News – Page 2100 – EEJournal

Acrosser Launches Green network Security Platform with 8 x Giga bps LAN ports and RAID Function.

May 9, 2011

ACROSSER Technology, a world-leading networking communication designer and manufacturer, launches AR-R5800 networking platforms based on Intel Core 2 Quad/Duo cores processor. They feature a 1U rack mount chassis, maximum 4GB DDR3 memory, 8 x GbE LAN ports, 2 x LAN bypass, PCI expansion slot, 4 x USB ports, 2 x SATA HDD and console port.

AR-R5800 is a rack mount platform (440x372x44mm), which can be installed in the 19” rack. It carries Intel Core 2 Quad-core or Dual-core or Pentium or Celeron processors to deliver more … Read More → "Acrosser Launches Green network Security Platform with 8 x Giga bps LAN ports and RAID Function."

Connect Android Apps to Any Platform, Anywhere with ORBexpress® for Android™

May 9, 2011

HERNDON, VA – May 9, 2011 – Solving the problem of Android™ apps communicating with other devices, application developers can now use ORBexpress to connect their Android apps to any platform, anywhere, announced Objective Interface Systems, Inc. (OIS). Developers also solve the Android device fragmentation problem by using a standard interface on all platforms. ORBexpress for Android provides an easy-to-use communication protocol for connecting disparate systems. OIS is the world’s leading provider of high-performance communications middleware solutions.

As the popularity of mobile platforms increases, software developers are … Read More → "Connect Android Apps to Any Platform, Anywhere with ORBexpress® for Android™"

IEEE’s Council on EDA to Host DAC Lunch Presentation on Truths and Myths of Embedded Computing

May 9, 2011

NEW YORK –– May 5, 2011 –– Shekhar Borkar, director of Intel’s Microprocessor Technology Lab, will present a talk during the 48th Design Automation Conference (DAC) titled, “Truths and Myths of Embedded Computing,” as part of the IEEE Council on Electronic Design Automation (CEDA) Distinguished Speaker Series.

The talk will be held during lunch Tuesday, June 7, from noon-2 p.m. in Room #25AB at the San Diego Convention Center, San Diego, Calif. Organized by Dwight Hill, principal engineer at Synopsys, it is open to all DAC attendees on a … Read More → "IEEE’s Council on EDA to Host DAC Lunch Presentation on Truths and Myths of Embedded Computing"

D-Tools, Inc. Announces 2011 “PROJECT: Success” Design Awards Contest Call for Entries

May 9, 2011

CONCORD, CA— MAY 06, 2010 — D-Tools, Inc., the worldwide leader in system integration software, today announced call for entries for their annual contest PROJECT: Success Design Awards. D-Tools is pursuing SI5.5 user’s greatest success stories and project designs that display how the software has positively affected their business and ROI. Winning success stories submitted by some of most distinguished System Integrators will be selected from the D-Tools user base. The contest is sponsored by D-Tools MVP Partners Atlantic … Read More → "D-Tools, Inc. Announces 2011 “PROJECT: Success” Design Awards Contest Call for Entries"

Power Modules with Additional Low Inductive Current Path

May 9, 2011

May 6th 2011 – Parasitic inductances are a major problem with power modules, in particular in fast switching applications. The parasitic inductance of the component interconnections causes an overvoltage condition and increases the switch-off losses in the semiconductor. Many initiatives have been investigated to reduce the parasitic inductance in power modules utilizing a complex mechanical construction of overlapping internal bus bars forming the DC path.

The first results of the new idea to separate the current paths into a static low resistive screw contact and in a transient low inductive PCB-based connection are promising. The limit for … Read More → "Power Modules with Additional Low Inductive Current Path"

New Transistors for 22 Nanometer Chips Have an Unprecedented Combination of Power Savings and Performance Gains

May 9, 2011

SANTA CLARA, Calif., May 4, 2011 – Intel Corporation today announced a significant breakthrough in the evolution of the transistor, the microscopic building block of modern electronics. For the first time since the invention of silicon transistors over 50 years ago, transistors using a three-dimensional structure will be put into high-volume manufacturing. Intel will introduce a revolutionary 3-D transistor design called Tri-Gate, first disclosed by Intel in 2002, into high-volume manufacturing at the 22-nanometer (nm) node in an Intel chip codenamed “Ivy Bridge.” A nanometer is one-billionth of a meter.

The three-dimensional Tri-Gate transistors represent a … Read More → "New Transistors for 22 Nanometer Chips Have an Unprecedented Combination of Power Savings and Performance Gains"

LDRA Implements Homeland Security’s Secure Programming Guidelines

May 6, 2011

San Bruno, CA, May 3, 2011. LDRA, the leading provider of automated software verification, source code analysis, and test tools, has achieved Common Weakness Enumeration (CWE) Compatibility for the LDRA tool suite. The CWE project aims to better understand flaws in software … Read More → "LDRA Implements Homeland Security’s Secure Programming Guidelines"

Realtek Semiconductor Corp. Selects Forte’s SystemC High-Level Synthesis, Floating Point IP Software for SoC Design

May 6, 2011

SAN JOSE, CALIF. –– May 5, 2011 –– Realtek Semiconductor Corp. of Hsinchu, Taiwan, has selected high-level synthesis (HLS) software and floating point intellectual property (IP) from Forte Design Systems™ for the design and development of systems on chip (SoCs) for communications network, computer peripheral and multimedia applications.

Forte’s Cynthesizer™ SystemC high-level synthesis software and CellMath™ were purchased after a thorough evaluation because they improved overall quality of results (QoR) and turnaround time ( … Read More → "Realtek Semiconductor Corp. Selects Forte’s SystemC High-Level Synthesis, Floating Point IP Software for SoC Design"

Neonode announces collaboration with Texas Instruments enabling next-generation touch screen devices

May 6, 2011

SANTA CLARA, Calif. – May 3, 2011 – Neonode, Inc. (NEON.OB), a leading optical touch screen technology company, today announced a collaboration with Texas Instruments Incorporated (TI) to further develop and improve the functionality, performance and cost advantage of zForce^®, Neonode’s patented optical touch screen technology.

Neonode and TI are working together on several commercial projects which use TI’s series of ultra-low-power MSP430™ microcontrollers. By further co-development of zForce^® and TI’s 16-bit microcontrollers, OEM’s can touch enable any surface at a low cost, independent … Read More → "Neonode announces collaboration with Texas Instruments enabling next-generation touch screen devices"

Expansion Modules Address SBC Form Factor Fragmentation

May 6, 2011

San Jose, Calif. — May 2, 2011 — Diamond Systems Corporation, a leading global supplier of compact, rugged, embedded computing solutions for real-world applications in a broad range of markets, today unveiled a new family of I/O expansion modules for systems based on single-board computers (SBCs) that expand using either PCI/104-Express, PC/104-Plus, or SUMIT-ISM. The modules implement identical analog and digital I/O feature-sets on all three formats, letting companies choose their favorite expansion format now, while reserving the option of migrating to an alternate format in the future without major rework … Read More → "Expansion Modules Address SBC Form Factor Fragmentation"

featured blogs

Understanding Concurrent Multiprotocol: An In-Depth Exploration

Dec 19, 2024

Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....