News – Page 2020 – EEJournal

Synopsys Introduces Virtualizer Next-Generation Virtual Prototyping Solution

July 19, 2011

MOUNTAIN VIEW, Calif., July 19, 2011 /PRNewswire/ —

Highlights:

Accelerates software development schedules by up to nine months and delivers up to 5X increase in design productivity compared to traditional methods
Leverages proven virtual prototyping technologies deployed at more than 50 leading semiconductor and electronic systems companies
Fast and accurate simulation with comprehensive system visibility and control delivers near real-time software execution with unparalleled debug and analysis efficiency
Integral part of the industry’s most comprehensive solution of tools, models and services for early software development, hardware/software … Read More → "Synopsys Introduces Virtualizer Next-Generation Virtual Prototyping Solution"

Renesas Electronics Announces Power Semiconductor Devices with High Current and Low Power Loss for Consumer Motor Drive Applications

July 19, 2011

Dusseldorf, 19th July 2011 – Renesas Electronics , a premier provider of advanced semiconductor solutions, today announced the development of 100 ampere (A) high-current power MOSFETs for motor drive in consumer products, such as cordless power tools and power-assisted bicycles, as part of a wider effort to strengthen the company’s entire … Read More → "Renesas Electronics Announces Power Semiconductor Devices with High Current and Low Power Loss for Consumer Motor Drive Applications"

Exar Samples Industry’s First ODU0/ODUflex Muxponder Solution

July 19, 2011

Fremont, California, 19 July 2011 – Exar Corporation (Nasdaq: EXAR) began offering today the industry’s first OTN muxponder solution that supports new G.709 features such as ODU0/ODUflex and GMP mapping. Exar’s MXP2 ASSP is a low power, 8 Watts, 2 x 10G single chip solution that was specifically designed to help customers future-proof their networks with support for the newest OTN standard features.

The data explosion coupled with the growing roll-out of packet-based networks has driven the OTN standard to include support for many client signals and … Read More → "Exar Samples Industry’s First ODU0/ODUflex Muxponder Solution"

TEWS TECHNOLOGIES introduces Virtex-5 AMC with FMC Module Slot

July 19, 2011

Halstenbek, Germany – July 19th, 2011. TEWS TECHNOLOGIES announces the introduction of the TAMC640, a standard single Mid-Size or Full-Size AMC module with a user-programmable LX50T, LX85T, or SX50T Virtex-5 FPGA. Designed for industrial, COTS, and transportation applications, where specialized I/O or long-term availability is required, the TAMC640 provides a number of advantages including a customizable interface for unique applications and a FPGA-based design to extend product lifecycle.

The integrated PCIe Endpoint Block of the Virtex 5 can be … Read More → "TEWS TECHNOLOGIES introduces Virtex-5 AMC with FMC Module Slot"

IAR Systems releases complete starter kit for NXP’s LPC1780 microcontroller series

July 19, 2011

Uppsala, Sweden—July 19, 2011— IAR Systems today announced a complete starter kit for NXP’s ARM Cortex-M3 based LPC1780 microcontroller family. IAR KickStart Kit for LPC1788 includes a feature-rich evaluation board, software development tools, an IAR J-Link Lite debug probe, and software. A high level of integration between hardware, software and tools in combination with pre-configured example projects and board support packages from various RTOS vendors makes it very easy to use the kit and get started with evaluation and development.

The evaluation board is fitted with … Read More → "IAR Systems releases complete starter kit for NXP’s LPC1780 microcontroller series"

XP Power extends family of COTS DC-DC converters aimed at military vehicle and avionic applications

July 19, 2011

XP Power today introduced the MTC35 and MTC50 series of commercial off the shelf (COTS) 35 W and 50 W DC-DC converters aimed at a broad range of military vehicle and avionics applications. These extremely robust and encapsulated board mounted modules accommodate a wide input range from 10 to 40 VDC, and can handle transients up to 50 VDC for up to 100 ms. Single output modules are available with + 3.3, + 5, + 12, + 15 or + 28 VDC outputs and can be adjusted between -20% and +10% via an external trim pin.

When used in conjunction with XP Power’s DSF, FSO or MTF series of standard EMI filter modules, … Read More → "XP Power extends family of COTS DC-DC converters aimed at military vehicle and avionic applications"

Vector Fabrics takes the pain out of parallelizing code for multi-core x86 architectures

July 19, 2011

Eindhoven, The Netherlands, 19th July 2011 – Vector Fabrics today announced the availability of its vfThreaded-x86 cloud-based software tool that facilitates the optimization and parallelization of applications for multi-core x86 architectures. Aimed at software developers that write performance-centric code such as for high-performance computing, scientific, industrial, video or imaging applications, the tool greatly reduces the time involved and the risks associated with optimizing code for the latest multi-core x86 processors.

“We’re excited to bring our proven parallelization technologies to the programming community that develops applications for the Intel architecture. Our tools make it easy to speed up a … Read More → "Vector Fabrics takes the pain out of parallelizing code for multi-core x86 architectures"

Microsemi Introduces Replacement Solution for Micron Technology EOL Package Used with TI Processors

July 19, 2011

IRVINE, Calif., July 19, 2011–Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced a new multichip (MCP) memory product that provides a drop-in replacement for the discontinued Micron memory package used in Texas Instruments (TI) processors. The MS29C2G24MAKLA1-XI is the first in a family of planned products, and is available today. The new memory solution is compatible with TI processor families that are enclosed in Micron Technology’s end-of-life (EOL) package-on-package (PoP) 152-pin ball grid array (BGA). The Microsemi replacement package allows users to avoid time-consuming … Read More → "Microsemi Introduces Replacement Solution for Micron Technology EOL Package Used with TI Processors"

New Release of Lattice Diamond Design Software Delivers More Robust Design Capabilities for Low Power, Cost Sensitive FPGA Applications

July 18, 2011

HILLSBORO, OR–(Marketwire – Jul 18, 2011) – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced release 1.3 of its Lattice Diamond® design software, the flagship design environment for Lattice FPGA products. Users of Lattice Diamond 1.3 software will benefit from major new features, including clock jitter analysis. Lattice Diamond 1.3 software is also now integrated with Lattice’s PAC-Designer® 6.1 mixed signal design tools ( … Read More → "New Release of Lattice Diamond Design Software Delivers More Robust Design Capabilities for Low Power, Cost Sensitive FPGA Applications"

IP65-rated Panel PC family by WinSystems introduced for Demanding Industrial Applications

July 18, 2011

July 14, 2011, Arlington, TX – Four new industrial-grade Panel PCs were introduced today by WinSystems. Available with 12-, 15-, 17- or 19-inch diagonal displays and touch screens, the PPC65 family of Panel PCs is powered by a fully integrated 1.6 GHz Intel^® Atom^™ based single board computer (SBC) which offers a multitude of I/O connectivity options. The front bezels on these Panel PCs are environmentally sealed to comply with NEMA 4/IP65 specifications to prevent damaging moisture, dust, and dirt from getting … Read More → "IP65-rated Panel PC family by WinSystems introduced for Demanding Industrial Applications"

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