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48th Design Automation Conference Announces Keynote Speakers

LOUISVILLE, Colo. –– April 25, 2011 – Industry luminaries from Apple/ Fusion-IO, Freescale Semiconductor, Intel, and IBM will give keynotes at the 48th Design Automation Conference (DAC). DAC 2011, the premier conference devoted to design and design automation of electronic systems, will be held at the San Diego Convention Center in San Diego, California, from June 5-10, 2011.

“In … Read More → "48th Design Automation Conference Announces Keynote Speakers"

New Cadence Allegro Technology Boosts Productivity and Predictability for Silicon, SoC and System Developers

SAN JOSE, Calif., 25 Apr 2011 – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today introduced the latest version of its Allegro PCB and IC packaging technology, delivering new capabilities that provide a significant increase in both productivity and predictability across silicon, SoC and system development. New technologies include advanced miniaturization capabilities, uniquely integrated power delivery network analysis, DDR3 design-in kit, bolstered co-design features, and flexible team-design enablement to address global designer productivity. The company also announced that the Allegro 16.5 technology will be available through product configuration that enables users to access advanced features on-demand … Read More → "New Cadence Allegro Technology Boosts Productivity and Predictability for Silicon, SoC and System Developers"

AMD Embedded G-Series Platform Gets Real-Time Operating System Support From Express Logic

SUNNYVALE, CA–(Marketwire – Apr 25, 2011) – AMD (NYSE: AMD) today announced embedded software provider Express Logic has brought its industry-leading ThreadX real-time operating system (RTOS) to the AMD Embedded G-Series platform. The AMD Embedded G-Series Accelerated Processing Unit (APU) offers an advanced, low-power, multi-core x86 CPU and a discrete-class DirectX® 11-capable GPU on a single, small-footprint die. This family of APUs was … Read More → "AMD Embedded G-Series Platform Gets Real-Time Operating System Support From Express Logic"

Pentek’s New High Channel Count Software Radio Module Targets Toughest Radar, UAV and Communication Apps

  • 8-fold increase in channel count delivers 32 digital down converters
  • Four 200 MHz 16-bit ADCs, plus sophisticated gating and triggering modes
  • x8 PCI Express interface with four DMA controller channels
  • Virtex-6 FPGA supports user customization with GateFlow Design Kit 

UPPER SADDLE RIVER, NJ– … Read More → "Pentek’s New High Channel Count Software Radio Module Targets Toughest Radar, UAV and Communication Apps"

ADLINK Technology Introduces High-Speed 200 MS/s 14-Bit PCI Express Digitizer

Friday April 22, 2011, San Jose, CA – ADLINK Technology Inc, a leading provider of test and measurement products and platforms, announced the release of the PCIe-9842, their PCI Express digitizer providing an impressive 200 MS/s sampling rate of 14 bits of data across one channel. The PCIe-9842 is specifically designed … Read More → "ADLINK Technology Introduces High-Speed 200 MS/s 14-Bit PCI Express Digitizer"

Future Electronics and ADD semiconductor extend distribution agreement to global franchise

Zaragoza, Spain, and Dallas, Texas, 20 April 2011 – Future Electronics and ADD semiconductor, the high-performance powerline communication (PLC) IC company for smart metering, lighting, and home/building automation applications, today announced that both companies have extended their agreement for distribution of ADD’s powerline communication SoCs to a global franchise.

ADD specializes in the design of system-on-chip (SoC) PLC solutions for narrow band communications using the low voltage electric grid transmission medium that turns the existing electric grid into a reliable and easy-to-use ‘smart … Read More → "Future Electronics and ADD semiconductor extend distribution agreement to global franchise"

Mercury Computer Systems Announces Strategic Agreement with CommAgility

CHELMSFORD, Mass. – April 21, 2011 – Mercury Computer Systems, Inc., (NASDAQ: MRCY, www.mc.com), a trusted ISR application-ready subsystems (ARS) provider, and CommAgility announced that they have reached a strategic agreement enabling Mercury to leverage market-leading technology to develop best-in-class application-ready subsystems for commercial and military communications, and wireless infrastructure systems. This agreement will allow Mercury to incorporate CommAgility and jointly-developed products into its existing platforms and to quickly generate new solutions that exploit the latest Texas Instruments’ (TI) Digital Signal Processing (DSP) technology, providing … Read More → "Mercury Computer Systems Announces Strategic Agreement with CommAgility"

Curtiss-Wright Controls Debuts Quad Channel 250 MSPS 16-bit Analog Input FMC

HIGH WYCOMBE, UK– April 21, 2011 — Curtiss-Wright Controls Embedded Computing (CWCEC), a business group of Curtiss-Wright Controls and a leading designer and manufacturer of commercial off-the-shelf (COTS) VME, VPX, VXS, and CompactPCI products for the aerospace and defense market, has introduced a new rugged FPGA Mezzanine Card (FMC/VITA 57) module, the FMC-516 is a quad channel 250 MSPS 16-bit analog input card that enables I/O devices to be directly coupled to a host FPGA. By providing direct ADC connection to the host FPGA, this compact card ensures maximum throughput and enables multiple channels and boards to be synchronized. The … Read More → "Curtiss-Wright Controls Debuts Quad Channel 250 MSPS 16-bit Analog Input FMC"

Laird Technologies Releases New Tpcm™ 580SP Series Screen Printable Phase Change Material

St. Louis, Missouri, USA – April 21, 2011– Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new Tpcm™ 580SP Series phase change material.

The Tpcm™ 580SP Series is the latest phase change material (PCM) offered in Laird Technologies’ thermal interface material (TIM) product … Read More → "Laird Technologies Releases New Tpcm™ 580SP Series Screen Printable Phase Change Material"

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