News – Page 2074 – EEJournal

TI re-architects embedded control to make the world greener with new Concerto™ dual-core microcontrollers

June 14, 2011

HOUSTON, TX (June 14, 2011) – Empowering developers to design greener, more connected applications, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced its new C2000™ Concerto dual-core microcontroller (MCU) series. The new Concerto 32-bit microcontrollers combine TI’s class-leading-performance C28x core and control peripherals with an ARM Cortex-M3 core and connectivity peripherals to deliver a clearly partitioned architecture that supports real-time control and advanced connectivity in a single, cost-efficient device. To make them easy to use, Concerto MCUs are supported by an intuitive software infrastructure as well as application and connectivity libraries within controlSUITE™ software. The series … Read More → "TI re-architects embedded control to make the world greener with new Concerto™ dual-core microcontrollers"

Methodics unveils next generation SoC Management Platform™ to improve consistency, efficiency, quality of SoC realization methodologies

June 13, 2011

San Diego, Calif. – June 6, 2011 – Targeting the escalating design data and IP management issues related to advanced system on chip (SoC) design, Methodics LLC, today announced the latest version of its SoC Management Platform solution. The standards-based solution, which is easily integrated into IC design environments, is geared toward improving both enterprise-level collaboration and management, while also increasing individual productivity and efficiency when dealing with the complexity of modern SoC design methodologies and IP use. The result is higher quality SoC design, lower development and infrastructure/IT … Read More → "Methodics unveils next generation SoC Management Platform™ to improve consistency, efficiency, quality of SoC realization methodologies"

NASA Grants 4DSP License for Sensing Technology

June 13, 2011

June 6, 2011, Austin, TX, USA – 4DSP LLC announced today that it has licensed a signal processing technology from NASA that overcomes the inherent limitation found when deploying a certain type of fiber optic sensing systems. The emergence of fiber optics sensors in recent years has seen a number of applications embrace this novel way of characterizing the environment in harsh conditions. Engineers have however been confronted with severe processing-speed limitations that prevented the technology … Read More → "NASA Grants 4DSP License for Sensing Technology"

MIPS Technologies and SiS Continue to Drive Android™ into the Digital Home

June 13, 2011

SUNNYVALE, Calif. and HSINCHU, Taiwan – June 6, 2011 – MIPS Technologies, Inc. (NASDAQ: MIPS), a leading provider of industry-standard processor architectures and cores for digital home, networking and mobile applications, and Taiwan’s Silicon Integrated Systems Corp. (SiS) announced their latest milestones in driving the Android™ platform into the digital home. The companies collaborated to deliver an optimized Android solution on SiS’ new MIPS-Based™ integrated internet TV platform, which is available now. SiS has also licensed the new superscalar multiprocessing MIPS32® 1074Kf™ Coherent Processing System (CPS) for next generation designs.

S2C Announces a Breakthrough Verification Module

June 13, 2011

San Jose, CA – June 6, 2011 – S2C Inc., a leading rapid SoC/ASIC prototyping solutions provider, announced that they have developed the TAI Verification Module (patent pending), a prototype verification product that allows user designs in FPGA-based prototypes to be verified with massive and fast test benchs through a x4 PCIe Gen2 channel to the PC. The Altera Stratix-4 GX FPGA-based TAI Verification Module has integrated Altera SignalTap Logic Analyzer with S2C’s TAI Player software enabling concurrent debugging of multi-FPGA design using the RTL names. This innovative technology … Read More → "S2C Announces a Breakthrough Verification Module"

Jasper to Release First of Its Kind System-Level-Verification IP (VIP) for ARM ACE-based SoCs

June 13, 2011

Mountain View, CA, June 07, 2011. Jasper Design Automation, the leading provider of verification solutions based on formal technology, today announced the availability of its suite of system-level VIP for AMBA 4 ACE-based SoCs. The VIP is the first of its kind for the ACE specification and was a direct result of the tight collaboration between ARM and Jasper for validating the quality and robustness of the specification.

“Our goal was to support a specification … Read More → "Jasper to Release First of Its Kind System-Level-Verification IP (VIP) for ARM ACE-based SoCs"

Lattice and Flexibilis Announce First FPGA Ethernet Switch IP Cores With HSR (IEC 62439-3) Protocol Support

June 13, 2011

HILLSBORO, OR – JUNE 13, 2011 – Lattice Semiconductor Corporation (NASDAQ: LSCC) and Flexibilis Oy today announced the immediate availability of the Flexibilis Ethernet Switch (FES) IP cores. The triple speed (10Mbps/100Mbps/1Gbps) FES IP cores operate on Ethernet Layer 2 and … Read More → "Lattice and Flexibilis Announce First FPGA Ethernet Switch IP Cores With HSR (IEC 62439-3) Protocol Support"

Green Hills Software to Present and Exhibit at Freescale Technology Forum 2011 in San Antonio

June 13, 2011

SANTA BARBARA, CA — June 13, 2011 — Green Hills Software, the largest independent vendor of embedded software solutions, will deliver technology presentations at the Freescale Technology Forum, San Antonio, TX, June 20 – 23, 2011. Green Hills Software will also demonstrate its latest embedded software solutions.

Green Hills Software speaker presentations include:

Topic: Advanced Compiler Optimizations for the Smallest, Fastest Code
When: Tuesday, June 21, 2011, 10:30 am — 11:30 am
Where: Grand Oaks Ballroom D
Who: Greg Davis, Director, Engineering Compilers: Green Hills Software
Track: Enabling Technologies; Market Segment: Tools

Synopsis:
This talk will survey some … Read More → "Green Hills Software to Present and Exhibit at Freescale Technology Forum 2011 in San Antonio"

austriamicrosystems introduces the AS5410 absolute linear position sensor IC as first product of 3D Hall platform

June 13, 2011

Unterpremstaetten, Austria & Rosemont, Illinois (June 6, 2011) – austriamicrosystems (SIX: AMS), a leading global designer and manufacturer of high-performance analog ICs, has introduced the AS5410 linear position sensor, the first product of the world’s first fully-featured 3D Hall platform. The unique 3D Hall sensor solution senses absolute position in automotive & industrial applications and provides the highest resolution position information available. The sensor solution is being demonstrated during the 2011 edition of the Sensors Expo & Conference in Rosemont, Illinois, booth #621.

Isolated Forward Converter Integrated Circuits Specified over -55°C to 125°C Junction Temperature Range

June 13, 2011

MILPITAS, CA – June 13, 2011 – Linear Technology Corporation announces the high reliability (MP-grade) version of the LT1952/-1, Read More → "Isolated Forward Converter Integrated Circuits Specified over -55°C to 125°C Junction Temperature Range"