News – Page 2044 – EEJournal

Students and Altium race ahead at Hockenheimring

August 12, 2011

Karlsruhe, Germany – 12 August 2011 – Altium <http://www.live.altium.com/> , a developer and provider of electronics design solutions, supports the sixth Formula Student Germany <http://www.formulastudent.de/> , held from 2-7 August 2011 at the Hockenheimring race track in Germany. A total of 108 teams from more than 20 countries competed with their race car designs to be the best of the best in various disciplines.

For several years now, Altium has been sponsoring a number of Formula … Read More → "Students and Altium race ahead at Hockenheimring"

Honeywell Introduces New HumidIcon™ Digital Humidity/Temperature Sensors

August 12, 2011

MINNEAPOLIS, August 11, 2011 – Honeywell (NYSE:HON) introduced today the new HumidIcon™ Digital Humidity/Temperature Sensors, HIH-6130/6131 Series, offering industry- leading accuracy, stability, and energy efficiency in a lowest total cost solution that … Read More → "Honeywell Introduces New HumidIcon™ Digital Humidity/Temperature Sensors"

X-ES Adds Ultra-Small Form-Factor ATR System for Rugged Applications With Severe Size, Weight, and Power Constraints

August 12, 2011

MIDDLETON, WI–(Marketwire – Aug 11, 2011) – Extreme Engineering Solutions, Inc. (X-ES) announces the availability of the XPand6000, a rugged ATR system measuring just 4.88 in. x 1.9 in. x 7.7 in. A fully-loaded XPand6000 utilizes three types of industry-standard Commercial-Off-The-Shelf (COTS) components: rugged COM Express modules, PMC/XMC modules, and solid-state storage. With COTS components, … Read More → "X-ES Adds Ultra-Small Form-Factor ATR System for Rugged Applications With Severe Size, Weight, and Power Constraints"

Intel and Micron Receive Most Innovative Flash Memory Technology Award at 2011 Flash Memory Summit

August 11, 2011

SANTA CLARA, Calif. and BOISE, Idaho, 2011-08-11 09:00 CEST (GLOBE NEWSWIRE) — Intel Corporation (Nasdaq:INTC) and Micron Technology, Inc. (Nasdaq:MU), received the Most Innovative Flash Memory Technology award Aug. 10 at the 2011 Flash Memory Summit for the companies’ industry-leading 20 nanometer (nm) NAND Flash memory process technology.

The 20nm 8 gigabyte (GB) NAND device from Intel and Micron delivers the highest capacity in the smallest form factor. Manufactured by IM Flash Technologies, the NAND flash joint venture from Intel and Micron, the new device is a breakthrough in NAND process and technology design, further extending the companies’ lithography leadership.</ … Read More → "Intel and Micron Receive Most Innovative Flash Memory Technology Award at 2011 Flash Memory Summit"

Source code for Micriµm’s µC/OS-III Real-Time Kernel immediately available from the element14 knode.

August 11, 2011

8 August 2011 – London, , Premier Farnell plc (LSE:pfl), today announced an agreement with Micriµm, a leading supplier of embedded RTOS solutions, to provide free evaluation access to the source code for Micriµm’s µC/OS-III Real-Time Kernel. The move is in line with the Group’s focus on providing engineering design solutions, driving business to the web and growing sales in emerging markets

Downloadable from the Operating Systems and Stacks room in … Read More → "Source code for Micriµm’s µC/OS-III Real-Time Kernel immediately available from the element14 knode."

New COM-Express Compact Module Targets Low Power Performance Applications

August 11, 2011

Aug, 09, 2011, Irvine, California – Advantech, a global embedded computing leader providing embedded platform solutions across multiple vertical markets through deployment of intelligent applications and services, proudly announces the release of SOM-6763 B1 – COM-Express compact module powered by the Intel® Atom™ Processors 400 and 500 Series. The new B1 version module with Intel® Atom™ processor N455 (512K Cache, 1.66GHz) and Intel® … Read More → "New COM-Express Compact Module Targets Low Power Performance Applications"

Excelsys Xgen Power Supplies Meet the Most Demanding Application Environments

August 11, 2011

Excelsys Technologies, market leading specialists in the supply of high-efficiency, low profile, user configurable, modular power supplies now offers ruggedised versions of its Xgen power supply range suitable for COTS/MIL applications and extreme industrial installations

Now available with conformal coating for protection against harsh environments, the Xgen series of power supplies has also been extensively HALT tested for resistance to shock and vibration and characterised over its extended operating temperature range. Excelsys Xgen power supplies are available with high temperature ratings from -20ºC to +70ºC and low operating noise versions and medically … Read More → "Excelsys Xgen Power Supplies Meet the Most Demanding Application Environments"

Digi-Key Corporation Inks Global Distribution Agreement with Everlight Electronics

August 10, 2011

Wednesday, August 10, 2011 – THIEF RIVER FALLS, Minnesota, USA and Tucheng, Taipei, TW–Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s Read More → "Digi-Key Corporation Inks Global Distribution Agreement with Everlight Electronics"

National Instruments Technology Helps Virginia Tech Win EcoCAR Competition

August 10, 2011

July 25, 2011 – Virginia Tech recently was named the overall winner of EcoCAR: The NeXt Challenge, a three-year collegiate vehicle engineering competition sponsored by the U.S. Department of Energy and General Motors (GM). The Virginia Tech Hybrid Electric Vehicle Team (HEVT) designed and built an extended-range electric vehicle (EREV) that uses E85 (ethanol) and achieves fuel efficiency of 81.9 miles per gallon gasoline equivalent. With National Instruments reconfigurable software and hardware, the team used a graphical system design approach to design, prototype, validate and deploy a control strategy for the vehicle’s hybrid components.

< … Read More →

Exar Licenses PowerXR Technology to Zarlink Semiconductor for Residential Gateway Platforms

August 10, 2011

Fremont, California, 10 August 2011 – Exar Corporation (Nasdaq: EXAR), today announced it has entered into a product license agreement with Zarlink Semiconductor (TSX: ZL). This agreement significantly expands the available market for both companies by delivering dynamic power management and monitoring products to residential gateways. Exar’s PowerXR technology will be used with Zarlink’s low power voice solutions to provide programmable solutions that will exceed energy efficiency requirements for residential gateways as outlined by the Home Gateway Initiative.

“Exar is pleased to be working with Zarlink to drive the adoption of programmable power technology into … Read More → "Exar Licenses PowerXR Technology to Zarlink Semiconductor for Residential Gateway Platforms"