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Crossing Automation Extends 450mm Product Portfolio

Fremont, Calif. – November 1, 2011 – Crossing Automation, Inc. (www.crossinginc.com), a leading designer and manufacturer of fab and tool automation products used by today’s foremost semiconductor device and equipment companies, today introduced the Crossing Spartan™ 450mm Development Platform  and Crossing Certon™ 450 Loadport. The company has received orders for both products from leading original equipment manufacturers (OEMs). The Loadports are expected to ship in December, with the Development Platform shipping in the first quarter of 2012.

“There is no question that 450mm … Read More → "Crossing Automation Extends 450mm Product Portfolio"

VIA Brings Fanless Dual Core Computing and USB 3.0 to Thin Embedded Devices

Taipei, Taiwan, November 2, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest Em-ITX form factor board, the VIA EITX-3002, which combines rich I/O with outstanding multimedia capabilities. Partnered with the new VIA AMOS-5002 industrial chassis kit, the VIA EITX-3002 provides the ideal solution for a wide range of durable and fanless next generation devices in medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications. 

The VIA EITX-3002 combines the VIA VX900 … Read More → "VIA Brings Fanless Dual Core Computing and USB 3.0 to Thin Embedded Devices"

CommAgility AMC provides high quality RF interface for LTE and LTE Advanced wireless applications

CommAgility announced today the AMC-RF2x2, a wideband, highly flexible dual channel RF card in the AdvancedMC format. The new card provides a high quality RF interface for LTE and LTE Advanced wireless infrastructure applications, and is suitable for test equipment, research, demonstrators and trial systems.

The AMC provides a flexible FPGA-based architecture based on a Xilinx LX75T Virtex-6TM device, with separate RF modules allowing customisation. The integrated firmware in the FPGA is used for control and IQ data processing, delivering the necessary performance for … Read More → "CommAgility AMC provides high quality RF interface for LTE and LTE Advanced wireless applications"

Microsemi Unveils Revolutionary Driver for LED Street Light Fixtures

ALISO VIEJO, Calif.–Nov.02, 2011–Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today unveiled a new LED driver designed specifically for North American street light installations. The efficient LXMG221D-0700040-D2F(TM) LED driver eliminates bulky step-down transformers typically used in street light fixtures in these markets, providing a single-step conversion from 347VAC or 480VAC down to less than 57VDC as typically required by LED fixtures. This allows manufacturers to design lighter fixtures, which can lower product development and transportation costs. Unique features include integrated fault detection and management … Read More → "Microsemi Unveils Revolutionary Driver for LED Street Light Fixtures"

AIS-SART Processor IC – The Future of Marine Search and Rescue

CML Microcircuits, (www.cmlmicro.com) has announced the launch of the new cutting-edge Marine AIS Search and Rescue Transmitter (SART) processor, the CMX7045.

The CMX7045 is a highly integrated and flexible baseband processor fulfilling the needs of an AIS-SART and meeting IEC 61097-14 requirements. In addition to providing the core AIS-SART formatted data functionality, the CMX7045 incorporates a number of auxiliary operations that assist in the overall system implementation and therefore reduce component count and cost.

Read More → "AIS-SART Processor IC – The Future of Marine Search and Rescue"

smxFFS v2 Released

Costa Mesa, California, November 2, 2011 — Micro Digital, Inc. is pleased to announce the release of smxFFS™ v2. It has been completely redesigned to use very little RAM, yet support very large flash devices, up to 256TB. It is suitable for small SoCs with only on-chip memories. Its RAM footprint is only 2KB, plus 2KB per open file (for 512 byte sector or page size), and does not depend on flash size. Its ROM requirement is also small, only 20KB for the whole API. The design has a few reasonable limitations to achieve this … Read More → "smxFFS v2 Released"

Xilinx ISE Design Suite 13.3 Full Custom Precision Floating-Point Support Extends Productivity for DSP Designers

SAN JOSE, Calif., Nov. 1, 2011 – Xilinx, Inc. (NASDAQ: XLNX) today announced the availability of ISE® Design Suite 13.3 featuring new capabilities for DSP designers to easily implement bit-accurate single, double and full custom precision floating-point math operations in their designs targeting wireless, medical, aerospace and defense, high-performance computing and video applications. This flow is available through System Generator for DSP and leverages the Xilinx Floating-Point Operator IP … Read More → "Xilinx ISE Design Suite 13.3 Full Custom Precision Floating-Point Support Extends Productivity for DSP Designers"

CommAgility Demonstrates Interoperability Of AMC-2C6670 Card With MTI Remote Radio Head and Xilinx CPRI Core

CommAgility announced today that it has successfully completed interoperability testing of its AMC-2C6670 AMC (Advanced Mezzanine Card) with a MTI Remote Radio Head (RRH) equipped with CPRI (Common Public Radio Interface), as well as with a Xilinx CPRI IP core.

The interoperability tests were carried out using the AIF2 interface of high performance TMS320C6670 and TMS320TCI6618 digital signal processors (DSPs) from Texas Instruments Incorporated (TI) running on the AMC-2C6670. To test with a Xilinx CPRI core, an additional AMC-V6 module from CommAgility was used with an optical SFP+ interface.

Tests were … Read More → "CommAgility Demonstrates Interoperability Of AMC-2C6670 Card With MTI Remote Radio Head and Xilinx CPRI Core"

X-FAB Extends 0.18 Micrometer Technology Platform to Address Energy Efficiency Applications

Erfurt, Germany – Nov. 1, 2011 – X-FAB Silicon Foundries today announced the new technology platform XP018, its latest foundry process with the industry’s lowest mask count for the modular combination of digital, analog and high-voltage features with embedded Flash. This unique foundry offering for energy-efficient applications is the first to allow system-on-chip (SoC) integration requiring up to 60V operating voltage and 5V power supply to be combined with embedded non-volatile memory (NVM). It enables a new generation of reliable and efficient power management, digital control and other … Read More → "X-FAB Extends 0.18 Micrometer Technology Platform to Address Energy Efficiency Applications"

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