industry news
Subscribe Now

Infineon and Resonac announce the expansion of their cooperation and a new multi-year agreement for delivery of silicon carbide (SiC) materials

Munich, Germany – 12 January 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is extending its cooperation with silicon carbide (SiC) suppliers. The German-based semiconductor manufacturer has signed a new multi-year-supply and cooperation agreement with Resonac Corporation (formerly Showa Denko K.K.), complementing and expanding the announcement of 2021. The new set of contracts will deepen the long-term partnership on SiC material. According to the agreement, Resonac will supply Infineon with SiC materials for the production of SiC semiconductors, covering a double-digit share of the forecasted demand for the next decade.

While the initial phase focuses on 6″ SiC material supply, Resonac will also support Infineon’s transition to 8″ wafer-diameter during the later years of the agreement. As part of the cooperation, Infineon will provide Resonac with intellectual property relating to SiC material technologies. The Infineon – Resonac partnership contributes to supply chain stability and will support the rapid growth of the emerging semiconductor material SiC.

”The demand for SiC is growing rapidly and we are preparing for this development with a significant expansion of our manufacturing capacities,” said Angelique van der Burg, Chief Procurement Officer at Infineon. “We are pleased to deepen our collaboration with Resonac and strengthen the partnership between our two companies.”

“The business opportunities in the area of renewable energy generation and storage, electromobility and infrastructure are enormous for the years to come. Infineon is doubling down on its investments into SiC technology and product portfolio, to proliferate the most comprehensive product offering to its customers. We are very happy that our partnership with Resonac will strongly support our market-leading position,” said Peter Wawer, President of Infineon’s Industrial Power Control division.

“We are pleased to team-up with Infineon as a global leader in power semiconductors in order to meet the growing demand for SiC in the years to come. We will continuously improve our Best-in-Class SiC material and develop the next generation of 8″ wafer technology. We value Infineon as an excellent partner in this regard,” said Jiro Ishikawa, Executive Adviser of Device Solutions Business Unit at Resonac.

Infineon is currently expanding its SiC manufacturing capacity in order to reach a market share of 30 percent by the end of the decade. Infineon’s SiC manufacturing capacity is about to increase tenfold by 2027. A new plant in Kulim is scheduled to start production in 2024. Today, Infineon already provides SiC semiconductors to more than 3,600 customers worldwide.

About Infineon

Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 56,200 employees worldwide and generated revenue of about €14.2 billion in the 2022 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).

Leave a Reply

featured blogs
Nov 12, 2024
The release of Matter 1.4 brings feature updates like long idle time, Matter-certified HRAP devices, improved ecosystem support, and new Matter device types....
Nov 7, 2024
I don't know about you, but I would LOVE to build one of those rock, paper, scissors-playing robots....

featured video

Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

Sponsored by Intel

Altera Innovators Day presentation by Ilya Ganusov showing the advantages of FPGAs for implementing AI-based Systems. See additional videos on AI and other Altera Innovators Day in Altera’s YouTube channel playlists.

Learn more about FPGAs for Artificial Intelligence here

featured paper

Quantized Neural Networks for FPGA Inference

Sponsored by Intel

Implementing a low precision network in FPGA hardware for efficient inferencing provides numerous advantages when it comes to meeting demanding specifications. The increased flexibility allows optimization of throughput, overall power consumption, resource usage, device size, TOPs/watt, and deterministic latency. These are important benefits where scaling and efficiency are inherent requirements of the application.

Click to read more

featured chalk talk

Accelerating Tapeouts with Synopsys Cloud and AI
Sponsored by Synopsys
In this episode of Chalk Talk, Amelia Dalton and Vikram Bhatia from Synopsys explore how you can accelerate your next tapeout with Synopsys Cloud and AI. They also discuss new enhancements and customer use cases that leverage AI with hybrid cloud deployment scenarios, and how this platform can help CAD managers and engineers reduce licensing overheads and seamlessly run complex EDA design flows through Synopsys Cloud.
Jul 8, 2024
33,949 views