News – Page 2133 – EEJournal

VIA Launches Vision Intelligence Display (VID) Series, Digital Touch Screens for Embedded Applications

February 22, 2011

TAIPEI, TAIWAN, February 22, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA VID series of industrial-class touch screen displays designed for a range of modern interactive kiosk, POI and POS embedded systems, extending VIA’s position as a total system and embedded component provider.

Available in both ruggedized and open frame configurations, the VIA VID series spans 7 inch to 19 inch form factors and offers excellent compatibility with VIA embedded systems, added longevity support, complete scalability and a robust feature set ideal for commercial … Read More → "VIA Launches Vision Intelligence Display (VID) Series, Digital Touch Screens for Embedded Applications"

connectBlue Solves Seamless Roaming with Standard Access Points

February 22, 2011

Industrial wireless solution provider connectBlue reveals solution that maintains the signal quality on the existing wireless connection when the scanning for a new network is initiated; for instance, as a device in motion is moving from one access point to another. The seamless handover is achieved by using two or more of the latest connectBlue Wireless LAN Ethernet Port Adapters on each cooperating device in motion.

In the typical situation, a client remains the wireless connection with an access point until the radio signal gets too weak that the client has to initialize the scan for … Read More → "connectBlue Solves Seamless Roaming with Standard Access Points"

ISQED Addresses System and Intellectual Property (IP) Design Challenges – Offers Free Exhibit

February 22, 2011

12th International Symposium & Exhibits on QUALITY ELECTRONIC DESIGN — ISQED 2011

March 14-16, 2011
Hyatt Regency Hotel, Santa Clara, CA USA
http://www.isqed.org

Conference Highlights:
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Keynote Speeches
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“Design for Manufacturing (DFM) Innovations and advances for IC Design”
Vinod Kariat – Fellow, Cadence Design Systems

“Multitechnology Hyperintegration Platform: The Technology Crystal Ball”
Kamran Eshraghian – President, Innovation Labs, Perth, Australia & Distinguished Professor,
World Class University (WCU), Korea</ … Read More → "ISQED Addresses System and Intellectual Property (IP) Design Challenges – Offers Free Exhibit"

HDR Video Camera Development Kit and Evaluation Reference Design Now Available For LatticeECP3 FPGA Family

February 22, 2011

HILLSBORO, OR -FEBRUARY 22, 2011-Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the release of the Lattice HDR-60 Video Camera Development Kit, a production-ready High Definition (HD) video camera development system based on the LatticeECP3™ FPGA family. Pre-loaded with a plug and play evaluation Image Signal Processing (ISP) pipeline based on Intellectual Property (IP) Cores from Lattice partner Helion GmbH, the Kit works right out of the box. The IP is capable of delivering 1080p performance at 60 frames per second with 2D noise reduction and High Dynamic Range (HDR). Designed with a form factor to … Read More → "HDR Video Camera Development Kit and Evaluation Reference Design Now Available For LatticeECP3 FPGA Family"

Digi-Key Corporation Expands Product Line with TT electronics

February 22, 2011

Tuesday, February 22, 2011 – THIEF RIVER FALLS, Minnesota, USA –Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation Expands Product Line with TT electronics"

Second Generation High Voltage Battery Stack Monitor Advances Hybrid/Electric Vehicle Battery Management Systems

February 22, 2011

MILPITAS, CA – February 22, 2011 – Linear Technology announces the LTC®6803, a second generation high voltage battery monitor for hybrid/electric vehicle (HEVs), electric vehicles (EVs) and other high voltage, high performance battery systems. The LTC6803 is a complete battery measuring IC that includes a 12-bit ADC, a precision voltage reference, a high voltage … Read More → "Second Generation High Voltage Battery Stack Monitor Advances Hybrid/Electric Vehicle Battery Management Systems"

S2C to Exhibit at DVCon

February 22, 2011

Who/What

S2C Inc. will be demonstrating its rapid SoC/ASIC prototyping system in booth 1003 at DVCon. S2C supports both Altera and Xilinx flows and is used in designing leading-edge SoCs and ASICs. The system includes TAI Logic Modules, TAI Player Pro Software, and a broad array of Prototype ReadyTM IP, accessories, and platforms.

Synopsys Announces Immediate Availability of Silicon-Proven DesignWare Data Converter IP in SMIC 65-nm LL Process Technology

February 22, 2011

MOUNTAIN VIEW, Calif., Feb. 22, 2011 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced the immediate availability of the silicon-proven DesignWare™ Data Converter IP for SMIC’s popular 65-nanometer (nm) Low Leakage (LL) process technology, enabling designers to improve their chips’ power efficiency and ease their integration efforts. Synopsys is the first IP provider to offer a comprehensive portfolio of high-performance data converter IP solutions consisting of analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) in this high density, low leakage process technology. The DesignWare Data Converter IP is … Read More → "Synopsys Announces Immediate Availability of Silicon-Proven DesignWare Data Converter IP in SMIC 65-nm LL Process Technology"

Swissbit announces INDUSTRIAL 2GB & 4GB DDR3 SODIMMs with Heat Spreader and / or Conformal Coating

February 21, 2011

Bronschhofen, Switzerland – February 21, 2011 – Swissbit announces new variations of its INDUSTRIAL family of DDR3 SODIMMs. In order to increase the heat dissipation and to avoid thermal hot spots on the memory modules in systems with difficult cooling, Swissbit can add an aluminum heat spreader to the existing portfolio of DDR3 SODIMMs. The dual sided heat spreader is attached with a thermally conductive tape and increases the heat dissipating area, thus reducing the critical high case temperatures which otherwise might lead to failing bits. … Read More → "Swissbit announces INDUSTRIAL 2GB & 4GB DDR3 SODIMMs with Heat Spreader and / or Conformal Coating"

RFMD® Unveils Power Platform for Entry-Level 3G Handsets

February 21, 2011

Barcelona, Spain, February 14, 2011 — RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced the expansion of the Company’s 3G product portfolio to include a complete power platform for entry-level 3G handsets. The RF323x power platform, comprised of the RF323x and RF72xx product families, provides handset manufacturers a complete reference design for the implementation of multi-region multimode 3G handset platforms.