industry news
Subscribe Now

CEVA Introduces Digital Video Stabilizer Software Module for CEVA-MM3000 Imaging & Vision Platforms Targeting Next Generation Smartphones and Mobile Devices

MOUNTAIN VIEW, Calif., – August 5, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of its digital video stabilizer (DVS) software module for theCEVA-MM3000 imaging and vision platforms, bringing advanced imaging capabilities to next generation smartphones and mobile devices. The DVS module is fully optimized to run in real-time using minimal processing workloads and very low memory bandwidth on the CEVA-MM3000 platforms. For example, in a 28nm process, the CEVA-MM3101 consumes less than 35mW power while running DVS on a 1080p30 fps video stream in real-time. Addressing higher resolution requirements, the DVS module scales up to 4K Ultra-HD video streams on a single CEVA-MM3101 platform.

CEVA’s DVS software module reduces the shakiness resulting from motion typically experienced when using the video and imaging functions in handheld devices such as smartphones and cameras. Features supported include rolling shutter (“Jello Effect”) and multiple axis correction, which reduce shakiness and smooth motion when panning, zooming and rotating, in any light conditions. The DVS module was implemented utilizing CEVA’s new Application Developer Kit (ADK), which was also announced today in a separate press release. The ADK serves to substantially simplify the overall software development experience, shortening the product design cycle and providing significant memory bandwidth and power consumption savings for imaging and vision applications.

Eran Briman, vice president of marketing at CEVA, commented: “Mobile device manufacturers are constantly on the lookout for differentiating features, most of which are aimed at enabling unique computational photography and vision applications. But even more important is the need to quickly implement such new features to meet product life cycles shorter than six months. Our DVS software module clearly illustrates the added value that the programmable CEVA-MM3000 family of imaging and vision platforms brings to OEMs, who can leverage the inherently low power consumption of DSPs to integrate advanced computational photography capabilities, in a timely and cost-efficient manner. Furthermore, our DVS module can be easily coupled with additional imaging software modules on the fully programmable CEVA-MM3000 platform such as Super-Resolution, Color Enhancement and High Dynamic Range.”

Sample streams and more details on CEVA’s DVS software module are available at http://www.ceva-dsp.com/DVS. 

About CEVA, Inc.

CEVA is the world’s leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, portable and consumer electronics markets. CEVA’s IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2012, CEVA’s IP was shipped in over 1.1 billion devices, powering smartphones from many of the world’s leading OEMs, including HTC, Huawei, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. Today, more than 40% of handsets shipped worldwide are powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.


Leave a Reply

featured blogs
Dec 19, 2024
Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....
Dec 24, 2024
Going to the supermarket? If so, you need to watch this video on 'Why the Other Line is Likely to Move Faster' (a.k.a. 'Queuing Theory for the Holiday Season')....

featured video

Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

Sponsored by Intel

Altera Innovators Day presentation by Ilya Ganusov showing the advantages of FPGAs for implementing AI-based Systems. See additional videos on AI and other Altera Innovators Day in Altera’s YouTube channel playlists.

Learn more about FPGAs for Artificial Intelligence here

featured chalk talk

SiC-Based High-Density Industrial Charger Solutions
Sponsored by Mouser Electronics and onsemi
In this episode of Chalk Talk, Amelia Dalton and Prasad Paruchuri from onsemi explore the benefits of silicon carbide based high density industrial charging solutions. They investigate the topologies of Totem Pole PFC and Half Bridge LLC circuits, the challenges that bidirectional CLLC resonant DC-DC converters are solving today, and how you can take advantage of onsemi’s silicon carbide charging solutions for your next design.
May 21, 2024
37,625 views