industry news
Subscribe Now

VIA Nano™ X2 E-Series Dual Core Processors Debut at Embedded System Conference

Taipei, Taiwan, April 29, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced that it will unveil its new family of low power dual core VIA Nano X2 Series processors at the Embedded System Conference, held at the McEnery Convention Center, San Jose from 2 – 5 May. The VIA booth is located at No 2032.

VIA Nano X2 E-Series processors combine a highly optimized, power-efficient dual-core architecture with advanced performance for the most demanding 86-bit x86 embedded system design applications. Available in two models running at speeds of 1.2+ GHz and 1.6+ GHz, VIA Nano X2 E-Series Processors also come with a component longevity guarantee of 7 years.

“The VIA Nano X2 E-Series demonstrates how VIA continues to lead the way in bringing highly optimized, power-efficient 64-bit x86 processors to the embedded market,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “With their advanced performance, these processors provide developers with exciting new embedded system design options.”  

VIA Nano X2 E-Series

Leveraging the latest 40nm manufacturing process, VIA Nano X2 E-Series processors combine two 64-bit, superscalar VIA Nano cores on one die, offering enhanced multi-tasking and superb multimedia performance on a low power budget.

VIA Nano X2 E-Series processors bring additional features that include VIA VT virtualization, a technology that allows legacy software and applications to be used in virtual scenarios without impacting on performance. The unique VIA AES Security Engine offers hardware-based data encryption on the fly, an essential tool in content protection and system security.

VIA Nano X2 E-Series processors are natively 64-bit compatible, facilitating an essential transition for the future of the embedded industry as 64-bit operating systems such as Windows® Embedded Standard 7 allow for vastly improved data throughput per clock cycle. This makes it easier to manipulate large data sets and improves overall performance. VIA Nano X2 E-Series processors are also fully compatible with Windows CE and Linux operating systems.

VIA Nano X2 E-Series processors are based on the latest 40nm manufacturing process using a VIA NanoBGA2 package of 21mm x 21mm with a die size of 11mm x 6mm. They are also fully pin-to-pin compatible with VIA Eden, VIA C7 and VIA Nano E-Series, and VIA Eden X2 processors.

Product Highlights

  • Industry-leading power-efficient architecture
  • 7 year longevity guarantee
  • Advanced multi-core processing
  • Native support for 64-bit operating systems
  • High-performance superscalar processing
  • Out-of-order x86 architecture
  • Most efficient speculative floating point algorithm
  • Full processor virtualization support
  • Advanced power and thermal management
  • VIA AES hardware security features
  • Pin-to-pin compatibility with VIA processors range

VIA Nano X2 E-Series Processors are sampling now to project customers. Systems and boards featuring VIA Nano X2 E-Series processors will be available in Q2 2011.

VIA will be showcasing a range of component, board and system-level embedded designs at the Embedded System Conference. For more information please go to: 

http://www.via.com.tw/en/company/events/esc2011/index.jsp

About VIA Technologies, Inc.

VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw

Leave a Reply

featured blogs
Dec 19, 2024
Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....
Dec 20, 2024
Do you think the proton is formed from three quarks? Think again. It may be made from five, two of which are heavier than the proton itself!...

featured video

Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

Sponsored by Intel

Altera Innovators Day presentation by Ilya Ganusov showing the advantages of FPGAs for implementing AI-based Systems. See additional videos on AI and other Altera Innovators Day in Altera’s YouTube channel playlists.

Learn more about FPGAs for Artificial Intelligence here

featured chalk talk

Outgassing: The Hidden Danger in Harsh Environments
In this episode of Chalk Talk, Amelia Dalton and Scott Miller from Cinch Connectivity chat about the what, where, and how of outgassing in space applications. They explore a variety of issues that can be caused by outgassing in these applications and how you can mitigate outgassing in space applications with Cinch Connectivity interconnect solutions. 
May 7, 2024
39,316 views