News – Page 15 – EEJournal

Vishay Intertechnology Introduces Compact, Sealed SMD Trimmers for Harsh Environments

New TS7 Series Delivers High Power Density in a Compact 6.7 mm x 7 mm Footprint, Offering 0.5 W Power Rating and IP67 Sealing

November 14, 2024

MALVERN, Pa. — Nov. 13, 2024 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced the release of its new TS7 series of single-turn, surface-mount cermet trimmers. The TS7 trimmers feature a compact 6.7 mm x 7 mm footprint with a height of 5 mm, making

The TS7 series is designed to support automated assembly and setting processes, enhancing production efficiency while reducing both time and costs. Fully sealed to withstand standard board wash processing, the trimmers ensure reliability in demanding industrial, consumer, and telecom environments.

Offering a 0.5 W power rating at +70 °C, the TS7 series is available in both top and side … Read More → "Vishay Intertechnology Introduces Compact, Sealed SMD Trimmers for Harsh Environments"

Ayar Labs to Showcase the Future of AI Infrastructure with Fujitsu, Intel Foundry, Corning, and Altera

The company will demonstrate the breadth of its ecosystem and value of optical I/O in advancing AI infrastructure at Supercomputing 2024

November 14, 2024

SAN JOSE, Calif. – Nov. 13, 2024 – Ayar Labs, the leader in optical interconnect solutions for large-scale AI workloads, will demonstrate a broad range of optical I/O implementations for AI scale-up fabrics at its Supercomputing 2024 (SC24) booth (#810). … Read More → "Ayar Labs to Showcase the Future of AI Infrastructure with Fujitsu, Intel Foundry, Corning, and Altera"

element14 Community and NXP Launch Smart Spaces Building Automation Challenge

Have the freedom to automate your space using FRDM boards from NXP

November 14, 2024

Phoenix – November 13, 2024: element14, an Avnet Community, has teamed up with NXP to launch an exciting new design challenge centered around building automation for smart spaces. This challenge invites engineers and tech enthusiasts to develop innovative solutions using NXP’s FRDM MCX A Series (A15X) development kit.

Ten selected participants will receive the NXP FRDM MCX A15X kit and will tackle a building automation problem. Suggested projects include, but are not limited to:

Smart Temperature Control System
Bluetooth Lighting Controller
Attendance and Presence … Read More → "element14 Community and NXP Launch Smart Spaces Building Automation Challenge"

Alliance Memory Expands Serial NOR Flash Portfolio With New High-Density Devices

Devices Offer Increased Storage and Performance for a Wide Range of Applications

November 13, 2024

KIRKLAND, Wash. , Nov. 12, 2024 (GLOBE NEWSWIRE) — Alliance Memory today announced the expansion of its Serial NOR Flash product line with the introduction of three new 3.3 V families with density of 128Mb, 256Mb, and 512Mb. These new products include the AS25F3128MQ-6SIN, AS25F3128MQ-6WINTR, AS25F3256MQ-7S2INTR, AS25F3256MQ-7W2INTR, AS25F3512MQ-7S2INTR, and AS25F3512MQ-7W2INTR, which are now available for embedded applications that require reliable, high-performance code storage and execution.

The new Serial NOR Flash devices are designed to address the growing demand … Read More → "Alliance Memory Expands Serial NOR Flash Portfolio With New High-Density Devices"

Renesas Introduces New AnalogPAK Programmable Mixed-Signal ICs, Including First Low-Power Device with 14-Bit SAR ADC

Devices Reduce Component Count, BOM Cost and Board Space in Almost Any Application

November 13, 2024

TOKYO, Japan, November 12, 2024 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced new AnalogPAK™ ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC (Successive-Approximation Register Analog-Digital Converter).

AnalogPAK devices are part of Renesas’ GreenPAK™ Family of Programmable Mixed-Signal Matrix products: cost-effective, NVM programmable devices which enable innovators to integrate many system functions while minimizing component count, board space, and power consumption. GreenPAK and AnalogPAK ICs deliver functional replacement of mixed-signal standard products and stand-alone discrete circuits. They also provide reliable hardware supervisory functions … Read More →

CHERI Alliance Officially Launches, Adds Major Partners including Google, to Tackle Cybersecurity Threats at the Hardware Level

Founding members include global commercial, research, and open-source organizations, and several UK universities and government entities

November 13, 2024

CAMBRIDGE, the United Kingdom – November 12, 2024 – The CHERI Alliance CIC (Community Interest Company) today announced its official launch and the expansion of its membership, welcoming Chevin Technology (UK), Read More → "CHERI Alliance Officially Launches, Adds Major Partners including Google, to Tackle Cybersecurity Threats at the Hardware Level"

Cemtrex’s Vicon Industries Unveils the Next Evolution of Camera Technology with NEXT™ Modular Camera System

Next Generation Modular Camera Platform That Delivers: Rapid Installation, AI Processing Capabilities, Advanced Onboard Technologies and Integrations

November 13, 2024

Hauppauge, NY, Nov. 12, 2024 (GLOBE NEWSWIRE) — – Cemtrex Inc. (NASDAQ: CETX, CETXP), an advanced security technology and industrial services company, today announced that its subsidiary, Vicon Industries, unveiled NEXT™, a next generation modular camera platform that … Read More → "Cemtrex’s Vicon Industries Unveils the Next Evolution of Camera Technology with NEXT™ Modular Camera System"

IO-Link actuator board from STMicroelectronics delivers turnkey reference design for industrial monitoring and appliances

Demonstrates IO-Link transceiver and low-side power switch combination

November 13, 2024

Geneva, Switzerland, November 12, 2024 — ST has introduced an IO-Link reference design for industrial beacons and home-appliance alarms, delivered ready-to-use as a fully built board complete with protocol stack and application software.

The EVLIOL4LSV1 board leverages ST’s L6364Q dual-channel IO-Link transceiver to handle communications and the IPS4260L intelligent low-side power switch for driving the indicator lights. The board can be directly connected to … Read More → "IO-Link actuator board from STMicroelectronics delivers turnkey reference design for industrial monitoring and appliances"

Mouser Explores the Open-Source Future with RISC-V Technology Resource Center

November 12, 2024

November 11, 2024 – Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components™, introduces its comprehensive RISC-V resource center, empowering design engineers with knowledge on the latest technology and applications. As the open-source architecture gains popularity, RISC-V stands out … Read More → "Mouser Explores the Open-Source Future with RISC-V Technology Resource Center"

Arteris and MIPS Partner on High-Performance RISC-V SoCs for Automotive, Datacenter and Edge AI

Pre-verified reference platform supports the acceleration of RISC-V-based SoC designs with mutual customers.

November 12, 2024

CAMPBELL, Calif., – November 12, 2024 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation and MIPS, a leading provider of efficient and configurable compute core IP, today announced a partnership to provide a pre-verified reference platform to support mutual customers. The creation of this pre-verified reference platform is designed to shorten development cycles and reduce risk for RISC-V-based chip designs for automotive, enterprise computing and edge AI applications.

MIPS develops high-performance RISC-V CPU IP for AI, automotive and general-purpose computing. By pre-integrating Arteris network-on-chip IP, including … Read More → "Arteris and MIPS Partner on High-Performance RISC-V SoCs for Automotive, Datacenter and Edge AI"

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