News – Page 2085 – EEJournal

CoFluent Design Announces CoFluent Studio Version 4 For Accelerated Creation And Integration Of SystemC TLM Models

May 31, 2011

San Jose, California – May 31, 2011 – CoFluent Design, a leading Electronic System Level (ESL) company that provides system-level modeling and simulation to accelerate innovation in embedded devices, today announced the new v4.0 major release of its flagship product, CoFluent Studio.

System designers use CoFluent Studio for hardware/software system modeling and simulation in consumer, communication, transportation and industrial electronics. CoFluent Studio generates SystemC code from graphics described either in standard UML/SysML or in CoFluent domain-specific language.

CoFluent Studio translates graphical diagrams into SystemC for hardware modeling and … Read More → "CoFluent Design Announces CoFluent Studio Version 4 For Accelerated Creation And Integration Of SystemC TLM Models"

Micron Announces Sample Availability for Its Third-Generation RLDRAM(R) Memory

May 30, 2011

BOISE, Idaho, 2011-05-26 06:15 CEST (GLOBE NEWSWIRE) — Micron Technology, Inc., (Nasdaq:MU) today announced that early engineering samples are available for its third-generation reduced latency DRAM (RLDRAM 3 memory). RLDRAM 3 is a high-bandwidth memory technology that enables a more efficient transfer of information across the network. Designed for high-performance networking applications, including high-end routers and switches that require back-to-back READ/WRITE operations or completely random access, RLDRAM 3 memory is an ideal choice for 40 Gigabit Ethernet (GbE) and 100 GbE designs, packet buffering and inspection, and lookup tables. Additionally, RLDRAM 3 memory offers significant improvements in speed, density, latency and power consumption. & … Read More → "Micron Announces Sample Availability for Its Third-Generation RLDRAM(R) Memory"

Imec extends 3D research agreement with Qualcomm focusing on advanced technologies and devices

May 30, 2011

Leuven, Belgium – May 25, 2011 – imec today announced their continued research arrangement with Qualcomm Incorporated on 3D technology which broadens the collaboration with Qualcomm participating in imec’s INSITE program focusing on designing with advanced technologies. This extended collaboration gives Qualcomm early insight on the system design impact of 3D and advanced process technologies including device structures, interconnects and lithography for the sub-20nm node.

Since 2008, Qualcomm has participated in the imec industrial affiliation program (IIAP) on 3D integration providing Qualcomm early access to new 3D technologies for its future wireless … Read More → "Imec extends 3D research agreement with Qualcomm focusing on advanced technologies and devices"

austriamicrosystems announces aggressive plan to be 100% carbon neutral by 2015

May 30, 2011

Unterpremstaetten, Austria (May 30, 2011) – austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog semiconductors,today announced ambitious plans to reach full carbon neutrality by 2015 and become the first semiconductor manufacturer worldwide to do so. In its aggressive, ongoing efforts to be environmentally responsible, austriamicrosystems has been actively reducing its carbon footprint since 2004, achieving a reduction of 50% of CO₂ equivalents or 31,000 tons until 2010 since implementing actions. Over the last two years austriamicrosystems has completely mapped the CO₂ generation of all company activities … Read More → "austriamicrosystems announces aggressive plan to be 100% carbon neutral by 2015"

Linaro partners with Samsung ecosystem to deliver exciting new low cost board ‘Origen’ to Open Source developers

May 30, 2011

TAIPEI, TAIWAN – May 30, 2011 – Linaro welcomes the news that developers will be able to buy low cost, high performance ‘Origen’ development boards using Samsung’s Exynos 4210 chipset, and run free open source software and tools that have been optimized by Linaro.

Software developers now have low cost access to the high performance Exynos mobile computing platform that packs features such as the latest multi-core Cortex-A9 CPU and multi-core Mali400 GPU, with 1GB of high end DDR3 memory. This board will be popular with developers of tablets, smartphones and other connected screens where leading edge performance, … Read More → "Linaro partners with Samsung ecosystem to deliver exciting new low cost board ‘Origen’ to Open Source developers"

Digi-Key Corporation Announces Stock of the Arduino Prototyping Platform

May 30, 2011

Friday, May 27, 2011 – THIEF RIVER FALLS, Minnesota, USA– Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation Announces Stock of the Arduino Prototyping Platform"

Management Day at the 48th DAC: Decision-making at the Cutting Edge of Business and Technology

May 30, 2011

LOUISVILLE, Colo. – May 27, 2011 – The rubber meets the road at the intersection of high-performance Systems-on-Chip design and the adoption of emerging technologies. Management Day at the 48^th Design Automation Conference (DAC) provides engineering and business managers with essential information to make the right decisions at the intersection of business and technology.

Read More → "Management Day at the 48th DAC: Decision-making at the Cutting Edge of Business and Technology"

IPM (Intelligent Power Module) – a solution for compact motor drive applications?

May 27, 2011

May 27th 2011 – Power electronics for application embedded motor drives need to be compact and to have good thermal characteristics. Different IPM (intelligent power module) concepts are competing with different sets of features to be the best solution.

Higher integration and more complex subsystems are some of the current mega trends in power electronics. Very popular are Intelligent Power Modules (IPM) for motor drive applications. They are a combination of power semiconductors like IGBTs, MOSFETs and diodes with peripheral components like driver circuits. If a whole subsystem has a good match to an application, an IPM can … Read More → "IPM (Intelligent Power Module) – a solution for compact motor drive applications?"

Imec welcomes NVIDIA as fabless partner in its advanced CMOS scaling program

May 27, 2011

Leuven, Belgium – May 25, 2011 – NVIDIA, a world-leader in visual computing technologies, signed a 3-year research collaboration agreement with imec on advanced CMOS scaling. By joining imec’s core CMOS program as INSITE member, NVIDIA will get early insight in the impact of future process and design technology options on its next-generation products.

NVIDIA joins the growing fabless community of imec’s core CMOS program. The collaboration focuses on the system design impact of advanced devices, interconnect, including 3D, and lithography implications for the sub-20nm node.

Imec INSITE makes … Read More → "Imec welcomes NVIDIA as fabless partner in its advanced CMOS scaling program"

TI spins out eight new motor drivers for stepper, brushed DC motors

May 27, 2011

DALLAS (May 24, 2011) – Texas Instruments Incorporated (TI) (NYSE:TXN) today expanded its DRV8x motor driver family with eight new devices supporting up to 5 A for higher-current bipolar stepper and brushed DC motors. The new DRV8x motor drivers provide RDSon as low as 100 milliohms, more than 60 percent less than the previous generation, enabling higher current and better thermal performance. Microstepping options within the family include up to 256 microsteps and greater with an external microcontroller or up to 32 microsteps with an on-chip indexer. For more information or to place an order, visit Read More → "TI spins out eight new motor drivers for stepper, brushed DC motors"

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