industry news
Subscribe Now

Aeroflex Gaisler Announces A Fault Tolerant Dual Core Processor For Space Applications

Gothenburg, Sweden – Aeroflex Gaisler ABa wholly owned subsidiary of Aeroflex Holding Corp. (NYSE:ARX), a leader in fault tolerant processor design and announces today a new fault tolerant processor – the GR712RC. The GR712RC is an implementation of a dual-core LEON3FT SPARC V8 processor using RadSafeTM technology. The fault tolerant design of the processor in combination with the radiation tolerant technology provides total immunity to radiation effects.  

“We are pleased with the performance of this next generation processor. The power optimized GR712RC is fully software compatible with previous LEON processors, with a performance increase of up to 100% at the same clock frequency. The two LEON3FT processor cores in the GR712RC can be clocked up to 125 MHz over the full military temperature range. This provides up to 300 DMIPS and 250 MFLOPS peak performance.” said Jiri Gaisler, CTO Aeroflex Gaisler.  

The GR712RC devices are shipped as fully tested parts in flight, engineering and prototype quality levels. It is provided in a 240-pin, 0.5 mm pitch high-reliability ceramic quad flat package (CQFP).

For prices and lead times, contact sales@gaisler.com

About Aeroflex Gaisler AB 

Aeroflex Gaisler AB is a provider of SoC solutions for exceptionally competitive markets such as Aerospace, Military and demanding Commercial applications. Aeroflex Gaisler’s products consist of user-customizable 32-bit SPARC V8 processor cores, peripheral IP-cores and associated software and development tools. Aeroflex Gaisler solutions help companies develop highly competitive customer and application-specific SoC designs. Please visit www.aeroflex.com/Gaisler for more information.

About Aeroflex

Aeroflex Incorporated is a leading global provider of microelectronic components and test and measurement equipment used by companies in the space, avionics, defense, commercial wireless communications, medical and other markets.   

Leave a Reply

featured blogs
Dec 19, 2024
Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....
Jan 10, 2025
Most of us think we know something about quantum computing, right until someone else asks us to explain it to them'¦...

featured video

Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

Sponsored by Intel

Altera Innovators Day presentation by Ilya Ganusov showing the advantages of FPGAs for implementing AI-based Systems. See additional videos on AI and other Altera Innovators Day in Altera’s YouTube channel playlists.

Learn more about FPGAs for Artificial Intelligence here

featured chalk talk

Power Modules and Why You Should Use Them in Your Next Power Design
In this episode of Chalk Talk, Amelia Dalton and Christine Chacko from Texas Instruments explore a variety of power module package technologies, examine the many ways that power modules can help save on total design solution cost, and the unique benefits that Texas Instruments power modules can bring to your next design.
Aug 22, 2024
43,036 views