News – Page 2060 – EEJournal

Imec demonstrates 3D integrated DRAM-on-logic for low-power mobile applications

July 11, 2011

Leuven, Belgium – July 11, 2011 – Imec and its 3D integration partners have proven the potential of 3D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec’s applied 3D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3D stacked ICs.

The 3D stack resembles as close as possible to future commercial chips. It consists of imec’s … Read More → "Imec demonstrates 3D integrated DRAM-on-logic for low-power mobile applications"

Temperature-to-Voltage Converter Measures Remote Diodes with 1°C Accuracy

July 11, 2011

MILPITAS, CA – July 11, 2011 – Linear Technology Corporation introduces the LTC2997, a high accuracy temperature-to-voltage converter with built-in series resistance cancellation for 2.5V to 5.5V systems. Many low voltage systems today rely on temperature to assess overall system health and reliability. Traditional implementations require a series of filters, a precise reference and a current source, resulting in … Read More → "Temperature-to-Voltage Converter Measures Remote Diodes with 1°C Accuracy"

Synopsys Leads the Way in Delivering Dual-Patterning-Compliant 20nm IC Implementation Support

July 11, 2011

?MOUNTAIN VIEW, Calif., July 11, 2011—Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design and manufacturing, today announced IC Compiler-Advanced Geometry, a new configuration of its market-leading IC Compiler physical design product. IC Compiler-Advanced Geometry targets design support for double-patterning technology (DPT), which has emerged as a key requirement for the next generation of silicon technology at 20 nanometers (nm) and imposes strict constraints on placement, routing and physical verification. As industry leaders in IC design and manufacturing race to prepare for 20nm technology, Synopsys has successfully collaborated with foundry partners as well as major … Read More → "Synopsys Leads the Way in Delivering Dual-Patterning-Compliant 20nm IC Implementation Support"

Synopsys and GLOBALFOUNDRIES Collaborate to Deliver Interoperable Process Design Kits (iPDKs)

July 11, 2011

MOUNTAIN VIEW, Calif., July 11, 2011–Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that it has collaborated with GLOBALFOUNDRIES to jointly develop, validate, support and distribute interoperable process design kits (iPDKs) for GLOBALFOUNDRIES’ mainstream and advanced process technologies. The GLOBALFOUNDRIES 65-nanometer (nm) iPDKs are available now with additional iPDKs planned for delivery later in 2011. The iPDKs have been fully validated with Synopsys’ custom design solution, including the Galaxy Custom Designer® tool, HSPICE® circuit simulator, CustomSim™ circuit simulator, IC Validator physical verification tool and StarRC™ extraction tool.

Avnet Memec signs distribution agreement expanding relationship with Microsemi Corporation

July 11, 2011

Poing, Germany, July 11, 2011 – Avnet Memec today announced that it has expanded its component distribution agreement with Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance. Avnet Memec will sell and support Microsemi’s full range of power, RF, analogue and mixed-signal devices throughout all European territories.

“Avnet Memec has successfully supported and designed-in components including Microsemi’s award-winning SmartFusion™ FPGAs for many years,” said Steve Haynes, President Avnet Memec EMEA. “Expanding our agreement with Microsemi enables us … Read More → "Avnet Memec signs distribution agreement expanding relationship with Microsemi Corporation"

Toumaz Limited Announces Joint Venture For Newly Approved Sensium™ “Digital Plaster”

July 11, 2011

Abingdon, United Kingdom, 11th July 2011 – Toumaz Limited (AIM: TMZ,), a pioneer in low cost, ultra-low power wireless communications and broadcast technology, has established a new joint venture with Dr. Patrick Soon-Shiong’s company California Capital Equity LLC (‘CCE’), to expand the commercialisation and distribution of the Sensium™ Digital Plaster. The joint venture, which is named “Toumaz US LLC”, will be headquartered in San Diego, California, and will sell and distribute the Sensium™ Digital Plaster in North America and Worldwide.

Toumaz Limited is also pleased to announce that … Read More → "Toumaz Limited Announces Joint Venture For Newly Approved Sensium™ “Digital Plaster”"

IAR Systems launches starter kit for NXP’s LPC11U00 USB microcontroller series

July 11, 2011

Uppsala, Sweden—July 11, 2011— IAR Systems today announced that an IAR KickStart Kit for the LPC11U00 series of microcontrollers is now available. It is a low cost starter kit for evaluation and for designing and prototyping software applications. The kit includes an LPC11U14 evaluation board fitted with an LPC11U14 microcontroller, a USB connector, an LCD, and various other peripherals, a J-Link Lite debug probe, software tools, example projects and board support packages for various RTOSes.

The LPC11U00 series of microcontrollers provides low cost 32-bit replacement for 8 … Read More → "IAR Systems launches starter kit for NXP’s LPC11U00 USB microcontroller series"

Atmel Samples SAM3S16 ARM-based Microcontroller With 1MB Embedded Flash

July 11, 2011

SAN JOSE, CA, July 11, 2011- Atmel^®Corporation (NASDAQ: ATML), a leader in microcontroller and touch technology solutions, today announced early sampling of its 32-bit ARM^® Cortex^®-M3-based microcontrollers (MCUs) with 1MB embedded Flash and 128KB SRAM. The new Atmel Read More → "Atmel Samples SAM3S16 ARM-based Microcontroller With 1MB Embedded Flash"

National Instruments Introduces Industry’s Highest Throughput PXI Frame Grabber

July 8, 2011

June 21, 2011 – National Instruments today announced the NI PXIe-1435 high-performance Camera Link frame grabber. Engineers can use the new module to integrate high-speed and high-resolution imaging into their PXI systems, the industry standard for automated test with more than 1,500 measurement modules available from more than 70 vendors. By combining high-throughput imaging with the benefits of off-the-shelf PXI measurement hardware, NI now offers full software-defined solutions for demanding automated test applications in industries such as consumer electronics, automotive and semiconductor.

< … Read More →

Sierra Circuits Demonstrates HDI Stackup Planner at Semicon West 2011

July 8, 2011

SUNNYVALE, CA–(Marketwire – Jul 7, 2011) – Sierra Circuits, the leader in QuickTurn HDI PCBs, has announced that it will be demonstrating the latest version of its HDI Stackup Planner software at the Semicon West trade show at the Moscone Center in San Francisco later this month. The complete show information follows:

</ … Read More →

Date:		July 12-14, 2011
Location:		Moscone Center, 747 Howard Street, San Francisco
Booth #:		522