industry news
Subscribe Now

Jasper CEO Kathryn Kranen Addresses Post-Silicon Validation Challenge at IP-SOC 2010, Dec. 1, Grenoble

WHAT: Jasper Design Automation CEO Kathryn Kranen is an invited speaker at this year’s IP-SOC 2010, describing best practices for post-silicon validation, debug and verification, and offering timely solutions for this increasingly urgent issue.  Held annually in Grenoble, IP-SOC highlights IP-based SoC design issues with three days of seminars, panels and distinguished speakers.  2010 conference dates are Nov. 30 – Dec. 1.  For more information: http://www.design-reuse.com/ipsoc2010/.

WHEN:  Wednesday, Dec. 1, 10:30am-11:00am, Invited Talk, Kathryn Kranen

WHERE:  Kilimandjaro Room, World Trade Center, Grenoble, France

WHO:  Kathryn Kranen, President and CEO, Jasper Design Automation

About Jasper Design Automation

Jasper delivers industry-leading EDA software solutions for semiconductor design, verification, and reuse, based on the state-of-the-art formal technology. Customers include worldwide leaders in wireless, consumer, computing, and networking electronics, with over 150 successful chip deployments.  Jasper, headquartered in Mountain View, California, is privately held, with offices and distributors in North America, South America, Europe, and Asia.  Visit www.jasper-da.com to reduce risks; increase design, verification and reuse productivity; and accelerate time to market.

Leave a Reply

featured blogs
Dec 19, 2024
Explore Concurrent Multiprotocol and examine the distinctions between CMP single channel, CMP with concurrent listening, and CMP with BLE Dynamic Multiprotocol....
Dec 20, 2024
Do you think the proton is formed from three quarks? Think again. It may be made from five, two of which are heavier than the proton itself!...

featured video

Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

Sponsored by Intel

Altera Innovators Day presentation by Ilya Ganusov showing the advantages of FPGAs for implementing AI-based Systems. See additional videos on AI and other Altera Innovators Day in Altera’s YouTube channel playlists.

Learn more about FPGAs for Artificial Intelligence here

featured chalk talk

High Power Charging Inlets
All major truck and bus OEMs will be launching electric vehicle platforms within the next few years and in order to keep pace with on-highway and off-highway EV innovation, our charging inlets must also provide the voltage, current and charging requirements needed for these vehicles. In this episode of Chalk Talk, Amelia Dalton and Drew Reetz from TE Connectivity investigate charging inlet design considerations for the next generation of industrial and commercial transportation, the differences between AC only charging and fast charge and high power charging inlets, and the benefits that TE Connectivity’s ICT high power charging inlets bring to these kinds of designs.
Aug 30, 2024
36,124 views