News – Page 2115 – EEJournal

MIPS Technologies Launches New Developer Community

April 14, 2011

SUNNYVALE, Calif. – April 14, 2011 – MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, today announced the launch of its new Developer Community at Developer.mips.com. The new site, which is live now, is specifically tailored to the needs of software developers working with the Android™ platform, Linux operating system and other applications for MIPS-Based™ hardware. All information and resources on the site are openly accessible.

“This new community demonstrates our … Read More → "MIPS Technologies Launches New Developer Community"

SiliconBlue to Present Smartphone Application Processor Companion Chips at Linley Tech Mobile Conference

April 14, 2011

SANTA CLARA, Calif.– SiliconBlue® Technologies, the leader in Custom Mobile Device™ solutions for handheld applications, today announced that Denny Steele, Vice President, Solutions Marketing, will present “Smartphone Application Processor Companion Chips” at the Inaugural Linley Tech Mobile Conference being held April 19-20 in San Jose, CA. His discussion will focus on Sensor and Connectivity Management including I2C and SPI interface functions in next generation smartphones. (For more information, please go to Read More →

EMA and Cadence Extend Channel Partner Contract To Sell Complete Line of PCB Design Tools

April 13, 2011

Rochester, NY (April 13, 2011) – EMA Design Automation™ (www.ema-eda.com), a full-service provider of mechanical and electrical CAD tools, today announced the extension of its Channel Partner Contract with Cadence® Design Systems. This extension allows EMA to sell and support the full Cadence Allegro® and OrCAD® product lines.

“Our customers’ needs vary greatly, from simple schematic capture requirements to complex front to back PCB design needs,” said Manny Marcano, president and CEO of EMA. “Cadence PCB products, along with … Read More → "EMA and Cadence Extend Channel Partner Contract To Sell Complete Line of PCB Design Tools"

Tektronix Enhances Popular Performance Oscilloscopes to Test More, Faster

April 13, 2011

BEAVERTON, Ore., April 12, 2011 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced two new versions of its performance oscilloscope families ranging from 500 MHz to 8 GHz designed to help embedded system design engineers troubleshoot their designs faster than ever before. The new offerings include the DPO7000C Series and new 4-, 6- and 8-GHz models in the MSO/DPO/DSA70000C Series. The company also announced its expanded support for MIPI testing with new serial decode solutions for Read More → "Tektronix Enhances Popular Performance Oscilloscopes to Test More, Faster"

Acrosser Fan-less telematics in vehicle computer uses Intel Atom D425/D525

April 13, 2011

Utilizing the in vehicle computer with Telematics technology in a commercial environment vehicle can be a power tool to improve the organization efficiency. Some applications of vehicle telematics include fleet management, vehicle/trailer tracking, satellite navigation, mobile data, wireless vehicle communication, vehicle safety warning system and intelligent vehicle.

The industrial computer manufacturer Acrosser Technology designs a series of in vehicle computers for telematics applications. Today Acrosser launches his latest Telematics In Vehicle Computer AR-V6002FL after his success in booming telematics market.

AR-V6002FL fanless In-Vehicle computer is based on Intel Atom D425/ … Read More → "Acrosser Fan-less telematics in vehicle computer uses Intel Atom D425/D525"

Advantech selects Innovasic Semiconductor’s RapID Platform for New EtherNet/IP I/O Modules

April 13, 2011

Albuquerque, New Mexico, April 2011 – Innovasic Semiconductor is pleased to announce that Advantech has selected the Innovasic RapID Platform and fido1100 System-on-a-Chip (SoC) solution to provide EtherNet/IP connectivity in their new ADAM-6100 series of real-time Ethernet I/O modules for factory automation.

“Innovasic’s fido1100-based RapID Platform for Industrial Ethernet enables customers to quickly and cost-effectively get new products to market,” said Jordon Woods, Innovasic CTO. “By utilizing the flexible architecture and programmability of the platform, customers can rapidly release a series of compatible industrial Ethernet products,& … Read More → "Advantech selects Innovasic Semiconductor’s RapID Platform for New EtherNet/IP I/O Modules"

TEWS TECHNOLOGIES Introduces Extended Temperature and High-Density Isolated Serial Communication PMC Module

April 13, 2011

Halstenbek, Germany – April 13th, 2011. TEWS TECHNOLOGIES extends its tradition of delivering high-density I/O solutions with its introduction of the TPMC377 high-density Isolated Serial Communication Controller. The conduction cooled single-width 32-bit PMC module is ideal for applications in transportation, COTS, communications, and process control.

The TPMC377 can operate with 3.3V and 5.0V PCI I/O signaling voltage. It provides 4 channels of high performance RS232/RS422/RS485 selectable serial connectivity with P14 I/O. Each of the serial channels are isolated from … Read More → "TEWS TECHNOLOGIES Introduces Extended Temperature and High-Density Isolated Serial Communication PMC Module"

Laird Technologies Releases New WTS2333C-FRSMM WiMAX External Wireless Dipole Antenna

April 13, 2011

St. Louis, Missouri, USA – April 12, 2011 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new WTS2333C-FRSMM WiMAX external wireless dipole antenna.

Specifically designed for portable devices, this rugged external wireless antenna operates in the 2.3 to 2.7 GHz and 3.3 to 3.9 GHz frequency bands with a max gain of 2.3 to 2.7 dBi. The antenna offers an omnidirectional radiation … Read More → "Laird Technologies Releases New WTS2333C-FRSMM WiMAX External Wireless Dipole Antenna"

GENIVI Alliance Announces Accenture, DENSO and Mobis As its Newest Members

April 13, 2011

SAN RAMON, Calif., April 13, 2011 /PRNewswire-USNewswire/ — The GENIVI Alliance, an automotive and consumer electronics industry association driving the development and adoption of an open In-vehicle Infotainment (IVI) reference platform, today announced the continued expansion of its membership with key new companies Accenture, DENSO Corporation and Mobis.

Accenture is a global management consulting, technology services and outsourcing company, with approximately 215,000 people serving clients in more than 120 countries. Accenture is developing a range of innovative offerings that combine automotive industry and mobility services expertise to transform original equipment manufacturers.

DENSO Corporation, headquartered in Kariya, Aichi prefecture, … Read More → "GENIVI Alliance Announces Accenture, DENSO and Mobis As its Newest Members"

Digi-Key Corporation Announces the Expansion of Cornell Dubilier’s Snap-In Product Line

April 13, 2011

Wednesday, April 13, 2011 – THIEF RIVER FALLS, Minnesota, USA – Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation Announces the Expansion of Cornell Dubilier’s Snap-In Product Line"

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