News – Page 2062 – EEJournal

ZMDI ZSSC3008 Sensor Signal Conditioner IC for Automotive, Industrial Automation and White Goods Applications

July 7, 2011

Dresden, Germany – July 7, 2011 — ZMD AG, a global supplier of energy-efficient analog and mixed-signal solutions for automotive, industrial, and medical applications, has introduced the ZSSC3008 sensor signal conditioning integrated circuit (IC). The ZSSC3008 is a cost-effective solution for resistive bridge sensor systems that require second-order linearity correction for a wide range of sensors.

“Customers using the ZSSC3008 benefit from its non-linear compensation feature for improved accuracy” says Steve Ramdin, ZMDI product manager. “This compensation feature, for example, makes it possible to use less expensive transducers, providing customers in industrial, medical … Read More → "ZMDI ZSSC3008 Sensor Signal Conditioner IC for Automotive, Industrial Automation and White Goods Applications"

60V Current Sense Amplifier Offers Adjustable Fault Flags

July 7, 2011

MILPITAS, CA – July 6, 2011 – Linear Technology announces the LT6109, a complete high side current sense device that incorporates a current sense amplifier, dual comparators and a precision 400mV voltage reference. When connected to a current shunt resistor, the high side current sense amplifier precisely extracts the shunt voltage, amplifies it, and translates it to … Read More → "60V Current Sense Amplifier Offers Adjustable Fault Flags"

Xilinx ISE Design Suite 13.2 Steps up Designer Productivity and Brings Partial Reconfiguration to Kintex-7, Virtex-7 FPGAs

July 6, 2011

SAN JOSE, Calif., July 6, 2011 – Xilinx, Inc. (NASDAQ: XLNX) today released ISE® Design Suite 13.2, providing support for the 28nm 7 series families including the recently arrived Virtex®-7 VX485T device being demonstrated to customers. In addition, this latest edition of ISE Design Suite provides an up to 25 percent performance increase in designs targeting Virtex-7 2000T devices, the industry’s largest density FPGAs built using Stacked Silicon Interconnect technology. The latest ISE software release also has enhancements to the PlanAhead™ design and analysis tool,providing partial reconfiguration support for Virtex-7 and Kintex& … Read More → "Xilinx ISE Design Suite 13.2 Steps up Designer Productivity and Brings Partial Reconfiguration to Kintex-7, Virtex-7 FPGAs"

Pickering Interfaces Expands Range of Fault Insertion PXI Modules

July 6, 2011

Clacton on Sea, UK, July 5^th 2011 –Pickering Interfaces is expanding its range of PXI Fault Insertion solutions with the introduction of the 40-197 and the 40-198. Fault Insertion (FI) modules are used within an Automatic Test System to simulate common fault conditions such as an open, short to ground or a short to other connections in a device under test.

The 40-197 provides up to 34 fault insertion channels that can be connected … Read More → "Pickering Interfaces Expands Range of Fault Insertion PXI Modules"

Cortus APS3 Processor at the Heart of PointChips Touch Screen Controller Chip

July 6, 2011

July 6th 2011 – PointChips, a South Korean company, has included the Cortus APS3 32 bit processor in their touch screen controller chip. The APS3 provides the processing power to translate the signals received from the sensors on a touch sensitive surface into information that can be used by a smart phone or tablet. The APS3 processor, running custom software written by experts at PointChips, enhances the user experience of smart phone and tablet users with sophisticated features such as advanced gesture recognition and enhanced precision to ensure easy and reliable operation.

Mass-market proximity sensing and security is available now with finalization of Bluetooth low energy Find Me and Proximity profiles

July 6, 2011

The ability to find missing keys and smartphones, or alarm and securely lock almost any portable device that is separated from its owner, will be just the start of a new wave of proximity-based wireless sensing applications that the newly adopted Bluetooth low energy Find Me and Proximity profiles will allow as part of the latest Bluetooth v4.0 spec

Oslo, Norway – JUL 5, 2011 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that the Bluetooth SIG’s recent finalization of its Bluetooth low energy Find Me and Proximity … Read More → "Mass-market proximity sensing and security is available now with finalization of Bluetooth low energy Find Me and Proximity profiles"

Baolab uses its NanoEMS technology to create ultra-low cost 3D Digital MEMS Compasses in CMOS

July 6, 2011

Barcelona, Spain – 5 July 2011. Until now, 3D Compasses have typically used non-standard technologies such as magneto-resistive materials or Hall-effect structures combined with magnetic field concentrators to detect the direction of the Earth’s magnetic field. Baolab Microsystems is first to design a pure CMOS Lorentz force MEMS sensor and, as a result, its new 3D Digital NanoCompass™ matches performance benchmarks for sensitivity, power consumption and package size, but at a dramatically lower cost. An additional unique feature resulting from this integration is that the device auto-calibrates to maintain consistent accuracy.

CEVA Enhances its CEVA-XC DSP Product Offering With HSPA+ Software IP

July 6, 2011

MOUNTAIN VIEW, Calif. – July 06, 2011 – CEVA, Inc. [(NASDAQ: CEVA); (LSE: CVA)], the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of fully optimized HSPA+ software libraries for the CEVA-XC DSP. The addition of these new libraries to the CEVA-XC Software-Defined Radio (SDR) reference architecture enables the implementation of a software-based multimode HSPA/HSPA+/LTE/LTE-A solution. Support for HSPA and HSPA+ is essential to provide mandatory backward 3G compatibility for mobile applications.

Read More → "CEVA Enhances its CEVA-XC DSP Product Offering With HSPA+ Software IP"

Ramtron Samples 64-Kilobit Serial F-RAM Memory

July 6, 2011

COLORADO SPRINGS, CO – July 6, 2011 – Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of ferroelectric-based low-power memory and integrated semiconductor products, today announced broad sampling of its newest ferroelectric random access memory (F-RAM) product built on the company’s manufacturing line at IBM Corporation (NYSE: IBM). The FM24C64C is a 64-Kilobit (Kb), 5-volt serial F-RAM device that performs at bus speed without write delays, and supports up to one-trillion (1e12) read/write cycles – a million times more than a comparable EEPROM device. The FM24C64C offers low power operation with 100 & … Read More → "Ramtron Samples 64-Kilobit Serial F-RAM Memory"

Tektronix Acquires Veridae Systems, Inc.

July 6, 2011

Beaverton, OR, July 5, 2011 – Tektronix, Inc., a leading supplier of test, measurement, and monitoring products and solutions, today announced the acquisition of Veridae Systems, Inc. The details of the transaction were not disclosed.

Founded in 2009 to commercialize research from the University of British Columbia, Veridae delivers three leading products for ASIC/FPGA prototyping debug, ASIC post silicon validation and FPGA-based system product validation into leading semiconductor and system product companies. These products are the first on the market to deliver a systematic “design for validation” approach as well as key features … Read More → "Tektronix Acquires Veridae Systems, Inc."

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