News – Page 2056 – EEJournal

Lattice’s New Mixed Signal Design Software Simplifies Platform Management Design

July 18, 2011

HILLSBORO, OR–(Marketwire – Jul 18, 2011) – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced release 6.1 of its PAC-Designer® mixed signal design software, with updated support for Lattice’s Platform Manager™, Power Manager II and ispClock™ devices. Users designing with Platform Manager devices will now have access to the Lattice Diamond® 1.3 software design environment, which was also announced today. … Read More → "Lattice’s New Mixed Signal Design Software Simplifies Platform Management Design"

TI’s new development kit helps engineers quickly and easily design Bluetooth® technology-enabled applications based on Stellaris® microcontrollers

July 18, 2011

DALLAS, Texas, July 18 /PRNewswire/ — Texas Instruments Incorporated (TI) (NYSE: TXN) today announced the Stellaris® 2.4 GHz CC2560 Bluetooth® Wireless Kit (DK-EM2-2560B), aimed at jumpstarting Bluetooth®-enabled designs. The kit includes the high-throughput, power-efficient CC2560 Bluetooth solution and proven Bluetooth stack within StellarisWare® software. The performance and integration of Stellaris MCUs pair with TI’s leading Bluetooth solution to help developers address the demand for … Read More → "TI’s new development kit helps engineers quickly and easily design Bluetooth® technology-enabled applications based on Stellaris® microcontrollers"

Renesas Electronics Achieves 4X Faster Performance with Synopsys’ HAPS® FPGA-Based Prototyping Solution

July 18, 2011

MOUNTAIN VIEW, Calif., July 18, 2011 — Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, adopted Synopsys’ HAPS-64 FPGA-based prototyping systems for their prototyping environment for systems-on-chips (SoCs) and microcontrollers. By deploying the HAPS systems, Renesas Electronics achieved more than a 4X speed-up in prototype performance over their previous FPGA prototyping solution. In addition, the … Read More → "Renesas Electronics Achieves 4X Faster Performance with Synopsys’ HAPS® FPGA-Based Prototyping Solution"

Maxim Acquires SensorDynamics, Developer and Manufacturer of Proprietary Sensor and MEMS Solutions

July 18, 2011

SUNNYVALE, Calif., 2011-07-18 13:15 CEST (GLOBE NEWSWIRE) — Maxim Integrated Products (Nasdaq:MXIM) today announced it has acquired SensorDynamics, a privately held semiconductor company that develops proprietary sensor and microelectromechanical (MEMS) solutions. SensorDynamics is based in Lebring, near Graz, … Read More → "Maxim Acquires SensorDynamics, Developer and Manufacturer of Proprietary Sensor and MEMS Solutions"

Avnet Electronics Marketing Brings Bluetooth Connectivity to Customers with the Addition of Bluegiga

July 18, 2011

PHOENIX—July 18, 2011 — Avnet Memec, a division of Avnet Electronics Marketing Americas, a business region of Avnet, Inc. (NYSE: AVT), has inked a distribution agreement with Read More → "Avnet Electronics Marketing Brings Bluetooth Connectivity to Customers with the Addition of Bluegiga"

Eurotech Selected by DRS Defense Solutions for Ultra Low-Power Embedded Computing Platform

July 18, 2011

COLUMBIA, Md., July 18, 2011 /PRNewswire/ — Eurotech, a leading supplier of embedded technologies, products, and systems, today announces they have been selected to supply embedded computers to DRS Defense Solutions. The program is expected to require some thousands of embedded computers … Read More → "Eurotech Selected by DRS Defense Solutions for Ultra Low-Power Embedded Computing Platform"

Enova Launches Its 9th Generation X-Wall DX processor, the 1st True Real-Time Hardware Encryption Processor for USB Mass Storage Class Devices.

July 15, 2011

SAN JOSE, Calif., July 14, 2011 – Enova Technology Corp., the real-time full disk encryption technology innovator, today announced its 9^th generation X-Wall DX processor, the 1^st true real-time hardware encryption processor for USB mass storage class devices.

The patent protected X-Wall DX is the 9th generation of the X-Wall real-time hardware full disk encryption processor capable of encrypting all USB Mass storage class (MSC) devices at USB2.0 wire speed with NIST (National Institute of Standards and Technology) and CSE (Communication Security Establishment) certified … Read More → "Enova Launches Its 9th Generation X-Wall DX processor, the 1st True Real-Time Hardware Encryption Processor for USB Mass Storage Class Devices."

SuperTalent Introduces Consumer Focused SATA III SSD

July 15, 2011

San Jose, California &#8211 July 12, 2011 &#8211 Super Talent Technology, a leading manufacturer of flash storage solutions and DRAM memory modules, today announced their new SATA III SSD, the TeraDrive CT3.

Right on the heals of the TeraDrive PT3, SuperTalent now unveils their TeraDrive CT3. Designed to fill the gap between their TeraDrive PT3 and CT2 offerings, the CT3 emerges as a price/performance leader. By combining the new SATA III interface with standard 25nm NAND flash, the TeraDrive CT3 enables traditional NAND flash to offer some very untraditional performance.

As with the PT3, … Read More → "SuperTalent Introduces Consumer Focused SATA III SSD"

Curtiss-Wright Controls Joins OpenFabrics Alliance (OFA) to Drive Continuum HPEC Initiative for COTS-based High Density DSP Systems

July 15, 2011

ASHBURN, VA – July 13, 2011 – Curtiss-Wright Controls Embedded Computing (CWCEC), a business group of Curtiss-Wright Controls and a leading designer and manufacturer of commercial off-the-shelf (COTS) VPX, OpenVPX™, VME, VXS and CompactPCI products for the rugged, deployed defense and aerospace market, has joined the OpenFabrics Alliance (OFA). OFA develops, tests, licenses and distributes the OpenFabrics Enterprise Distribution (OFED^TM) … Read More → "Curtiss-Wright Controls Joins OpenFabrics Alliance (OFA) to Drive Continuum HPEC Initiative for COTS-based High Density DSP Systems"

Leti and Replisaurus Reach Milestone in Project to Commercialize ElectroChemical Pattern Replication (ECPR) Metallization Process

July 15, 2011

SAN FRANCISCO, Calif. – July 13, 2011 – CEA-Leti and Replisaurus Technologies, Inc., a developer of a metallization technology for integrated passives, copper pillars and 3D integration (TSV), today announced that they have completed a crucial step toward commercialization of Replisaurus’ innovative ElectroChemical Pattern Replication (ECPR^TM) metallization process.

In less than two years since launching their common lab at Leti, the two partners have optimized the ECPR master process (the master is a 200mm or 300mm silicon wafer filled with copper and sized for final structures to be patterned). The technology is … Read More → "Leti and Replisaurus Reach Milestone in Project to Commercialize ElectroChemical Pattern Replication (ECPR) Metallization Process"