News – Page 2053 – EEJournal

Wide VIN Range Flyback Controller is Specified over a -55°C to 150°C Junction Temperature Range

May 25, 2011

MILPITAS, CA – May 25, 2011 – Linear Technology Corporation announces the high reliability (MP-grade) version of the LTC3805/-5, a programmable frequency flyback controller that operates over a -55°C to 150°C junction temperature range. This high-performance shunt regulated input voltage PWM (pulse width modulation) controller enables for wide input voltages ranging from 5V to off-line applications and is … Read More → "Wide VIN Range Flyback Controller is Specified over a -55°C to 150°C Junction Temperature Range"

Forza Selects Berkeley Design Automation Analog FastSPICE™ Platform

May 25, 2011

SANTA CLARA, CA, —May 24, 2011— Berkeley Design Automation, Inc., the nanometer circuit verification leader, today announced that Forza Silicon Inc., a fabless semiconductor company specializing in high-resolution, high-speed CMOS image sensors, has selected the company’s Analog FastSPICE Platform for full-circuit verification and block-level characterization.

“The CMOS image sensors we design have tremendous verification challenges,” said Daniel Van Blerkom, Ph.D., CTO at Forza Silicon. “We selected AFS because it can handle verification of our CMOS image … Read More → "Forza Selects Berkeley Design Automation Analog FastSPICE™ Platform"

Advantech Expands Performance Features on Its Newest MICA-101 Mobile Clinical Assistant

May 25, 2011

Irvine, California, May 18, 2011 – Advantech, a global embedded computing leader, is happy to announce a new generation of the MICA-101 mobile clinical assistant. The new MICA-101 (Version C) has the same integrated features and ergonomic design as its predecessor, but the new release has been enhanced to provide better imagery, faster storage, and better power, making it even more robust. MICA-101 mobile clinical assistant is suitable for EMR, HER, and Nursing Information Systems (NIS). It is a fanless system that is lightweight, portable and quiet to use, and it streamlines workflow while increasing productivity.

< … Read More →

Aldec Delivers 4 MHz Design Emulator with Extensive Debugging Support

May 25, 2011

Henderson, NV (US) – May 23, 2011 — Aldec, Inc., a pioneer in mixed HDL language simulation and hardware-assisted verification solutions for system and ASIC designs, enhances HES™ (Hardware Emulation Solutions) by expanding its debugging capabilities, ASIC gate capacity and speed of operation.

The new release of HES Design Verification Manager software, DVM™ 2011.04, supports SCE-MI 2.0 standard and provides 4 MHz emulation speed for designs with 10 million ASIC gates. The new version of DVM automates the entire design setup process including the insertion of SCE-MI transactors into the user’s design and SCE-MI API functions to interface with … Read More → "Aldec Delivers 4 MHz Design Emulator with Extensive Debugging Support"

Embedded Systems and Software: A Central Theme at 48th DAC

May 25, 2011

LOUISVILLE, Colo. –– May 24, 2011 –– At the 48th Design Automation Conference (DAC), the premier conference devoted to design and design automation of electronic systems a full one-third of the technical program addresses embedded systems and software. DAC’s embedded theme is reflected in a dedicated Embedded System and Software (ESS) Executive Day, embedded theater teardowns and presentations, a zone for ESS vendors on the exhibit floor, panels, … Read More → "Embedded Systems and Software: A Central Theme at 48th DAC"

New AMD Embedded G-Series APUs Provide 39 Percent Power Reduction for Fanless Designs

May 24, 2011

SUNNYVALE, CA–(Marketwire – May 23, 2011) – AMD (NYSE: AMD) today announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts, up to a 39 percent power savings compared to earlier versions¹. The very low power consumption and small 361mm² package is ideal for compact, fanless … Read More → "New AMD Embedded G-Series APUs Provide 39 Percent Power Reduction for Fanless Designs"

Ericsson’s Digital Voltage Regulators Offer New Levels Of Control And Energy Saving At Up To 40A Output

May 24, 2011

Ericsson Power Modules’ 3E series BMR464 is a new addition to the company’s second-generation, digital point-of-load (POL) regulators, that extends the maximum output current from such devices up to 40A. With unprecedented functionality, the regulator enables systems architects to fully monitor and dynamically control the energy that is delivered to processors, FPGAs, ASICs and other components, ensuring minimum energy consumption under all operating conditions. The BMR464 offers easy paralleling and current sharing. Up to seven modules can be paralleled, offering a maximum output current of 280A. The regulator’s easy-paralleling mode even makes it possible to combine its 20 … Read More → "Ericsson’s Digital Voltage Regulators Offer New Levels Of Control And Energy Saving At Up To 40A Output"

IC Realtime® Joins D-Tools Manufacturer Vantage Point (MVP) Program

May 24, 2011

CONCORD, CA., MAY 24, 2011 – D-Tools, Inc, the worldwide leader in system integration software, today announced that IC Realtime Security Solutions LLC, has joined the D-Tools Manufacturer Vantage Point (MVP) program. Headquartered in Pompano Beach, Florida, IC Realtime® designs and manufactures high end integrated surveillance systems and software applications that deliver the maximum levels of protection, accessibility and flexibility for their clients.

IC Realtime will soon work closely with the D-Tools team so that their database is accessible to users of D-Tools SI 5.5 software. Partnering with D-Tools will allow IC Realtime to offer the convenience of … Read More → "IC Realtime® Joins D-Tools Manufacturer Vantage Point (MVP) Program"

SpringSoft’s New ProtoLink Probe Visualizer Speeds Verification Of FPGA-Based Prototype Boards

May 24, 2011

HSINCHU, Taiwan, May 23, 2011 — SpringSoft, Inc., a global supplier of specialized IC design software, today introduced the ProtoLink™ Probe Visualizer to dramatically increase design visibility and simplify debug of FPGA-based prototype boards. The new Probe Visualizer uses patented interconnect innovations and software automation with the industry-leading HDL debug platform to shorten the verification cycle of off-the-shelf or custom-designed prototypes and maximize their return on investment for early validation of system-on-chip (SoC) designs.

Prototype boards are widely used today to verify that critical design modules … Read More → "SpringSoft’s New ProtoLink Probe Visualizer Speeds Verification Of FPGA-Based Prototype Boards"

Imec and Atrenta Develop Exploration Flows for 3D ICs

May 24, 2011

Leuven, Belgium and San Jose, Calif., – May 24, 2011 – Atrenta Inc., a leading provider of SoC Realization <http://www.atrenta.com/Atrenta-SoC-Realization.pdf> solutions for the semiconductor and electronic systems industries, in collaboration with imec’s 3D integration IIAP (industrial affiliation program), have jointly developed an advanced planning and partitioning design flow for heterogeneous 3D stacked ICs. Imec <http://www.imec.be/> and Atrenta <Read More → "Imec and Atrenta Develop Exploration Flows for 3D ICs"