industry news
Subscribe Now

ENNOVI Introduces Stackable Multi-Row Board-to-Board Connector Platform That Snaps Together Without Solder

Automotive-grade product offers a reliable, repeatable and versatile solution that can be scaled up in line with specific customer requirements

SINGAPORE (May 21, 2024) – ENNOVI, a mobility electrification solutions partner, is successfully addressing the growing market demand for high-density interconnects in challenging automotive application scenarios. The new ENNOVI-MB2B multi-row board-to-board (BTB) connector platform features a proprietary ‘snap-in biscuit’ design, allowing multiple connector units to be stacked together without solder. This unique cost-effective approach enables different pin count requirements to be accommodated via the same basic interconnect platform, without any extra expense or engineering effort.

The new multi-row BTB connectors feature ENNOVI´s patented 0.4mm miniPLX™ press-fit terminals made from a copper alloy that exhibits very low levels of contact resistance (<1mΩ). Each pin has a 3A current carrying capability. The optional coating of these pins with the company’s patented IndiCoat™ plating technology mitigates tin whisker build-up, this preventing the risk of short circuits and extending operational lifespan.

ENNOVI-MB2B connectors are available in board stacking heights from 7mm to 30mm. They can have between 1 and 6 rows, with up to 30 contact terminals being incorporated into each row. Conforming with automotive performance requirements, these rugged products can withstand high humidity levels (8 hour cycling up to 10% RH), mechanical shock (35g for 5 to 10ms across 10 axes) and vibration (8 hour per axis). A working temperature range of -40°C to +150°C is supported.

“Being able to fit enough interconnect terminal pins into a small space, while not having any excess, is a priority for any of our clients. At the same time, keeping their total cost of ownership down is also vital,” explains Ralph Semmeling, Product Portfolio Director at ENNOVI. “This means that the companies we are dealing with want access to off-the-shelf products at attractive price points, but with the inherent flexibility that following a custom-based strategy offers. Our new ENNOVI-MB2B stackable interconnect platform gives them the best of both worlds. Allowing them to design at cost.”

There are a broad variety of applications that the robust, high-density, scalable multi-row BTB connectors will be targeted at. Among the most prominent of these are going to be electric vehicles (EVs), particularly for Electric Power Steering (EPS) and Electronic Control Unit (ECU) functions.

For more information on the ENNOVI-MB2B multi-row BTB stack-together connectors from ENNOVI, please visit: https://ennovi.com/multi-row-board-to-board-connector/

About ENNOVI:

ENNOVI, a Mobility Electrification Solutions Partner, is a world leader in designing and manufacturing customized interconnect and high-precision system solutions for electric vehicles. The company is fully dedicated to the mobility market with the agility to act at speed in realizing EV OEMs’ needs, from product, process, and manufacturing, on a global level. ENNOVI is accelerating EV market customers’ ideas and requirements through end-to-end competencies in battery platform, power and signal interconnect needs. Headquartered in Singapore, ENNOVI has more than 8,000 employees across 15 locations globally, where all its activities are socially responsible, with minimal environmental impact. ENNOVI. Electrify faster. Learn more at www.ennovi.com.

Leave a Reply

featured blogs
Nov 5, 2024
Learn about Works With Virtual, the premiere IoT developer event. Specifically for IoT developers, Silicon Labs will help you to accelerate IoT development. ...
Nov 7, 2024
I don't know about you, but I would LOVE to build one of those rock, paper, scissors-playing robots....

featured video

Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

Sponsored by Intel

Altera Innovators Day presentation by Ilya Ganusov showing the advantages of FPGAs for implementing AI-based Systems. See additional videos on AI and other Altera Innovators Day in Altera’s YouTube channel playlists.

Learn more about FPGAs for Artificial Intelligence here

featured paper

Quantized Neural Networks for FPGA Inference

Sponsored by Intel

Implementing a low precision network in FPGA hardware for efficient inferencing provides numerous advantages when it comes to meeting demanding specifications. The increased flexibility allows optimization of throughput, overall power consumption, resource usage, device size, TOPs/watt, and deterministic latency. These are important benefits where scaling and efficiency are inherent requirements of the application.

Click to read more

featured chalk talk

Reliability: Basics & Grades
Reliability is cornerstone to all electronic designs today, but how reliability is implemented and determined can vary widely by different market segments. In this episode of Chalk Talk, Amelia Dalton and Sam Accardo from the YAGEO Group explore the definition of reliability for electronic components, investigate the different grades of reliability offered by the YAGEO Group and the various steps that the YAGEO Group is taking to ensure the greatest reliability of their components.
Aug 15, 2024
53,458 views