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StarChip® Introduces Its SCM Family of SIM Controllers Addressing the M2M Markets

MEYREUIL, June 21st, 2011- StarChip®, today announced the availability of its new SCM family of secure SIM controllers addressing M2M markets. The SCM controller family is based on Cortus APS3s 32-bit core enabling 20Mips@20MHz across an extended range of temperatures (-40°C to +105°C). A powerful combination of flexibility and extended performance with large data retention (>25years) and best-in-class endurance (up to 2 billion cycles) have been implemented to deliver a robust design suitable for harsh environments.

SCM members (SCM320G and SCM288G) are fully flash-based, code and data … Read More → "StarChip® Introduces Its SCM Family of SIM Controllers Addressing the M2M Markets"

LDRA Slashes Time and Cost of Certifying HC08/HCS08 to Stringent Avionics, Medical and Automotive Standards

Wirral, UK, 22 June 2011. LDRA, the leader in standards compliance, automated software verification, source code analysis and test tools, delivers full certification capabilities for Freescale’s HC08 and HCS08 applications. By exploiting the resources of the Read More → "LDRA Slashes Time and Cost of Certifying HC08/HCS08 to Stringent Avionics, Medical and Automotive Standards"

Green Hills Software Expands Platform for Industrial Safety

SAN ANTONIO, TX — June, 22, 2011 — FREESCALE TECHNOLOGY FORUM — Green Hills Software, the largest independent vendor of embedded software solutions, has partnered with KW Software, an internationally leading provider of solutions and technologies in the field of industrial control and safety technology, and Molex, a provider of complete interconnect solutions, to add new software integrations to its Platform for Industrial Safety. The Platform includes a complete set of development tools, a wide variety of middleware, industrial communications protocols, and services built around the IEC 61508 SIL 3-certified Green Hills INTEGRITY® real-time operating system (RTOS). These new partner integrations … Read More → "Green Hills Software Expands Platform for Industrial Safety"

Renesas Electronics Expands EMMA Family Lineup with Set-Top Box SoCs Supporting 3D Broadcasts and Internet-Based Content

Dusseldorf, 21st June 2011 –  Renesas Electronics  , a premier provider of advanced semiconductor solutions, today announced the availability of its new system-on-chip (SoC) for set-top boxes (STBs), the EMMA™3SE/P, which supports the video standards used for digital television broadcasts worldwide and a wide variety of video formats required … Read More → "Renesas Electronics Expands EMMA Family Lineup with Set-Top Box SoCs Supporting 3D Broadcasts and Internet-Based Content"

Tilera Unveils the Ultimate Cloud Computing Processor; Slashing Power Consumption and Footprint by 80 Percent

SAN FRANCISCO – June 21, 2011 – STRUCTURE 2011:

  • Co-developed with the world’s leading cloud computing companies
  • Slashes power by 80 percent, each core consuming <0.5 watts
  • High performance 64-bit processors with 36, 64 or 100 cores @ 1.5 G

Tilera® Corporation, the leader in manycore general purpose < … Read More → "Tilera Unveils the Ultimate Cloud Computing Processor; Slashing Power Consumption and Footprint by 80 Percent"

Ultra compact 15-40 Watt power supplies with PCB or chassis mount options

XP Power announced today two additions to its range of ultra compact high power density AC-DC power supplies. New products include the introduction of the encapsulated single output ECE series, and multiple output models of the existing ECL family.

The ECE20 are encapsulated PCB mount 20 Watt devices, measuring just 1.07 x 2.06 x 0.91 inches (27.7 x 52.4 x 23.0 mm), while the ECE40 units measure only 1.50 x 3.10 x 1.10 inches (38.1 x 78.7 x 27.9 mm) and have up to 40 Watts output. The ECE40 are also encapsulated and are available in either a PCB mount version, or chassis mount package with screw terminals. Both the ECE20 … Read More → "Ultra compact 15-40 Watt power supplies with PCB or chassis mount options"

AT&T and Option introduce 4G connection kit for Emerging Device Developers

LEUVEN, Belgium – June 21, 2011 – AT&T* and Option (Euronext: OPTI; OTC: OPNVY), the wireless technology company, today announced a new AT&T Connection Kit for emerging device developers, the first featuring a 4G (HSPA+) module. The industry leading AT&T Connection Kit program provides the tools and environment necessary to streamline device development and optimize performance on the AT&T network.  

The newest connection kit leverages Option’s LGA module GTM601and will help … Read More → "AT&T and Option introduce 4G connection kit for Emerging Device Developers"

EMA Updates Training for New OrCAD 16.5 Release

Rochester, NY (June 21, 2011) – EMA Design Automation™ (www.ema-eda.com), a full-service provider of mechanical and electrical CAD tools, today announced the availability of Cadence® OrCAD® 16.5 training to educate users on the robust features available in this new version. This training is meant to ensure that customers are getting the most value out of their PCB tools. The knowledge gained in the EMA training helps designers become more efficient and productive, which leads to a shorter design cycle and … Read More → "EMA Updates Training for New OrCAD 16.5 Release"

SiliconGear Designs Spartan-6 FPGAs into Latest Generation High-Definition Video Security Surveillance & Video Display Platform

SAN JOSE, Calif., June 21, 2011 – Xilinx, Inc. (NASDAQ: XLNX) today announced that SiliconGear has designed Xilinx’s Spartan®-6 field programmable gate array (FPGA) into its latest generation high-definition (HD) video security and video display platform.

SiliconGear is a leading supplier of FPGA and system-on-a-chip (SoC) platforms for manufacturers of low-cost, high-performance HD-serial digital interface (SDI) digital video … Read More → "SiliconGear Designs Spartan-6 FPGAs into Latest Generation High-Definition Video Security Surveillance & Video Display Platform"

Microsemi Expands Support for Designers Developing Next-generation High-voltage, High-power RF Generators

IRVINE, Calif., June 21, 2011 – Microsemi Corporation (Nasdaq:MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a design guide for developing next-generation high-voltage, high-power systems based on the company’s unique digital radio frequency (DRF) family of hybrid modules. These systems are used in applications including semiconductor processing, LCD glass coating, solar cell manufacturing, optical device and architectural glass coating, hazardous gas treatment, CO2 laser excitation, MRI RF amplifiers, RF scalpels and induction heating systems.

The modules combine RF driver ICs and power MOSFETs in a single, high-performance package capable of … Read More → "Microsemi Expands Support for Designers Developing Next-generation High-voltage, High-power RF Generators"

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