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Point2 Technology Announces Industry-Leading Smart Retimer Mixed-Signal SoC for 800G/1.6T Active Electrical Cable Applications in Hyperscale AI/ML Datacenters

NVIDIA Announces Omniverse Real-Time Physics Digital Twins With Industry Software Leaders

ATLANTA, Nov. 18, 2024 (GLOBE NEWSWIRE) — SC24 — NVIDIA today announced an NVIDIA Omniverse™ Blueprint that enables industry software developers to help their computer-aided engineering (CAE) customers in aerospace, automotive, manufacturing, energy and other industries create digital twins with real-time interactivity.

Software developers such as Altair, Ansys, Cadence and … Read More → "NVIDIA Announces Omniverse Real-Time Physics Digital Twins With Industry Software Leaders"

Eaton unveils self-cooling rack innovation for edge computing applications

Intelligent power management company Eaton today announced it has expanded its family of self-cooling server racks with the North American launch of its new SmartRack® 5.5 kW self-cooling server rack, the highest capacity in-rack cooling solution available. Designed for server rooms and edge applications in enterprise, manufacturing, government and telecom environments – as well as traditional network closets – the new solution provides precision cooling within the rack to help prevent equipment shutdowns, malfunctions and other failures caused by overheating.
Organizations across industries are increasingly incorporating edge computing into their IT operations, leading them to deploy single-rack micro … Read More → "Eaton unveils self-cooling rack innovation for edge computing applications"

New NTN wireless comms module from SIMCom enables IoT deployment where terrestrial networks struggle

SIMCom, a leading provider of cellular wireless modules and solutions for IoT and M2M applications, has developed a new NTN (non-terrestrial network) satellite communications module. SIM7070G-HP-S supports 3 … Read More → "New NTN wireless comms module from SIMCom enables IoT deployment where terrestrial networks struggle"

Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology

MUNICH, Germany and TOKYO, Japan, November 13, 2024 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today launched the new generation of automotive fusion system-on-chips (SoCs) serving multiple automotive domains including Advanced Driver Assistance Systems (ADAS), in-vehicle … Read More → "Renesas Unveils Industry’s First Automotive Multi-Domain SoC Built with 3-nm Process Technology"

MathWorks and NXP Unveil Model-Based Design Toolbox for Battery Management Systems

Natick, MA – (13 Nov 2024)

MathWorks, the leading developer of mathematical computing software, and NXP® Semiconductors, the worldwide leader in automotive processing, announced the availability of the Model-Based Design Toolbox (MBDT) for Battery Management Systems (BMS). The toolbox enables engineers to model, develop, and validate BMS applications in MATLAB®  … Read More → "MathWorks and NXP Unveil Model-Based Design Toolbox for Battery Management Systems"

Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan

CHANDLER, Ariz., November 14, 2024 — To enable developers building artificial intelligence (AI)-driven sensor processing systems, Microchip Technology (Nasdaq: MCHP) has released its PolarFire® FPGA Ethernet Sensor Bridge that works with the Read More → "Microchip to Accelerate Real-time Edge AI with NVIDIA Holoscan"

Siemens presents next-generation AI-supported software for electronic system design

  • The latest version combines Xpedition, Hyperlynx and PADS Professional software through a unified user experience with connectivity and collaboration in the cloud
  • Improved integration with Teamcenter and NX software from Siemens

    Siemens Digital Industries Software today announced the latest evolution of its electronic systems design portfolio. The next generation takes an integrated and multidisciplinary approach, combining Xpedition™, Hyperlynx™ and PADS™ Professional software into a unified user experience with cloud connectivity and AI capabilities to push the boundaries of innovation in electronic systems design.

The electronics design industry is facing major challenges. Skilled … Read More → "Siemens presents next-generation AI-supported software for electronic system design"

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