (multimode) PAs. This solution is utilized in Infineon’s proven SMARTi(TM) UE2 RF engine platform, which delivers unparalleled flexibility and efficiency to multistandard cellular phone systems.

The MAX8989 integrates a high-efficiency switching regulator with a parallel bypass LDO to guarantee … Read More → "Step-Down Converter with Linear Bypass Powers Multimode PAs in Mobile Handsets"

Tyco Electronics Provides High-Performance LCD Coaxial Embedded Display Interface (LCEDI) And LCEDI Source Receptacle (SR)

February 18, 2011

HARRISBURG, Pa. – Feb 15, 2011 – The rapidly developing tablet, notebook and netbook PC markets are creating demand for high-performance interconnects with sufficient throughput to drive the latest display technology. With these requirements in mind, Tyco Electronics (TE) introduced the next-generation LCD Coaxial Embedded Display Interface (LCEDI) family of connectors, with which TE is able to provide a total solution for panel / main board interconnection.

There are two distinct versions of LCEDI connectors: LCEDI and LCEDI SR. LCEDI connectors are mainly designed for notebook panels and tablet PCs, while LCEDI SR connectors are designed for … Read More → "Tyco Electronics Provides High-Performance LCD Coaxial Embedded Display Interface (LCEDI) And LCEDI Source Receptacle (SR)"

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