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Infineon presents new ASIL-D-compliant 3-phase gate driver IC for braking systems and electric power steering in vehicles

October 31, 2024

Munich, Germany – 31 October 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is launching the new MOTIX™ TLE9189 gate driver IC for safety-critical applications for 12 V brushless DC (BLDC) motors. With this new three-phase gate driver IC, Infineon is responding to the growing demand for motor control ICs required for by-wire solutions. The driver IC is qualified according to AEC Q100 Grade 0 and ISO 26262 (ASIL D). This makes the device particularly suitable for brake-by-wire and steer-by-wire systems, where conventional mechanical connections will be eliminated in the future.

“With the TLE9189 we are … Read More → "Infineon presents new ASIL-D-compliant 3-phase gate driver IC for braking systems and electric power steering in vehicles"

NXP Expands Edge AI Capabilities with eIQ Software Enablement

NXP adds GenAI Flow with Retrieval Augmented Generation (RAG) fine-tuning and eIQ Time Series Studio to its eIQ AI and machine learning development software to make it easier to deploy and use AI across a broad spectrum of edge processors, from small microcontrollers (MCUs) to larger and more powerful applications processors (MPUs)
October 31, 2024

What’s new: NXP Semiconductors today announced it has added two new tools to its eIQ AI and machine learning development software, making it easier to deploy and use AI at the edge across a full spectrum of edge processors.

Read More → "NXP Expands Edge AI Capabilities with eIQ Software Enablement"

Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries and improving energy efficiency

October 31, 2024
  • Infineon first to master handling and processing of ultra-thin 20-micrometer power semiconductor wafers
  • Reducing wafer thickness cuts substrate resistance in half, enabling power loss reductions of over 15 percent
  • New technology for various applications including Infineon’s Powering AI roadmap
  • Ultra-thin wafer technology already qualified and released to customers

Munich, Germany – 29 October 2024 – After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer  … Read More → "Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries and improving energy efficiency"

NSM211x Series High-Precision AEC-Q100 Current Sensors Eliminate Need for External Isolation Components

Target applications include OBC/DC-DC converters, PTCs, automotive motor control, fuel cell and charging station current detection. On display at Electronica – stand B5.450
October 31, 2024

Robust resistive multi-touch solutions support gesture operations

Exceptional immunity to ESD enables use in challenging application environments
October 31, 2024

Milwaukee, Wisconsin. October 29, 2024. Display solutions and embedded systems provider, Review Display Systems Inc. (RDS) has announced the availability of a range of Resistive Multi-touch (RMT) interface solutions from AMT, a leading provider of touch-based interface solutions.

AMT’s Resistive Multi-touch (RMT) solutions provide precise input accuracy, multi-point touch operation and gesture support, coupled with the reliability and noise immunity characteristics of resistive touch technology.

Critical-use equipment necessitates the need for enhanced EMI performance and zero tolerance for false touch signals. Robust, dependable and error-free touch solutions are essential for … Read More → "Robust resistive multi-touch solutions support gesture operations"

Siemens and CELUS collaborate to empower SMBs with AI-powered PCB design

Collaboration aims to simplify PCB design with AI-driven automation, making advanced tools more accessible and affordable for engineers and small to medium-sized businesses
October 30, 2024

Siemens Digital Industries Software, a global leader in PCB electronic systems design, and CELUS, a pioneer in AI-powered electronic design automation solutions, today announced their collaboration to transform the PCB design landscape for small and medium-sized businesses (SMBs) and independent engineers.

This collaboration combines Siemens’ industry-leading PCB design expertise with CELUS’ innovative AI automation platform to create a powerful, user-friendly and cost-effective solution tailored to the real-world needs of engineers. The integration of CELUS’ AI-driven automation with Siemens’ next-generation PCB design solution aims to deliver a fully integrated design environment that accelerates design processes, minimizes errors and … Read More → "Siemens and CELUS collaborate to empower SMBs with AI-powered PCB design"

Arteris Selected by TIER IV for Intelligent Vehicles

FlexNoC 5 network-on-chip IP and Magillem Connectivity SoC integration automation software accelerate autonomous driving chip project timelines while meeting automotive functional safety and performance requirements and reducing the development risks.
October 30, 2024

CAMPBELL, Calif. – October 29, 2024 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced TIER IV has licensed FlexNoC 5 interconnect IP and Magillem Connectivity SoC integration automation software for its next generation of intelligent vehicle electronics. These products support the development of high-performance, reliable automotive SoC products that are essential to realizing fully autonomous driving in the future.

TIER IV is pioneering open-source software for autonomous driving to empower intelligent vehicles worldwide. … Read More → "Arteris Selected by TIER IV for Intelligent Vehicles"

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