News – Page 2070 – EEJournal

NEC LCD Technologies and Renesas Electronics Europe Announce Availability of Two New 7.2-inch 3D Displays for Use in Industrial Display Applications

May 20, 2011

Dusseldorf, 20^th May 2011 – NEC LCD Technologies Ltd, (NLT), together with Renesas Electronics Europe, its sales and marketing channel in Europe, today announced the introduction of two new 7.2-inch 3D colour thin film transistor (AM-TFT) LCD modules for industrial display applications, the NL8060BH18-01 and NL8060BH18-02. The modules incorporate NLT’s proprietary HDDP (horizontally double-density pixels) technology and are targeted for use in a variety of industrial applications such as 3D CAD/CAM, technical/user manuals, broadcasting, mapping and … Read More → "NEC LCD Technologies and Renesas Electronics Europe Announce Availability of Two New 7.2-inch 3D Displays for Use in Industrial Display Applications"

Accellera Shares Electronic Design Standards Information at the Design Automation Conference; Events Focus on UVM, IP-XACT and IP Tagging

May 20, 2011

San Diego, CA – Accellera, the electronics industry organization focused on electronic design automation (EDA) standards, invites Design Automation Conference (DAC) attendees, to several Accellera and DAC events:

On Sunday, DAC will hold a Universal Verification Methodology (UVM™) Workshop.
On Tuesday, Accellera and its members, Cadence, Mentor and Synopsys, will host a UVM User … Read More → "Accellera Shares Electronic Design Standards Information at the Design Automation Conference; Events Focus on UVM, IP-XACT and IP Tagging"

Real Intent Highlights Latest Technology for Advanced Sign-Off Verification at DAC 2011

May 20, 2011

San Diego, CA – May 19, 2011 – Real Intent Inc., the leading provider of software products that accelerate Advanced Sign-Off Verificationof electronic designs, today announced it will highlight its latest technology and proven solutions at this year’s 48^th Design Automation Conference (DAC) in San Diego, California, June 6-8, 2011. Real Intent will feature its Ascent™ XV solution, the industry’s first and only solution for comprehensive X-verification and sign-off. Ascent … Read More → "Real Intent Highlights Latest Technology for Advanced Sign-Off Verification at DAC 2011"

Tektronix, Fluke Scholarship Program at DeVry University Awards 20 Students

May 19, 2011

BEAVERTON, Ore., and EVERETT, Wash., May 11, 2011 – Tektronix, Inc. and Fluke Corporation today announced that 20 DeVry University students have each received $1,000 scholarships in the name of the two companies. The 2011 awards are the first under a $100,000 donation by Tektronix and Fluke for a five-year scholarship program to the DeVry University Education Fund to help create opportunities for engineering students.

The 20 scholarship recipients were selected from more than 125 applicants and come from across the … Read More → "Tektronix, Fluke Scholarship Program at DeVry University Awards 20 Students"

Green Hills Software Brings Latest Multicore Security and Reliability to Military & Aerospace Seminars

May 19, 2011

SANTA BARBARA, CA — May 16, 2011 —Green Hills Software, the proven worldwide leader in FAA/EASA- and NSA-certified high-assurance operating systems, is presenting and demonstrating its leading multicore military and aerospace products in a seminar series with Freescale Semiconductor and other industry leaders. Green Hills will showcase its unique multicore secure virtualization, multi-level high-assurance real-time operating systems (RTOS), certification expertise and award-winning multicore development tools that deliver unprecedented multicore safety and security while reducing development costs for military and aerospace systems developers.

The seminars are scheduled for Los Angeles, CA (May 18), Dallas, TX (June 1), Huntsville, AL (June 8) … Read More → "Green Hills Software Brings Latest Multicore Security and Reliability to Military & Aerospace Seminars"

Renesas Electronics Announces Digital Ambient Illuminance Sensor with Industry-Leading Compact and Thin SON Package

May 19, 2011

Dusseldorf, 16th May 2011 – Renesas Electronics , a premier supplier of advanced semiconductor solutions, today announced the availability of the digital ambient illuminance sensor, the PH5551A2NA1, with an industry-leading compact and thin package. The PH5551A2NA1 device is the company’s first entry into the market for ambient illuminance sensors and incorporates Renesas Electronics’ technology expertise accumulated in the development and commercialization of photo detector IC products for CD, DVD, and BD players, a product category where Renesas Electronics enjoys … Read More → "Renesas Electronics Announces Digital Ambient Illuminance Sensor with Industry-Leading Compact and Thin SON Package"

WD® Launches Industry’s Largest Capacity 3 TB SATA Hard Drives for AV Platforms

May 19, 2011

IRVINE, Calif., May 16, 2011 /PRNewswire/ — Western Digital® (NYSE: WDC), a leader in the desktop, mobile, high-capacity enterprise and consumer markets for hard drives, today announced the addition of 2.5 TB and 3 TB versions to its family of WD AV-GP SATA hard drives, serving the audio-video (AV) market. Shipping immediately, the 2.5 TB and 3 TB capacity, 3.5-inch, WD AV-GP hard drives offer 24X7 reliability, low power consumption and unrivalled storage capacity for storage-intensive AV applications … Read More → "WD® Launches Industry’s Largest Capacity 3 TB SATA Hard Drives for AV Platforms"

Conductive coatings combine high shielding performance and ease of application to allow use of plastic enclosures for sensitive electronics equipment

May 19, 2011

Chomerics Europe – a division of Parker Hannifin has introduced two new electrically conductive acrylic coatings that are designed for application onto plastic housings to provide EMI / RFI shielding. CHO-SHIELD^® 2040 is silver-filled material that provides superior shielding performance of > 75 dB and CHO-SHIELD^® 2044 uses a nickel filler to achieve > 60 dB shielding effectiveness (both between 80 MHz and 10 GHz).

< … Read More →

Curtiss-Wright Controls Electronic Systems Debuts Forced Air Conduction-Cooled Development Chassis for 3U OpenVPX® Modules

May 19, 2011

LITTLETON, MA – May 18, 2011 — Curtiss-Wright Controls Electronic Systems (CWCES), a business group of Curtiss-Wright Controls and a leading designer and manufacturer of rugged deployed subsystems for the aerospace, defense and commercial market, has introduced a new 12-slot 3U OpenVPX^® forced air conduction-cooled chassis for the development of military embedded systems. The RME9CC Chassis is the newest member of Electronic Systems’ Hybricon^{®</ … Read More → "Curtiss-Wright Controls Electronic Systems Debuts Forced Air Conduction-Cooled Development Chassis for 3U OpenVPX® Modules"}

Silicon Frontline Announces First Commercial 3D Hierarchical Extractor

May 19, 2011

Campbell, CA, May 18, 2011 – Silicon Frontline Technology, Inc. (SFT), an Electronic Design Automation (EDA) company, in the post-layout verification market focused on solutions for nanometer design applications, announced today that it is introducing the industry’s first commercial hierarchical 3D extractor, H3D, for post-layout verification. H3D offers hierarchical parasitic extraction, hierarchical netlisting, unlimited capacity, and field-solver accuracy. H3D works with design flows from the leading EDA suppliers.

“Post-layout verification is a major bottleneck in today’s leading edge designs,” … Read More → "Silicon Frontline Announces First Commercial 3D Hierarchical Extractor"