News – Page 11 – EEJournal

Solid Sands and VyperCore Collaborate to Ensure C/C++ Compliance in New Accelerator Chip Design

November 22, 2024

Amsterdam, The Netherlands and Cambridge, United Kingdom, – 21 November 2024 – Solid Sands, the world-leading provider of verification and qualification technology for C and C++ compilers and libraries, and VyperCore, a fabless semiconductor company offering up to 5x acceleration of managed-language applications, have announced that VyperCore has chosen SuperTest, Solid Sands’ comprehensive testing and validation suite, to ensure compliance with C and C++ language standards for the development of their new accelerator chip. This collaboration is poised to procure VyperCore with the highest quality levels when developing and … Read More →

COMSOL Releases Version 6.3 of COMSOL Multiphysics®

The latest version of the multiphysics simulation software introduces the Electric Discharge Module, GPU-accelerated simulations, and updates for greater modeling productivity

November 21, 2024

BURLINGTON, Mass., Nov. 19, 2024 (GLOBE NEWSWIRE) — COMSOL, a global leader in modeling and simulation software, today announced the release of COMSOL Multiphysics® version 6.3, which delivers new features and capability updates for efficient physics modeling and simulation app development. The new version includes automated geometry preparation tools, GPU support for accelerated acoustics simulation and surrogate model training, a new Electric Discharge Module, and an interactive Java environment, to name a few.

The new automated geometry preparation tools streamline model development by removing unnecessary details and defects in CAD models, resulting in higher-quality meshes for enhanced simulation reliability. Users can … Read More → "COMSOL Releases Version 6.3 of COMSOL Multiphysics®"

Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs

New Multiplexed Registered Clock Driver, Multiplexed Data Buffer and PMIC Enable Next-Generation MRDIMM Speeds up to 12,800 Mega Transfers per Second for AI and High-Performance Compute Applications

November 21, 2024

TOKYO, Japan ― Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory interface chipset solutions for the second-generation DDR5 Multi-Capacity Rank Dual In-Line Memory Modules (MRDIMMs).

The new DDR5 MRDIMMs are needed to keep pace with the ever-increasing memory bandwidth demands of Artificial Intelligence (AI), High-Performance Compute (HPC) and other data center applications. They deliver operating speeds up to 12,800 Mega Transfers Per Second (MT/s), a 1.35x improvement in memory bandwidth over first-generation solutions. Renesas has been instrumental in the design, development and deployment … Read More → "Renesas Introduces Industry’s First Complete Memory Interface Chipset Solutions for Second-Generation DDR5 Server MRDIMMs"

Vishay Intertechnology 150 V MOSFET Increases Efficiency With the Industry’s Lowest RDS(ON) of 5.6 mΩ and RDS(ON)Qg FOM of 336 mΩnC

Offered in PowerPAK® SO-8S Package, TrenchFET® Device's Low RthJC of 0.45 °C/W Enables High ID to 144 A to Increase Power Density

November 21, 2024

MALVERN, Pa. — Nov. 20, 2024 — To provide higher efficiency and power density for telecom, industrial, and computing applications, Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new 150 V TrenchFET® Gen V n-channel power MOSFET in the PowerPAK® SO-8S (QFN 6×5) package. Compared to previous-generation devices in the PowerPAK SO-8, the Vishay Siliconix SiRS5700DP slashes overall on-resistance by 68.3 % and on-resistance times gate charge — a key figure of merit (FOM) for MOSFETs used in power conversion applications — by 15.4 % while providing 62.5 % lower RthJC and 179 % higher continuous drain current.

With the industry’s lowest on-resistance of 5.6 mΩ at 10 V and on-resistance times … Read More → "Vishay Intertechnology 150 V MOSFET Increases Efficiency With the Industry’s Lowest RDS(ON) of 5.6 mΩ and RDS(ON)*Qg FOM of 336 mΩ*nC"

From Brain-Computer Chips to Climate Change: Dubai Future Forum 2024 Predicts the Future of Humanity

November 21, 2024

November 20th, 2024, Dubai – Imagine your boss is a robot or your mind is connected to a computer chip. What does this mean for the future of humanity? Scientists from over 100 countries met this week at the Dubai Future Forum, the world’s largest gathering of futurists, to discuss the challenges ahead in a world where technological innovation and artificial intelligence are shaping the future.

