Santa Clara, CA and Kyoto, Japan, Jan. 22, 2025 (GLOBE NEWSWIRE) — ROHM Semiconductor today announced a new 32-bit D/A converter IC (DAC chipRead More → "ROHM’s 2nd Generation MUS-IC Series Audio DAC Chip for Hi-Res Audio Playback with Exclusive HD Monaural Mode"
TORONTO, Jan. 22, 2025 /CNW/ – Xanadu has achieved a world-first in the quantum computing industry by successfully building a universal photonic quantum computer consisting of four modular and independent server racks that are photonically interconnected and networked together. This 12 qubit machine, known as Aurora, consists of 35 photonic chips and a combined 13 km of fiber optics all operating at room temperature.
With this breakthrough, Aurora could in principle be scaled up to thousands of server racks and millions of qubits … Read More → "Xanadu introduces Aurora: world’s first scalable, networked and modular quantum computer"
January 22, 2025
TDK Corporation (TSE: 6762) has expanded its CGA series for automotive and C series for commercial multilayer ceramic capacitors (MLCCs) to 10 nF at 1,250 V in 3225 size (3.2 x 2.5 x 2.5 mm – L x W x H), with C0G characteristics (Class I dielectric). This is the industry’s highest capacitance* for a 1,250-V rated product in 3225 size and this temperature characteristic. Mass production of the product series began December 2024.
Circuits using silicon carbide (SiC) MOSFETs, which can withstand … Read More → "Multilayer Ceramic Capacitors TDK offers MLCCs with 10 nF and C0G characteristics at 1,250 V in 3225 size for automotive and commercial"
| Uppsala, Sweden – January 22, 2025 – IAR, a global leader in embedded development solutions, announces its support for the THA6 Gen2 series automotive-grade MCUs from Tongxin Microelectronics Co., Ltd. (TMC). This collaboration, achieved through the latest release of IAR Embedded Workbench for Arm v9.60.3, enables developers to meet next-generation automotive electronics’ high-performance and functional safety demands.
The TMC THA6 Gen2 series is the first Arm Cortex-R52+ ASIL D MCU in China. Operating at a frequency of 400 MHz, it is built on the modern Armv8 architecture, offering both performance and scalability. Additionally, … Read More → "IAR Expands Support for TMC THA6 Gen2 Series Automotive MCUs, Driving Innovation in Automotive Electronics" |
Ditzingen/Freudenstadt (Germany), January 22, 2025 – TRUMPF and the SCHMID Group are developing an innovative manufacturing process for the latest microchip generation for the global chip industry. This will enable manufacturers to increase the performance of high-end electronic components for smartphones, smart watches and AI applications. In the process known as advanced packaging, manufacturers combine individual chips on silicon components known as interposers. With the process from TRUMPF and SCHMID, these interposers can be made of glass in the future.
“Advanced packaging with glass is a crucial future technology for the semiconductor industry. Glass is significantly cheaper than silicon. … Read More → "TRUMPF and SCHMID Group enable cost-effective high-speed chips"
Västerås, Sweden, 21 January 2025 – Percepio AB, a leader in continuous observability solutions for embedded systems and edge devices renowned for its award-winning product Tracealyzer®, announces the launch of Percepio Detect, a groundbreaking tool that redefines how embedded software developers tackle testing, debugging, and observability challenges. Supporting the new best practice of Observability Driven Development (ODD), Percepio Detect enables next-generation DevOps for embedded software by seamlessly extending the capabilities of existing Continuous Integration and Continuous Testing (CI/CT) processes. Designed for edge devices and real-time systems, Percepio Detect empowers developers with real-time … Read More → "Percepio® Launches Percepio Detect™: Spearheading Observability Driven Development for Embedded Software"
FOUNTAIN INN, S.C. (January 21, 2025) – Read More → "KYOCERA AVX Releases Two New Series of Small, High-Power, Thin-Film Band-Pass Filters"
SUNNYVALE, Calif., Jan. 21, 2025 (GLOBE NEWSWIRE) — Numem, an innovator focused on accelerating memory for AI workloads, will be at the upcoming Chiplet Summit to showcase its high-performance solutions. By accelerating the delivery of data via new … Read More → "Numem Overcomes AI Performance Barriers with Next-Gen Memory Solutions, Highlights Innovations at Chiplet Summit"
