Tuesday, May 31, 2011 – THIEF RIVER FALLS, Minnesota, USA – Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation and Lattice Semiconductor Announce Global Distribution Agreement"
May 31, 2011—Foster City, CA and Phoenix, AZ—IAR Systems® and ON Semiconductor today announced that IAR Systems integrated development environment has been chosen as the tool chain for ON Semiconductor’s new Q32M210 precision mixed-signal microcontroller for portable sensing applications. The KickStart edition of IAR Embedded Workbench® for ARM® was selected for its ability to provide an effective integrated development environment for building and debugging Q32M210 applications.
In addition to IAR Embedded Workbench, the ON Semiconductor development kit includes a hardware board and easy-to-use software with firmware libraries and … Read More → "IAR Embedded Workbench Selected by ON Semiconductor for its new Q32M210 Precision Mixed-Signal Microcontroller Development Kit"
Computex, Taipei, Taiwan, May 31, 2011- Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller and touch technology solutions, today announced that the Atmel SAM9G45 and SAM9M10 ARM®-based products will support the Android™ operating system (OS) for applications in consumer, industrial and computing markets. Based on the 32 … Read More → "Atmel ARM9-based Products Support Android OS"
SAN JOSE, Calif., May 31, 2011– Magma® Design Automation Inc. (Nasdaq:LAVA), a provider of chip design software, today announced that Magma’s Talus®, Hydra™, Tekton™, QCP™ and Quartz™ DRC integrated circuit (IC) implementation and verification solutions have been qualified to support the TSMC Reference Flow 12.0. Through TSMC’s Open Innovation Platform (OIP), Magma’s product suite provides users with advanced features to address the challenges of 28-nanometer (nm) design.
“Magma and TSMC have already worked closely to support … Read More → "Magma’s Talus IC Implementation System Supports TSMC 28-nm Process Technology through Reference Flow 12.0"
SANTA CLARA, CA – May 26, 2011 — Calypto® Design Systems, Inc., the leader in sequential analysis technology, today announced version 5.0 of its PowerPro®Platform, a full suite of RTL power optimizationtools proven to reduce power by up to 60 percent on multi-million gate designs. The PowerPro Platform features new RTL power analysis capabilities, production-proven optimization techniques for reducing dynamic and leakage power in the logic, memory, and embedded processor sections of an SoC, and is the only solution that provides sequential formal equivalence checking.
Version 5.0 of the PowerPro Platform improves turnaround time by 2X … Read More → "Calypto Launches Industry’s Most Advanced RTL Power Optimization Platform"
May 23, 2011, Farmington Hills, Michigan, USA – Kistler (www.kistler.com), a worldwide supplier of precision sensors, systems and instrumentation for the dynamic measurement of pressure, force, torque and acceleration, has introduced CoMo Injection Firmware software version 2.2.3, designed for greater functionality and enhanced zero-defect process monitoring capabilities within supported automotive, medical, electrical and two-shot injection molding operations.
Developed in response to customer demand and with direct compatibility to Kistler CoMo Injection versions 2869A and 2869B, version 2.2.3 firmware software includes real-time curve display … Read More → "New Kistler CoMo Injection Firmware Software Version 2.2.3 Offers Enhanced Real-Time Injection Molding Data Analysis Capabilities"
MOUNTAIN VIEW, CA –May 31, 2011 – Nimbic (formerly Physware) today announced the open beta launch of nCloud, the world’s first scalable and secure cloud computing platform for electronic design automation (EDA). Effective immediately, nWave, the leading 3D full-wave EM solver for signal and power integrity (formerly PhysWAVE), and nApex, the leading 3D accelerated parasitic extractor (formerly PhysAPEX), are available on nCloud.
Cavium Networks (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for networking, communications, and the digital home, announced today the collaboration with Caswell, Inc., a leader in design and manufacturing of high performance communication appliance and storage solutions, to deliver Multi-Motherboard Blade Servers (MMBS) powered by a massive array of OCTEON® processors for energy efficient cloud computing applications. This high computing throughout is delivered using up to 10 systems in a server rack, with each system consisting of a 4U … Read More → "Caswell & Cavium Collaborate to Deliver Breakthrough Energy Efficient Servers With Massive OCTEON(R) Processor Arrays for Cloud Computing"
San Jose, California – May 31, 2011 – CoFluent Design, a leading Electronic System Level (ESL) company that provides system-level modeling and simulation to accelerate innovation in embedded devices, today announced the new v4.0 major release of its flagship product, CoFluent Studio.
System designers use CoFluent Studio for hardware/software system modeling and simulation in consumer, communication, transportation and industrial electronics. CoFluent Studio generates SystemC code from graphics described either in standard UML/SysML or in CoFluent domain-specific language.
CoFluent Studio translates graphical diagrams into SystemC for hardware modeling and … Read More → "CoFluent Design Announces CoFluent Studio Version 4 For Accelerated Creation And Integration Of SystemC TLM Models"
BOISE, Idaho, 2011-05-26 06:15 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc., (Nasdaq:MU) today announced that early engineering samples are available for its third-generation reduced latency DRAM (RLDRAM 3 memory). RLDRAM 3 is a high-bandwidth memory technology that enables a more efficient transfer of information across the network. Designed for high-performance networking applications, including high-end routers and switches that require back-to-back READ/WRITE operations or completely random access, RLDRAM 3 memory is an ideal choice for 40 Gigabit Ethernet (GbE) and 100 GbE designs, packet buffering and inspection, and lookup tables. Additionally, RLDRAM 3 memory offers significant improvements in speed, density, latency and power consumption. & … Read More → "Micron Announces Sample Availability for Its Third-Generation RLDRAM(R) Memory"
