News – Page 2121 – EEJournal

Mentor Graphics Helps CamSemi Replace Design and Verification Flow to Improve Simulation Performance and Time to Market

March 10, 2011

WILSONVILLE, Ore., March 9, 2011—Mentor Graphics Corp. (NASDAQ: MENT) today announced that it assisted CamSemi in replacing their integrated circuit (IC) design and verification flow with Mentor tools to improve simulation performance and time to market. Cambridge-based CamSemi is a global leader in the development and supply of power management ICs for more energy-efficient, low-cost power supplies and lighting. Working with Mentor Graphics, CamSemi was able to replace a design and verification flow from a major supplier with the Mentor^® Read More → "Mentor Graphics Helps CamSemi Replace Design and Verification Flow to Improve Simulation Performance and Time to Market"

Artila Releases Linux-ready ARM9 CAN Bus Box Computer

March 10, 2011

TAIPEI, Taiwan — March 2011 — Artila Electronics, the leading designer and manufacturer of Linux-ready ARM9 industrial PC, is proud to release Matrix-522 Industrial Linux-ready ARM9 CAN Bus Box Computer, the new design of its ARM9 box computer selection. Its CAN Bus interface supports CANopen protocols for target markets such as industrial automation, transportation, vehicles, and building automation.

Matrix-522, the new design of Linux-ready ARM9 industrial box computer, is powered by an ATMEL AT91SAM9G20 400MHz ARM9 CPU, and also equipped with 64MB SDRAM and 128MB NAND Flash memory. In addition, the Matrix-522 integrates two isolated CAN … Read More → "Artila Releases Linux-ready ARM9 CAN Bus Box Computer"

Mentor Graphics Introduces Calibre RealTime for Instant Signoff Verification of Custom IC Designs

March 10, 2011

WILSONVILLE, Ore., March 10, 2011—Mentor Graphics Corporation (NASDAQ: MENT) today announced the new Calibre® RealTime platform for signoff-quality physical verification during design creation. The first release provides instantaneous design rule checking (DRC) in the SpringSoft Laker™ custom IC design and layout solution, using the same Calibre decks as the signoff flow. The new solution improves design speed and quality of results by giving designers, for the first time, the full power of Calibre’s signoff engines and qualified decks during design. This allows them to optimize their layouts for performance without sacrificing manufacturing yield. A version … Read More → "Mentor Graphics Introduces Calibre RealTime for Instant Signoff Verification of Custom IC Designs"

GDA (L&T Infotech) Pravega SuperSpeed USB (USB 3.0) IP Receives USB-IF Certification

March 10, 2011

SAN JOSE, Calif., March 10, 2011 /PRNewswire/ — GDA Technologies, Inc. (an L&T Infotech Company), a leading Silicon Intellectual Property (SIP) solution provider for the embedded, networking, and consumer electronics markets, announced today that its Pravega SuperSpeed USB 3.0 Dual Mode Controller IP successfully passed the USB Implementers Forum (USB-IF) SuperSpeed USB certification for device mode. The IP achieved this certification by passing compliance, interoperability and Gold Suite tests at the USB Implementers Forum’s test lab. The Pravega SuperSpeed USB 3.0 Dual Mode Controller IP’s architecture is carefully tailored to optimize link utilization, latency, reliability, power consumption and silicon footprint … Read More → "GDA (L&T Infotech) Pravega SuperSpeed USB (USB 3.0) IP Receives USB-IF Certification"

Microsemi Announces Comprehensive Solar Technology Portfolio

March 9, 2011

IRVINE, Calif., March 09, 2011 — Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor technology aimed at building a smart, secure, connected world, today announced the immediate availability of its solar technology portfolio. Microsemi’s products for renewable energy applications include SmartFusionTM and IGLOO® FPGAs; analog, mixed signal devices such as bypass diodes/switches, MOSFETs, FREDs and IGBTs; DC-DC converters, and pulse width modulation (PWM) modules. The extensive portfolio enables the efficient, reliable and cost-sensitive implementation of the entire range of photovoltaic (PV) applications, including power harvesting, power management, power switching and power monitoring.

“As PV designers … Read More → "Microsemi Announces Comprehensive Solar Technology Portfolio"

Dual Output Synchronous Step-Down DC/DC Controller with Excellent Channel-to-Channel Current Sharing Boosting Power & Reliability

March 9, 2011

MILPITAS, CA – March 9, 2011 – Linear Technology Corporation introduces the LTC3869/-2, a dual output high efficiency (up to 95%) synchronous step-down DC/DC controller with well balanced current sharing between channels when paralleled. This controller can maintain better than +/-4% current mismatch between channels during steady state and transient conditions when both … Read More → "Dual Output Synchronous Step-Down DC/DC Controller with Excellent Channel-to-Channel Current Sharing Boosting Power & Reliability"

High Reliability DC Link Power Film Capacitors Ideal for Power Inverter Applications

March 9, 2011

Fairview, PA – March 9, 2011 – Spectrum Advanced Specialty Products now offers DC link power film capacitors with voltage ratings up to 1300 VDC. Due to harsh operating conditions of wind and photovoltaic installations, components used in power inverter applications require superior life expectancy. Spectrum’ … Read More → "High Reliability DC Link Power Film Capacitors Ideal for Power Inverter Applications"

Tekdata adds dynamic 3D modelling to interconnect design capabilities

March 9, 2011

Tekdata Interconnections has invested in SolidWorks® 3D CAD tools to support ongoing expansion of its specialist design services for complex wiring and mechanical assemblies.

“We chose SolidWorks for its advanced modelling capabilities, including extensions for 3D wire routing,” commented Terry McManus, CTO/Design Centre Manager at Tekdata. “It is the ideal tool for designing with innovative wiring technologies, such as our Computaweave® “branching” cable system, and will help our engineers visualise complex interconnect … Read More → "Tekdata adds dynamic 3D modelling to interconnect design capabilities"

Renesas Electronics Introduces New Third Generation USB 3.0 Host Controllers with Industry-Leading Transfer Speed and Low Power Consumption

March 9, 2011

Dusseldorf, 9th March 2011 – Renesas Electronics, a premier provider of advanced semiconductor solutions, today announced the availability of its two new SuperSpeed Universal Serial Bus (USB 3.0) xHCI host controllers (part number, μPD720201 and μPD720202) for electronic devices such as PCs and digital TVs that feature faster effective data transfer speeds and reduced power consumption in low power mode.

The μPD720201 and μPD720202 devices make it easier for system designers to build electronic devices combining high-speed data … Read More → "Renesas Electronics Introduces New Third Generation USB 3.0 Host Controllers with Industry-Leading Transfer Speed and Low Power Consumption"

SMX® RTOS Now Available to Ease Development on AM1x Sitara™ ARM® Microprocessors from Texas Instruments

March 9, 2011

Costa Mesa, California, March 8, 2011 — Micro Digital, Inc. is pleased to offer out-of-the-box SMX^® real-time operating system (RTOS) support for the AM18x and AM17x Sitara™ ARM9™ microprocessors (MPUs) from Texas Instruments Inc. (TI). This new SMX RTOS support allows developers to get their projects off to a quick start with the middleware and drivers needed for many of the on-chip peripherals, as well as an exceptional graphical debug tool that helps programmers to solve problems quickly. Developers also benefit from extensive error-checking and diagnostics in the software.

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