Will humanity settle on the Moon? Will children be taught from home? Experts at the Forum predict revolutionary changes ahead that will transform the way people live, companies are managed and the universe … Read More → "From Brain-Computer Chips to Climate Change: Dubai Future Forum 2024 Predicts the Future of Humanity"

Dependable power distribution with eFuses: Infineon launches PROFET™ Wire Guard with integrated I²t wire protection

November 21, 2024

Munich, Germany – 20 November 2024 – Modern, decentralized, and zonal power distribution architectures require dependable solutions. With PROFET™ Wire Guard, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) provides developers with advanced wire protection for modern power distribution. Compared to conventional fuses, the product family can emulate the stress characteristics of the wires much more accurately with an integrated and precise I²t wire protection curve, which can be selected from six implemented curves depending on the application requirements. Combined with other features, the integrated I²t wire protection accuracy enables wire harness optimization when replacing … Read More → "Dependable power distribution with eFuses: Infineon launches PROFET™ Wire Guard with integrated I²t wire protection"

New USB 2.0 Type C Connectors Feature Space-Saving Package Sizes

November 20, 2024

LAKE OSWEGO, Ore. — November 20, 2024 — Same Sky’s Interconnect Group</ … Read More →

Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards

FlexNoC 5 interconnect IP with physical awareness improves place and route efficiency and reduces interconnect area and power consumption.

November 20, 2024

CAMPBELL, Calif. – November 19, 2024 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced GigaDevice has licensed FlexNoC 5 interconnect IP to enhance product performance, reduce power consumption and shorten time to market. These solutions offer flexibility and cost-efficiency, supporting companies in developing advanced technologies.

GigaDevice provides industry-proven product families. These products offer high performance and reliability for applications requiring automotive-grade solutions. Committed to meeting the stringent standards of the automotive industry, the … Read More → "Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards"

Emproof and DDC-I Partner to Elevate Embedded Security with Deos and Emproof Nyx

November 20, 2024

Emproof, an innovator in embedded system security, and DDC-I, a trusted provider of safety-critical real-time operating systems, have announced a strategic partnership today, 6 November 2024. Together, the companies are introducing advanced security solutions for Deos-based systems, detailed in their newly released whitepaper; Advanced Embedded Security with DDC-I Deos and Emproof Nyx.

This collaboration combines the robust capabilities of DDC-I’s Deos real-time operating system (RTOS) with Emproof’s security solution, Emproof Nyx. Designed for industries where cybersecurity is paramount—such as aerospace and defense—this joint solution addresses sophisticated threats, including reverse engineering and exploitation … Read More → "Emproof and DDC-I Partner to Elevate Embedded Security with Deos and Emproof Nyx"

Ambiq and Edge Impulse Enable Low-Power Scalable AI

November 20, 2024

Austin, TX, November 19, 2024 – Ambiq®, a leading developer of ultra-low-power semiconductors and solutions enabling Edge AI, joins the Edge Impulse ecosystem to bring scalable AI model deployment on the Apollo4 Plus.

AI developers can harness the power advantages of Ambiq’s 4th generation Apollo System-on-Chip to deploy sophisticated edge AI such as speech, health, and other AI models through Edge Impulse’s platform. The Apollo4 Plus uses the proprietary Subthreshold Power Optimization Technology (SPOT®) platform to deliver 10X more efficiency for AI processing vs. other Arm M4-based solutions, making it an ideal platform for AI developers who … Read More → "Ambiq and Edge Impulse Enable Low-Power Scalable AI"

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Understanding Concurrent Multiprotocol: An In-Depth Exploration

Dec 19, 2024

Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....